HP Dx5150 Series Montageanleitung

HP-00007-01, Appendix 3 02-Jun-2005

HP Restricted

Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

HP Business Desktop dx5150 Series Small Form Factor, ATX board

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description

Notes

Qty items in

product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA)

With a surface greater than 10

square cm

2 (sys board &

P/S board)

Batteries All types including standard

alkaline and lithium coin or button

style batteries

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm

Includes background illuminated

displays with gas discharge lamps

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT)

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

3 (3 in P/S)

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

Components and waste containing

asbestos

Components, parts and materials

containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances

HP-00007-01, Appendix 3 02-Jun-2005

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Torx Screw Driver

Dikes (Figure 17)

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

SYSTEM BOARD

1 To remove the access panel (see Figure 1 below):

a. Pull up and hold open the latch on the top of the computer.

b. Slide the access panel back about 1.3 cm (0.5 inch), and then lift it off of the unit.

2 To remove the front bezel (see Figure 2 below):

a. Pull up on the three release tabs on the top of the bezel.

b. Pull the front bezel away from the chassis.

3 Rotate the drive cage to its full upright position (see Figure 3 below).

4 Unplug all cables from the system board (see Figure 4 below).

5 To remove the heatsink assembly (see Figures 5 & 6 below):

a. Loosen the two captive screws that secure the heatsink to the system board.

b. Twist the heatsink slightly to break the bond between it and the processor then, and

then lift the heatsink from the processor.

6 To remove the processor (see Figure 7 below):

a. Rotate the socket handle to its fully open position.

b. Lift the processor from the system board.

7 To remove the system board (see Figures 8 & 9 below):

a. Remove the eight screws that secure the system board to the chassis.

b. Slide the system board toward the front of the computer until the rear I/O connectors

clear the chassis, and then remove the system board from the chassis.

POWER SUPPLY PCA

1 Make sure the drive cage is rotated to its fully upright position, and then disconnect all

power cables from all devices.

2 To remove the power supply (see Figure 10 below):

a. Remove the three screws that connect the power supply to the chassis.

b. Slide the power supply forward about 0.95 cm (3/8 inch), lift it to clear the guides on the

floor of the chassis, and then pivot the top of the power supply to clear the top chassis lip.

3 Cut the tie-wrap (see Figure 11 below).

HP-00007-01, Appendix 3 02-Jun-2005

HP Restricted

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POWER SUPPLY PCA (

continued

)

4 Remove the cover from the power supply by removing the screws from the power supply

surface, and then lifting the cover off of the power supply (see Figure 12 below).

5 Cut the two cables that connect the Switch (see Figure 13 below).

6 Cut the two cables that connect the Inlet (Figure 14 below).

7 Remove the power supply PCA from the power supply (see Figure 15 below).

8 Cut the capacitors (C4, C5) solder joint (see Figure 16 below) using dikes (see Figure 17

below), and then remove the capacitors.

9 Cut the capacitor (C11) solder joint using dikes, and then remove the capacitor (see

Figure 18 below).

BATTERY

1 Locate the battery and battery holder on the system board.

2 Depending on the type of battery holder on the system board, complete the following

instructions to replace the battery:

Type 1 Battery Holder (see Figure 19 below)

- Lift the battery out of the holder.

Type 2 Battery Holder (see Figure 20 below)

- To release the battery from the holder, squeeze the metal clamp that extends above one

edge of the battery. When the battery pops up, lift it out.

HP-00007-01, Appendix 3 02-Jun-2005

HP Restricted

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3.2 Illustrations

FIGURE 1: Removing the access panel

FIGURE 2: Removing the front bezel

FIGURE 3: Rotating the drive cage

FIGURE 4: System board

HP-00007-01, Appendix 3 02-Jun-2005

HP Restricted

Page 5

FIGURE 5: Removing the heatsink FIGURE 6: Removing the heatsink assembly

FIGURE 7: Removing the processor

FIGURE 8: System board screw locations

FIGURE 9: Removing the system board

FIGURE 10: Removing the power supply

HP-00007-01, Appendix 3 02-Jun-2005

HP Restricted

Page 6

FIGURE 11: Tie wrap

FIGURE 12: Power supply with cover removed

FIGURE 13: Switch cables

FIGURE 14: Inlet cables

FIGURE 15: Power supply PCA

FIGURE 16: C4 and C5 capacitors

HP-00007-01, Appendix 3 02-Jun-2005

HP Restricted

Page 7

FIGURE 17: Dikes

FIGURE 18: C11 capacitor

FIGURE 19: Type 1 battery holder

FIGURE 20: Type 2 battery holder

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