HP 406 G1 MT Montageanleitung

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 406 G1 MT

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB, Memory,HDD PCA,ODD PCA,PSU PCA

Batteries

All types including standard alkaline and lithium coin

or button style batteries MB

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

system fan, Cooler fan,PSU fan

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

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refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 crisscross screw driver

Description #2 hexagon screw driver

T15

Description #3 electric iron

QUICK 310

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel from the unit

2. Remove front panel from the unit

3. Remove all the cables from the unit

4. Remove ODD from the unit

5. Remove HDD from the unit

6. Take off FIO from the unit

7. Take off system fan from the unit

8. Take off PSU from the unit.

9. Take off Memory from the unit.

10. Take off CPU cooler from the unit.

11. Take off battery from the unit.

12. Take off PCA from the unit.

13. Open the PSU

14. Take off PSU fan

15. Take off CAP using electric iron.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1. Remove access panel

from the unit.

Release screw on the access

panel. Griping the tab at the end

of access panel, pull towards the

rear and remove it from unit.

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2 Remove front panel from

the unit.

Release 3 bezel latches from

chassis by pulling the bezel

latches outwards.

3.Remove all the cable from

the unit.

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4.Remove ODD from the unit.

Rotate the screw driver to release

the ODD and remove the ODD

from the cage.

5.Remove HDD from the unit.

Rotate the screw driver to release

the ODD and remove the ODD

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from the cage.

6 Take off FIO from the unit.

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7.Take off the system fan

from the unit

Rotate screw driver to loose

screw and then take off the

system fan.

8.Take off PSU from the unit.

Rotate the screw driver to release

PSU from the unit.

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9. Take off Memory from the

unit.

Release memory socket levers

by pulling outward.

10. Take off CPU cooler from

the unit.

Rotate the screw driver to release

CPU cooler from the unit.

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11. Take off battery from the

unit.

12.Take off PCA from the

unit.

Rotate screw driver to loose

PCA from the unit.

13.Open the PSU

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PSG instructions for this template are available at EL-MF877-01

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