HP JG589A Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP A-MSR OAP FIC Module（JG277A）
HP MSR OAP VMware vSphere FIC Module（JG533A）
HP SBM FIC-OAP Module（JG589A）
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
Continuous vacuum desoldering system
Desoldering tip
Damp sponge
Flux-cored solder
tweesers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove shielding finger 2 from filler panel 1.
2. Remove film 3 from filler panel 1.
3. Unscrew the screws on radiator 4, and then remove radiator 4.
4. Unscrew the screws on PCB 6, and then remove PCB 6.
5. Unscrew the screws on part 5, and then remove part 5.
6. Unscrew the screws on PCB 7, and then remove PCB 7.
7. Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or fluxes.
8. Install thermal drive desoldering tip handpiece.
9. Start with tip temperature of approximately 315°C and change as necessary.
10. Thermal shock tip with damp sponge.
11. Tin tip with solder. (See Figure 2.)
12. Confirm complete solder melt of contacted lead. (See Figure 3.)
13. For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while continuing
lead movement. (See Figures 4&5.)
14. Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See Figure
6.)
15. Repeat for all solder connections.
16. Re-tin tip end with solder and return handpiece to its stand.
17. Lift the component body free of the printed board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 1 Treatments to filler panel
Figure 2 Position Tip
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 3 Melt Solder
Figure 4 Move Lead & Apply Vacuum
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 5 Move Lead & Apply Vacuum
Figure 6 Lift Handpiece
4. Revised record
Date
Version
Author
Modify content
2012.11.09
V1
Wu Xuejun
Add the module JG587A and JG589A
Dieses Handbuch passt für folgende Modelle
5
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