HP BladeSystem Blade Switch Montageanleitung
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes Quantity of items
included in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2 (system bd,
daughter bd)
Batteries All types including standard alkaline
and lithium coin or button style
batteries
1 (underside of
daughter board)
Mercury-containing components For example, mercury in lamps, display
backlights, scanner lamps, switches,
batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 2
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads,
tubes, vent chambers, and service
stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Flat blade, torx (T15) screwdriver Torx: T-15
Description #2 3/16-inch nut driver
Description #3
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
DAUGHTER BOARD
1 Turn the three black levers that secure the daughter board to the system board to a horizontal
position to align with the slots (see Figure 2 below).
2 Remove the screw from each of the two metal retaining clips that secure the daughter board to
the metal tray (see Figure 3 below).
3 Remove two 3/16-inch hex nuts from the rear panel (see Figure 3 below).Remove the mid-plane
assembly.
4 Lift the top of the daughter board, and then pull it toward the open end of the tray until the
connectors on the back of the board are free from the metal tray.
5 Lift the daughter board out of the tray.
DAUGHTER BOARD BATTERY
1 Lay the daughter board on its top so that the components are visible.
2 Use a flat blade screwdriver to lift off the plastic cap marked “DALLAS POWERCAP”. The
battery is located in the plastic cap (see Figures 4 & 5 below).
3 Pry the battery from the plastic cap using the flat blade screwdriver.
SYSTEM BOARD
1 Using a T15 driver, remove the two remaining screws that secure the system board to the metal
tray (see Figure 6 below).
2 Slide the board forward about 12 mm (½ inch) toward the open end of the tray.
3 Lift the system board up and out of the tray.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to
identify the items contained in the product that require selective treatment (with descriptions and
arrows identifying locations).
FIGURE 1: Switch FIGURE 2: Lever that secures daughter board to
system board
FIGURE 3: Daughter board retaining clips hex nuts FIGURE 4: Daughter board battery location
FIGURE 5: Daughter board battery FIGURE 6: System board screws
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