HP 1420-24G-2SFP Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Calculators

Marketing Name / Model

[List multiple models if applicable.]

HP 1420-24G-2SFP Switch

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.

2. Remove the cover 2

3. Remove all of the inner cables.

4. Unscrew the screws on PCB 6, and then remove PCB 6..

5. Unscrew the screws on PCB 11, and then remove PCB 11.

6. Unscrew the screws on PCB 5, and then remove PCB 5 and lamp guide 13.

7. Remove panel 3, insulate plate 9 and outlet 12.

8. Remove film 4 from panel 3..

9. Remove all of the labels.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

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Figure1 Remove mounting angle

Figure2 Treatment to the product

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3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for materials

and components

Details

2.8%

Fe recycling

810

36.0%

Fe recycling

2.3%

Containing brominated flame

retardants

8.0

0.4%

Containing brominated flame

retardants

Complex

PCB

0.4%

The surface of PCB is greater

than 10 square centimeters

Complex

PCB

478

21.2%

The surface of PCB is greater

than 10 square centimeters

721

32.0%

Fe recycling

N/A

6.5

0.3%

Containing brominated flame

retardants

N/A

Complex

PCB

3.9%

The surface of PCB is greater

than 10 square centimeters

15.4

0.7%

Containing brominated flame

retardants

2.0

0.1%

Containing brominated flame

retardants

4. Revised record

Date

Version

Author

Modify content

2015.01.12

Huang Bin

Initial version

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