HP Aruba CX 10000-48Y6C Montageanleitung

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking

Marketing Name / Model

[List multiple models if applicable.]

HPE Aruba CX 10000-48Y6C FB 6F 2PS Bdl (R8P13A)

HPE Aruba CX 10000-48Y6C BF 6F 2PS Bdl (R8P14A)

HPE Aruba CX 10K Empty Chassis (R8S96A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

All Plastics under 25 grams

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Screwdriver

T10

Phillips Screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew 7x T10 screws for top cover

2. Slide top cover backward from the faceplate to open the cover

3. Unscrew 17x screws securing Main PCBA and Console PCBA

4. Unscrew 2x screws securing Trident3 heatsink

5. Remove Console PCBA from motherboard

6. Slide PCBA away from faceplate and lift back of PCBA to disassemble from chassis

7. Disassemble all plastic baffles from PCBA

8. Disassemble all heatsinks from motherboard

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1: System PCA

Attachment 2: Location of Coincell.

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

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