HPE Apollo 2000 Gen10 Plus System Montageanleitung

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category

: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE Apollo 2000 Gen10 Plus System

HPE Apollo n2400 Gen10 Plus SFF CTO Chassis

HPE Apollo n2600 Gen10 Plus SFF CTO Chassis

HPE Apollo n2800 Gen10 Plus SFF CTO Chassis

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Depending on Power Supply

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

There’s no containing Brominated Flame

Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

T10/T15

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. PCA-Remove all of PCAs with screwdriver

2. Megacell Module– Remove the top cover and locate the megacell on the system. Remove the megacell and

dispose of properly.

3. Capacitors>2.5 cm-Removing the Node module from chassis, removing the node cover by pressing down cover latch,

locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1-15 - PCA Pictures

Attachment 16 – Megacell Module Location

Attachment 17-20 – Super Cap Location in PSU

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 1 HPPN: P13604-001 Attachment 2 HPPN: P17564-001

Attachment 3 HPPN: P13610-001 Attachment 4 HPPN: P13616-001

Attachment 5 HPPN: P17570-001

Attachment 6 HPPN: P22340-001

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 7 HPPN: P17567-001

Attachment 8 HPPN: P22336-001 Attachment 9 HPPN: P13573-001

Attachment 10 HPPN: P13575-001

Attachment 11 HPPN: P13571-001

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 12 HPPN: P13621-001

Attachment 13 HPPN: P13614-001

Attachment 14 HPPN: P17560-001

MF877-00 Page 6

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 15 HPPN: P13623-001

Attachment 16 Remove Megacell Module

MF877-00 Page 7

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 17:Model: HSTNS-PR62

Remove capacitor

Attachment 18 Model: HSTNS-PL62

Remove capacitor

MF877-00 Page 8

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 19 Model: 2200W HICKORY

Remove capacitor

Attachment 20 Model: 3000W DIGGER

Remove capacitor

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