HPE ProLiant XL170r Gen10 Montageanleitung

MF877-00

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HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE ProLiant XL170r Gen10 Server

HPE ProLiant XL190r Gen10 Server

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1

Items listed below are classified as requiring selective treatment.

1.2

Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

ItemDescription

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies(PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containingcomponents

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode RayTubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractoryceramic fibers

1.0 Items Requiring Selective Treatment

MF877-00

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ItemDescription

Notes

Quantity

of items

included

in product

Components, parts and materials containing

radioactivesubstances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Driver

T10

T15

T20

Philips screw driver

Cross No.1

Cross No. 2

Hex socket

Sharp Nose Pliers

screw driver flat type

Tweezer

3.0 Product Disassembly Process

3.1

List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

System Board Battery - Remove the battery from the system board.

Capacitance which is inserted by operator–First, let tin touch the two pin of the capacitance ,second, soldering tin

the

points with Soldering Station which set the temperature to 330 士10oC for L/F model , if non-L/F model,set the

temperature to 300士10oC, remove capacitance from PCB afrer tin completely melting,and then put it into Recycled

Box (Remark:if capacitance which is disassembled is GND ,Set the Soldering Station(Gao

Zhou)temperature to

385oC).

Capacitors in 800W power supply (Chicony) => Remove the power supply from the system.With a Philips screw

driver

remove the screws securing the top cover and loosen the screws securing the PCA. Then use Sharp Nose

Pliers to

remove the daughter card, and electrolyte-capacitor.

Capacitors in 800W and 1400W PSU (Delta) => Push latch and remove PSU from the system. With a Philips

screw

driver remove the screws securing the cover and take the PCA out. Then use Sharp Nose Pliers to

remove the

daughter card, and electrolyte-capacitor. Then use Sharp Nose Pliers to remove the daughter card,

and electrolyte-

capacitor.

3.2

Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the

items

contained in the product that require selective treatment (with descriptions and arrows identifying

locations).

MF877-00

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HPE instructions for this template are available at MF877-01

System battery location

System battery location –BH1

MF877-00

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HPE instructions for this template are available at MF877-01

800W PSU (Chicony) Disassemble

MF877-00

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HPE instructions for this template are available at MF877-01

MF877-00

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HPE instructions for this template are available at MF877-01

SMC: System Exploding drawing

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