HP Compaq 303B Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
Compaq 303B PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
(Mainboard and power supply board)
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries Located on the mainboard
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
located on power supply
up to 8
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
system and power supply fan
2
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver, wire cutters
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel from the unit
2. Remove all the cables from PCA
3. Remove PCI & PCI-E card from the PCA
4. Remove HDD
5. Take off Front Panel
6. Take off ODD
7. Take off system FAN
8. Take off CMOS battery
9. Take off PSU from the Unit
10. cut off wire tie
11. open PSU
12. remove large electrolytic capacitors and PSU FAN
13.
14.
15.
16.
17.
18.
19.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1 Remove access panel from the unit
Release the screw and slide access panel and remove
it.
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
2 Remove all the cables from PCA
Take all the cables off PCA
3 Remove PCI & PCI-E card from the PCA
Use screw driver to take off the screw as shown in
the photo
3 Take PCI & PCI-E cards off the PCA
Release memory socket levers by pulling
outward.
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
4 、Remove HDD from the system
Rotate the screw driver to take off the HDD holder
5 take off Front Panel
Pull the button up and then take off the front panel
6 Take off ODD
Use one hand to pull the steel up , and the same time
take off ODD use the other hand
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
7 Take off system FAN
Rotate screw driver to loose screw and then
take the cooler off PCA
8 Take off CMOS battery
Pull the battery holder as shown in the photo,
and then the battery will off the PCA
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
9 Take off PS from the Unit
Use screw driver to loose screws and then take
the PS off the Unit
10 cut off wire tie
11 open PS
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
12 use screw driver to separate the small
PCA from the main board and remove large
Capacitors and PSU FAN
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