HPE Edgeline EL1000 Montageanleitung

MF877-00

Template Revision A

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HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE Edgeline EL1000

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1

Items listed below are classified as requiring selective treatment.

1.2

Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

ItemDescription

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containingcomponents

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries No

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps No

Cathode RayTubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Depends on PSU Module

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. No

Components and waste containing asbestos

1.0 Items Requiring Selective Treatment

MF877-00

Template Revision A

Page

HPE instructions for this template are available at MF877-01

ItemDescription

Notes

Quantity

of items

included

in product

Components, parts and materials containing

refractoryceramic fibers

Components, parts and materials containing

radioactivesubstances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Driver

T-10/15

PhilpsScrewdriver

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1

List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

System Board Battery (1G/10G I/O Board)

Remove 2 screws on rear side of Juno Chassis with T-10 Driver.

Slide Hood and remove 2 Black Screw with T15 Driver to detach PCIe/PXIe Baseboard Kit.

Remove 2 HDD Cage Screw with T10 Driver than you could

Capacitance

Capacitance which is inserted byoperator

let tin touch the two pin of the capacitance

second, soldering tin the points with Soldering Station which set the temperature to 330

10oC for L/F model , if non-L/F model, set the temperature to 300

10oC, remove capacitance from PCB after tin completely melting, and then put it into Recycled Box(Remark:if

capacitance which is disassembled is GND ,Set the Soldering Station(Gao Zhou)temperature to 300 �10oC,

remove capacitance from PCB after tin completely melting,

Put it into Recycled Box

(Remark: if capacitance which is disassembled is GND, Set the Soldering Station (Gao Zhou)

Capacitors in 800W/500W PSU

2.5 cm Pull down the lid to release the power supply from Chassis

Removing 2 screw on the Bottom Side with T15 Driver

Removing 1 screw on the Right Side with Philips Driver

Removing 4 screw on the Fan Module

Open its cover and locate the capacitors and pry from the PCB with a flat head screw driver or long nose plier and

dispose of properly.

MF877-00

Template Revision A

Page

HPE instructions for this template are available at MF877-01

3.2

Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

Attachment 1 - System Exploding Drawing

Attachment 2- System BatteryLocation

Attachment 3 –Remove Fan Kit

Attachment 4 - Remove 500W/800W PSU

Attachment 5 –PSU Capacitor Location

MF877-00

Template Revision A

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HPE instructions for this template are available at MF877-01

Attachment 1- Edgeline EL1000 System Exploding Drawing

Attachment 2- System Battery Location - 10G I/O

Board

Location: BT1

MF877-00

Template Revision A

Page

HPE instructions for this template are available at MF877-01

Attachment 3- Remove Fan Kit

Remove 2 screws with T15 Driver to release the cage and lift up the cage

Pinch the red holder to remove the fans.

MF877-00

Template Revision A

Page

HPE instructions for this template are available at MF877-01

Attachment 4- Remove 800/500W PSU

Pull down the lock and hold the holder to pulled out the module

MF877-00

Template Revision A

Page

HPE instructions for this template are available at MF877-01

Attachment 5-

Remove 800W PSU Capacitor Location

Remove 500W PSU Capacitor Location

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