HP Pavilion d4000 - Desktop PC Montageanleitung
HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Model Name HP Pavilion d4000 Series PC
Description Desktop PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10
square cm 5
Batteries All types including standard
alkaline and lithium coin or button
style batteries
1
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated
displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case
plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
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Components, parts and materials
containing refractory ceramic fibers 0
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Phillip’s screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Turn the screw on side panel at the back, push the side panel before panel leave
2 Three latch on main bezel back, pull the latch before main bezel leave
3 Push the latch on POWER SHITCH HOLDER, remove the holder
4 Push down the LATCH DRIVE, remove the part
5 Loosen left side cover the thumbscrew*2 and take out it from chassis.
6 Release bezel the hook*3 and take out it from chassis.
7 Pull out system all internal cable and device power the connectors.
8 Take out internal cables and power switch module.
9 Pull up ODD the green latch and take out ODD from chassis.
10 Loosen ODD the screws. Each one ODD has 4 unit screws.
11 Pull up card reader the green latch and take out card reader from chassis.
12 Loosen card reader the screw*2.
13 Pull up FDD the green latch and take out FDD from chassis.
14 Loosen FDD the screw*2.
15 Loosen Front I/O module the fix screw*1 and take out front I/O module from chassis.
16 Disassembly front I/O module the cables.
17 Pull up HDD the green latch and take out HDD from chassis.
18 Loosen HDD the screws. Each one HDD has 4 unit screws.
19 Loosen system fan the screw*4 and take out it from chassis.
HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 3
20 Loosen graphics card, modem card, audio card, TV tuner card the fix screw.
21 Each one PCI card has 1unit screw.
22 Take out all PCI card from motherboard.
23 Loosen motherboard and extender card the fix screw total 10.
24 Take out motherboard and extender card from chassis. Remove RTC coin cell battery
for selective treatment.
25 Take out battery from motherboard.
26 Loosen heat sink the fix screw*4 and take out it from motherboard.
27 Press down CPU the fix latch and take out it from motherboard.
28 Press down RAM the fix latch and take out it from motherboard.
29 Loosen power supply the screw*4 and take out it from chassis.
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
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