HP t310 G2 Montageanleitung
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Product End-of-Life Disassembly Instructions
Product Category: Thin Client
Marketing Name / Model
[List multiple models if applicable.]
HP t310 G2 All-in-One Zero Client
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCBA, OSD BOARD
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries NA
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries. NA
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
Cathode Ray Tubes (CRT)
NA
Capacitors / condensers (Containing PCB/PCT)
NA
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
NA
External electrical cables and cords
Power code
Gas Discharge Lamps
NA
Plastics containing Brominated Flame Retardants
NA
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NA
Components and waste containing asbestos
NA
Components, parts and materials containing
refractory ceramic fibers
NA
Components, parts and materials containing
radioactive substances
NA
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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Flat Blade Screwdriver
5mm
Description #2: Phillips Screwdriver
#1
Description #3 3/16” Hex Nut Driver
3/16”
Description #4
Description #5
Description #6
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Loosen 4 screws from the Rear Cover
2. Dis-assemble the Rear Cover with Tools
3. Loosen these four Screws from the Panel
4. Pull out the Connector of Back Light/LVDS FFC and Take out OSD Board
5. Loosen these four Screws from the Middle Frame in order to Dis-Assemble the Front Bezel
6. Loosen these 12 Screws from the Middle Frame in order to Dis-Assemble the Middle-Frame
7. Loosen the 2 Screws from the Bottom side of Metal Frame
8. Pulling out the Cables of the SPK and Loosen the 5 screws in order to take out the assembly of the MB
9. Pulling out Assy-SPK from the Assy-Metal Bracket
10. Pulling out the Cable of the LVDS,OSD Board and BackLight
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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