HP Xw6400 - Workstation - 4 GB RAM Montageanleitung

Product End-of-Life Disassembly Instructions

HP xw6400 Workstation

Product Category: Workstations

Marketing Name / Model

[List multiple models if applicable.]

HP xw6400 Workstation

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Two in the power supply, one graphics card, and

one system board. (Additional cards may be present

depending on the configuration.)

Batteries All types including standard alkaline and lithium coin

or button style batteries 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries None

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps None

Cathode Ray Tubes (CRT) None

Capacitors / condensers (Containing PCB/PCT) None

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height Ten attached to the power supply boards. 10

External electrical cables and cords 1

Gas Discharge Lamps None

Plastics containing Brominated Flame Retardants None

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. None

Components and waste containing asbestos None

Components, parts and materials containing

refractory ceramic fibers None

Components, parts and materials containing

radioactive substances None

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Torx drivers, screwdriver, diagonal cutter

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

(See instructions below in sections 3.2 and 3.3.)

3.2 Workstation Disassembly Procedures

1. Remove/disengage any security devices that prohibit opening the workstation.

2. Disconnect the power cord from the electrical outlet and then from the workstation.

3. Disconnect all peripheral device cables from the workstation.

4. Remove the access panel. Pull up on the handle 1and lift off the cover 2.

5. Disconnect all internal cables from system board, power supply, and other components.

6. Remove the system battery. Press on the release tab of the battery holder. Rotate the battery

beyond the latch and lift it straight up.

Battery

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7. Remove the graphics card and any other expansion cards.

If necessary, first remove the PCI Holder for short or tall cards. Lift the holder arm with one

hand, press in on the sides of the holder 1, and rotate it out of the chassis 2.

Short Card Tall Card

Remove the PCI retainer clamp by pressing down on the green snaps and rotating the PCI

retention clamp upward 1. Lift the PCI card out of the chassis 2. (First picture.)

For PCI Express cards (second picture), remove the PCI retainer clamp by pressing down on

the green snaps and rotating the PCI retention clamp upward 1. Remove the power supply

cable (not shown) if required. Then move the PCI slot lever 2to release the card and lift it out

of the chassis 3.

PCI Card PCI Express Card

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8. Remove the power supply from the chassis. Disconnect or cut electrical connections to the

power supply. Remove the four screws 1securing the power supply to the workstation

chassis. Slide the power supply toward the front, then lift up to remove it from the chassis 2.

9. Remove the system board. Slide the board forward to disengage the mounting standoffs from

the chassis 1. Lift the board out of the chassis 2.

10. Dispose of all removed components according to regulatory requirements.

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3.3 Power Supply Disassembly Procedures

1. Cut the cable tie at the rear of the unit.

2. Remove the four power supply screws—two on each side of the front.

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3. Slide the chassis housing from the power supply unit.

4. Remove the four screws from the corners of the first PCB card. Pull the card loose from the

chassis.

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5. Unplug the connectors that connect the two PCB cards together. Remove the first PCB

card from the chassis.

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6. Use a diagonal cutter to remove the desired components from both PCB cards. (Note that

some components may need to be unsoldered if a diagonal cutter does not fit between the

component and the PCB card.)

7. Dispose of all removed components according to regulatory requirements.

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