HP Compaq 303B Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

Compaq 303B PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

(Mainboard and power supply board)

Batteries

All types including standard alkaline and lithium coin

or button style batteries Located on the mainboard

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

located on power supply

up to 8

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

system and power supply fan

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver, wire cutters

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel from the unit

2. Remove all the cables from PCA

3. Remove PCI & PCI-E card from the PCA

4. Remove HDD

5. Take off Front Panel

6. Take off ODD

7. Take off system FAN

8. Take off CMOS battery

9. Take off PSU from the Unit

10. cut off wire tie

11. open PSU

12. remove large electrolytic capacitors and PSU FAN

13.

14.

15.

16.

17.

18.

19.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1 Remove access panel from the unit

Release the screw and slide access panel and remove

it.

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

2 Remove all the cables from PCA

Take all the cables off PCA

3 Remove PCI & PCI-E card from the PCA

Use screw driver to take off the screw as shown in

the photo

3 Take PCI & PCI-E cards off the PCA

Release memory socket levers by pulling

outward.

EL-MF877-00 Page 4

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PSG instructions for this template are available at EL-MF877-01

4 、Remove HDD from the system

Rotate the screw driver to take off the HDD holder

5 take off Front Panel

Pull the button up and then take off the front panel

6 Take off ODD

Use one hand to pull the steel up , and the same time

take off ODD use the other hand

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

7 Take off system FAN

Rotate screw driver to loose screw and then

take the cooler off PCA

8 Take off CMOS battery

Pull the battery holder as shown in the photo,

and then the battery will off the PCA

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

9 Take off PS from the Unit

Use screw driver to loose screws and then take

the PS off the Unit

10 cut off wire tie

11 open PS

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

12 use screw driver to separate the small

PCA from the main board and remove large

Capacitors and PSU FAN

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