HP Engage Flex Pro-C Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Engage Flex Pro-C
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
250W EPA92 RPOSL18
1
External electrical cables and cords
1
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T-15
Screwdriver
PH1
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
2. Remove the Front panel from chassis.(see Figure 2- 3 below)
3. Disconnect ODD SATA power cable and SATA data cable from ODD.(see Figure 4- 7 below)
4. Remove the ODD from ODD cage.(see Figure 8-9 below)
5. Disconnect HDD SATA power cable and SATA data cable from HDD.(see Figure 10-11 below)
6. Remove the HDD from chassis.(see Figure 12-13 below)
7. Disconnect SATA power/data cable from MB and remove them from the chassis.(see Figure 14-17 below)
8. Disconnect PSU cable from MB.（see Figure 18-20 below)
9. Disconnect FIO cable from MB and remove FIO from chassis.(see Figure 21-24 below)
10. Remove PS2&Audio from chassis.(see Figure 25-26 below)
11. Remove the memory from the MB .(see Figure 27 below)
12. Remove speaker from chassis.(see Figure 28-29 below)
13. Remove fan duct from NB.(see Figure 30 below)
14. Remove heatsink from MB.(see Figure 31 below)
15. Remove the CPU from MB.(see Figure 32-33 below)
16. Disconnect fan cable from MB.(see Figure 34 below)
17. Remove the battery from MB.(see Figure 35 below)
18. Remove the MB from chassis.(see Figure 36-38 below)
19. Remove the fan from chassis.(see Figure 39 below)
20. Remove the PSU from chassis.(see Figure 40 below)
21. Separate the fan and fan duct.(see Figure 41-42 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 25 Disconnect the PS/2 & Audio cable from MB
Figure 26 Use T-15 screwdriver to loose the screw of PS/2 &
Audio and remove it from MB
Figure 27 Remove memory from MB
Figure 28 Disconnect speaker cable from MB
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 29 Use T-15 screwdriver to loose the screw of
speaker and remove it from chassis
Figure 30 Remove the fan duct from MB
Figure 31 Use T-15 screwdriver to loose the screw of
heatsink and remove it from MB
Figure 32 Press the latch
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