HPE Edgeline EL300 Montageanleitung

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE Edgeline EL300 Converged Edge System

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HPE products to remove components and materials requiring selective treatment, as

defined by EU directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Tool Description

Tool Size (if

applicable)

Torx driver

T10/T15

Philps Driver

Flat Head Screw Driver

Medium

Hexagon Screw Driver

5.0mm

Hex Key

8.0mm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. The adapter can’t be disassemble and please dispose it and cable properly.

2. Use Philps Driver#2 to remove screws and take off the metal piece on bottom side.

3. Use Torx Driver#10 to remove screws on left and right sides.

4. Use Flat Head Screw Driver to remove heatsink.

5. Use Hexagon Screw Driver (5.0mm) and Hex Key (8.0mm) to remove screws and hex nuts.

6. Remove the top cover and locate the battery on the system board. With a medium flat head screw driver remove the

battery and dispose of properly.

7. Use Torx driver (T10&T15) to remove screws that fixed on 2 PCBA.

8. Use Torx driver (T10&T15) to remove screws fixed on mother board please refer to pictures.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1:

Attachment 1 – System Coin Battery location

Attachment 2 – Capacitor location by model number of supply

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

Attachment 2:

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