HP ZHAN 99 Pro G1 Montageanleitung

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ZHAN 99 Pro G1 MT

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

PCA

Batteries

All types including standard alkaline and lithium coin

or button style batteries Lithium Coin Battery on

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries NA

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps NA

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. NA

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description Ph2 screw driver (Disassemble 1 pcs screws for access panel)

T15 1.5~2.0

kgf-cm

Description T15 screw driver (Disassemble 4 pcs screws for side brkt and lower case)

T15 3.0~4.0

kgf-cm

Description T15 screw driver (Disassemble 2 pcs screws for PCI cover and main bkt)

T15 3.0~4.0

kgf-cm

Description T15 screw driver (Disassemble 6 pcs screws for MB and main bkt)

T15 3.0~4.0

kgf-cm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove to lower case from housing.

2. Pull off ODD SATA con &ODD power con.

3. Remove ODD from housing and loosen 4 screws to remove HDD

4. Remove front bezel from housing

5. Loosen 4 screw on side bkt then remove it

6. Pull off all cables on MB

7. Remove PCI card from housing

8. Pull off PSU con

9. Loosen 4 screws on MB then remove it

10. Loosen 3 screws on PSU then remove it

11.

12.

13.

14.

15.

16. .

17. .

18.

19.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Remove to lower case from housing.

2. Pull off ODD SATA con &ODD power con.

3. Remove ODD from housing and loosen 4 screws to remove HDD

4. Remove front bezel from housing

5. Loosen 4 screws on side bkt then remove it

6. Pull off all cables on MB

7. Remove PCI card from housing

8. Pull off PSU con

9. Loosen 4 screws on MB then remove it

10. Loosen 3 screws on PSU then remove it

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