HP ProDesk 480 G3 MT Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 480 G3 MT Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Cooler fan 81g,system fan 99g,PSU fan 67g

247g

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

T-15

Micro shear

YN-3

Screw driver

PH2

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel. (see Figure 1-2)

2. Remove front bezel. (see Figure 3)

3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5)

4. Remove the HDD (see Figure 6-8)

5. Remove the Slim ODD (see Figure 9-10)

6. Unplug all cable conn. from PCA. (see Figure 11)

7. Remove the PCA(see Figure 12-13)

8. Remove the DIMM. (see Figure 14)

9. Remove the CPU. (see Figure 15-16)

10. Remove the Battery. (see Figure 17)

11. Remove the FIO module from chassis. (see Figure 18-19)

12. Remove the PWR_LED switch cable from chassis. (see Figure 20-21)

13. Remove the SD card reader from chassis. (see Figure 22-23)

14. Remove the speaker from chassis. (see Figure 24-25)

15. Remove Sys fan from chassis. (see Figure 26-27)

16. Remove the PSU from chassis. (see Figure 28-29)

17. Remove the PSU chassis and remove the PSU board. (see Figure 30-39)

18. Remove the Electrolytic Capacitors from PSU board. (see Figure 40-54)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure1 Release Thumb screw on the access panel.

Figure2 Griping the tab at the end of access panel, pull

towards the rear and remove from unit.

Figure3 Pull 3 pcs bezel hooks and remove the front bezel

from chassis.

Figure4 Unplug the cooler cable from PCA

Figure5 Release 4 screws from cooler and remove it

Figure6 Disconnect the SATA and power cables from

HDD

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure7 Release the HDD screws

Figure8 Remove the HDD form chassis

Figure9 Push the latch and release the Slim ODD.

Figure10 Remove the Slim ODD form chassis.

Figure11 Unplug all cable conn. from PCA.

Figure12 Release 8 pcs screws from PCA

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure13 Remove PCA from chassis

Figure14 Push the hooks on both sides and then pick up

the memory

Figure15 Rotate the handle and open it up

Figure16 Remove the CPU from board

Figure17 Remove the battery from the PCA

Figure18 Release the screw of the FIO cable

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure19 Rotation and Remove the FIO module from

chassis

Figure20 Push the plastic hook.

Figure21 Remove the PWR_LED switch from chassis

Figure22 Release 1 pcs screw of speaker

Figure23 Remove the speaker form chassis

Figure24 Release the SD card reader screw

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure25 Remove the SD Card reader from chassis

Figure26 Release 2 pcs screws from system fan.

Figure27 Remove the system fan from chassis

Figure28 Release 4 pcs screws of PSU and remove it

Figure29 Pull up the PSU and remove it

Figure30 Cut the cable tie

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure31 Remove screw for bottom

Figure32 Remove screw for top

Figure33 Remove FG screw

Figure34 Disconnect fan connector

Figure35 Remove LED holder

Figure36 Remove plastic cover

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure37 Remove PCB screw

Figure38 Remove AC inlet screw

Figure 39 Cut output cable, AC inlet wire, LED wire

Figure40 Remove capacitors use solder iron

Figure41 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(C801,C151,C303,C951) (Gamay-S 300W APFC-Delta)

Figure42 Heat the solder of Electrolytic Capacitors greater

than 2.5cm in diameter or height and remove it.

(C801 ,C951) (Crasto-S 180W E-Star6-Delta)

C801

C151

C303

C951

EL-MF877-00 Page 10

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure43 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(C801) (Ortega 180W ATX bronze-Delta)

Figure44 Heat the solder of Electrolytic Capacitors greater

than 2.5cm in diameter or height and remove it.

(C1,C6) (Gamay-S 300W APFC_AcBel)

Figure45 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it

(C1,C6,C19) (Gamay-S 300W Bronze_AcBel)

Figure46 Heat the solder of Electrolytic Capacitors greater

than 2.5cm in diameter or height and remove it.

(C6,C19) (Crasto-S 180W APFC_AcBel)

Figure47 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(C6,C19) (Crasto-S 180W Bronze_AcBel)

Figure48 Heat the solder of Electrolytic Capacitors greater

than 2.5cm in diameter or height and remove it.

(C6,C19,C57,C13) (Ortega 180W Bronze_AcBel)

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