HP 290 G2 SFF Montageanleitung

EL-MF877-00

Template Revision C

Page 1

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 290 G2 SFF Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking

code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button

style batteries

Li-Ion batteries. Include all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, RTC coin

cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[ ] screws

[

] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height PSU

External electrical cables and cords DC Cable for External Power Supply

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

1.0 Items Requiring Selective Treatment

EL-MF877-00

Template Revision C

Page 2

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity

of items

included

in product

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Hexagon Screw Driver T-15

Electric Iron QUICK 310

Crisscross Screw Driver PH1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Remove access panel (Step1-2)

2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step3~Step4)

3. Remove ODD/ HDD from chassis (Step4~Step8)

4. Remove all cables and heat sink from MB (Step9~Step12)

5. Separate heatsink(Step13~Step14)

6. Remove the Memory/ CPU/ WLAN/SSD/GFX and Battery from MB (Step14~Step23)

7. Remove MB from chassis (Step24-25)

8. Remove the PSU from chassis (Step26~Step28)

9. Separate PSU and remove the Electrolytic Capacitors (Step 29~Step33)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00

Template Revision C

Page 3

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step1 Use T-15 screwdriver to Loose thumb screw and

remove access panel.

Step2 Disconnect ODD power cable and

ODD SATA cable from ODD.

Step3 Press the ODD’s latch on ODD cage

Step4 Remove the ODD from ODD cage

Step5 Remove front bezel from chassis

Step6 Disconnect HDD power cable and

HDD SATA cable from HDD.

EL-MF877-00

Template Revision C

Page 4

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step7 Remove the driver cage from Chassis

Step8 Use T-15 screwdriver to loose the screws of HDD and

remove HDD from HDD cage

Step9 Disconnect all cables from MB

Step10 Remove the Fan duct from cooler

Step11 Disconnect Cooler Fan cable from MB

Step12 Disconnect Cooler Fan cable from MB

EL-MF877-00

Template Revision C

Page 5

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step13 Use T-15 screwdriver to loose the

screws and remove the fan

Step14 Separate the fan from CPU heat sink

Step15 Remove memory from the MB

Step16 Rotate the handle and open it up

EL-MF877-00

Template Revision C

Page 6

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step17 Remove the CPU from the board

Step18 Open the GFX from Lock

Step19

Remove the GFX from the board

Step20 Remove SSD M.2 Card

Step21 Remove WLAN M.2 Card

Step22 Remove the Antenna from chasis

EL-MF877-00

Template Revision C

Page 7

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step23 Remove the battery from the system board

Step24

Use T-15 screwdriver to loose the screws of MB from

board

Step25 Remove MB from chassis

Step26

Use T-15 screwdriver to loose the screws of PSU

Step27 Press the PSU’s latch on chassis

Step28 Remove the PSU from chassis

EL-MF877-00

Template Revision C

Page 8

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step29 Remove four screws covered

Step30 Remove the screw and open case

Step31 Loose screws and remove PCB from case

Step32 Remove Ele-Cap from PCBA

33. Step30 Show Ele-Cap on PCBA (C1)

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