HP Aruba Instant On 1830 Montageanleitung

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HPE Aruba Instant On 1830 48G 4SFP 370W 24p Class4 PoE Switch (JL815A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

on PSU PCB Board

External electrical cables and cords

Power Cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Tool Description

Tool Size (if

applicable)

Phillips Screwdriver

Diagonal Pliers

5”

Hexagonal Socket Screwdriver

Plat Screwdriver

4mm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Using a P2 Phillips Screwdriver, remove all 12 screws securing top cover to chassis. Remove Cover. (see 3.2.1)

2. Using a P2 Phillips Screwdriver, remove 9 screws to chassis, remove Air baffle (3pcs). (see 3.2.2)

3. Using Diagonal Plier to cut 1 cable tie on chassis and Disconnect Power supply and main board cable connections (3 cables

connections in all), remove Power supply and insulator (1pcs). (see 3.2.3)

4. Using a P2 Phillips Screwdriver, remove 8 screws to chassis, remove PoE board and insulator (1pcs), remove SFP heat sink,

remove cable tie. (see 3.2.4)

5. Disconnect Fan and main board 2 cables connection and Using a P2 Phillips Screwdriver, remove 4 screws to chassis, remove

Fan(2pcs) (see 3.2.5)

6. Using a P2 Phillips Screwdriver, remove 7 screws to chassis, using a #5 Hexagonal socket Screwdriver, remove 7 standoffs to

chassis, remove main board (1pcs). (see 3.2.6)

7. Using Diagonal Plier to cut 1 cable tie on rear plane, Using Flat Screwdriver push the hooks on the sides of AC-inlet Socket, and

Using a P2 Phillips Screwdriver, remove 1 screws to chassis and Disconnect ac-inlet cable (see 3.2.7)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the

product that require selective treatment (with descriptions and arrows identifying locations).

3.2.1

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

3.2.2

3.2.3

MF877-00 Page 4

Template Revision A

HPE instructions for this template are available at MF877-01

3.2.4

3.2.5

MF877-00 Page 5

Template Revision A

HPE instructions for this template are available at MF877-01

3.2.6

3.2.7

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