Infineon XMC4000 series Benutzerhandbuch

Microcontrollers

XMC4000

Microcontroller Series

for Industrial Applications

Application Guide

V1.0 2013-11

PCB Design

Guidelines

Edition 2013-11

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all

warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual

property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the

failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life

support devices or systems are intended to be implanted in the human body or to support and/or maintain and

sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other

persons may be endangered.

PCB Design

XMC4000 Family

Revision History

Page or Item

Subjects (major changes since previous revision)

V1.0, 2013-11

Trademarks of Infineon Technologies AG

AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,

CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,

EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™,

IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™,

PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™,

SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,

TRENCHSTOP™, TriCore™.

Other Trademarks

Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,

PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by

AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum.

COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.).

EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay

Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique

Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL

ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim

Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of

NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA

MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,

OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™

Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of

Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited.

TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc.

TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™,

PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated.

VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.

Last Trademarks Update 2011-02-24

PCB Design

XMC4000 Family

Table of Contents

Application Guide 4 V1.0, 2013-11

Table of Contents

Revision History ....................................................................................................................................................3

Table of Contents ..................................................................................................................................................4

Guidelines...............................................................................................................................................................5

PCB Design

XMC4000 Family

Introduction

Application Guide 5 V1.0, 2013-11

Guidelines

PCB Design

XMC4000 Family

Introduction

Application Guide 6 V1.0, 2013-11

1 Introduction

The XMC4000 family is an ARM® Cortex™-M4 based 32-bit microcontroller family available in VQFN-

48, LQFP-64/100/144 and LGBGA-144 pin packages. This application guide helps to design a PCB

with respect to:

electromagnetic compatibility

power supply system

performance of analog peripherals

thermal management

In addition to the Infineon PCB Design Guidelines for Microcontrollers (AP24026), which gives

general design rules for PCB design, some product-specific recommendations and guidelines for the

XMC4000 family are provided in this document.

Note:This application note contains design recommendations from Infineon Technologies point of

view. Effectiveness and performance of the final application implementation must be validated

by the customer, based on dedicated implementation choices. Other design implementations

can also be applied.

2 General Information

The XM4000 family has four different power domains:

Pad Domain (VDDP, 3.3V, supplied externally)

Analog Domain (VDDA, 3.3V, supplied externally)

Core Domain (VDDC, 1.3V, generated internally)

Hibernate Domain (VBAT, 2.0-3.6V, supplied externally)

The Pad Domain VDDP and the Analog Domain VDDA with a nominal voltage of 3.3V must be

supplied and decoupled externally.

The Core Domain supply with a nominal voltage of 1.3V is generated out of the Pad Domain supply

by an on-chip EVR (Embedded Voltage Regulator). The VDDC pins are the output of the EVR and

must be stabilized and decoupled with external decoupling capacitors on the PCB.

The supply pin VBAT of the Hibernate Domain can be connected to a battery coin cell or large

capacitor. Even if the hibernate features are not used, the VBAT pin must always be connected to a

power supply, when VDDP is supplied.

Note: The VBAT pin must always be supplied, when VDDP is supplied. Tie the VBAT pin directly to

VDDP, if no other circuitry for VBAT is destined.

3 PCB Design Recommendations

3.1 Clock Output

To minimize the EMI radiation on the PCB some measures have to be considered if the external clock

output feature via the clock pin EXTCLK (P0.8 or P1.15) is used:

Reduced the driver strength of the pin if possible by choosing a weak pad drive mode (register

P0_PDR0 or P1_PDR15 respectively)

Route this signal with adjacent ground reference and avoid signal and reference layer changes

Route it as short as possible

Routing ground on each side can help to reduce coupling to the other signals (crosstalk)

PCB Design

XMC4000 Family

PCB Design Recommendations

Application Guide 7 V1.0, 2013-11

3.2 Unused Pins

For unused pins the measures listed in Table 1 should be considered.

Table 1 Measures for unused pins

Unused Function / Unused Pin

Recommended measure if pin is not used

Power Supply Pins (VDDP, VDDA,

VDDC, VBAT, VSS including exposed

pad, VSSA, VSSO, VAGND)

These pins must always be connected to an appropriate

power supply or power circuitry!

Reference Voltage of the ADC

(VAREF)

Leave VAREF open (ADC cannot be used, digital input

function of P14 and P15 is still working)

Port Pins (P0-P15)

Pins should be configured as “direct input” with an “internal

pull-up [or pull-down] device active” via the register Pn_IOCR

Pins should be left open and should not be connected to any

other net (layout isolated PCB pad, for soldering only)

External oscillator pins (XTAL1, XTAL2,

RTC_XTAL1, RTC_XTAL2)

Leave XTAL1 / RTC_XTAL1 open if the corresponding

oscillator is in dower-down

Connect a pull-down resistor to XTAL1 / RTC_XTAL1 or tie

directly to GND (VSS) if the corresponding oscillator is not in

dower-down

Leave XTAL2 / RTC_XTAL2 open

USB Pins (USB_DP, USB_DM, VBUS)

Leave USB_DP, USB_DM and VBUS open

Serial Wire Debug Pins (TMS, TCK)

Leave TMS and TCK open

Reset Pin (PORST#)

Leave PORST# open

Hibernate Pins (HIB_IO_0, HIB_IO_1)

Leave HIB_IO_0 open (after reset this pin is driving a low

level)

Leave HIB_IO_1 open if the Hibernate domain is not enabled

(SCU_PWRSTAT.HIBEN == 0)

Leave HIB_IO_1 open and configure as “Direct input, Input

pull-down device connected” (HDCR.HIBIO1SEL = 0001B) if

the Hibernate domain is enabled (SCU_PWRSTAT.HIBEN

== 1)

PCB Design

XMC4000 Family

PCB Design Recommendations

Application Guide 8 V1.0, 2013-11

3.3 Main Oscillator (XTAL1 / XTAL2)

To reduce the radiation / coupling from the main oscillator circuit, a separated ground island on the

GND layer should be designed (see Figure 1). This ground island can be connected at one point to

the GND layer. Ideally this point is close to the VSSO pin (not available in all packages). This helps to

keep the noise generated by the oscillator circuit locally on this separated island. The ground

connections of the load capacitors and VSSO should also be connected to this island. Traces for load

capacitors and Crystal should be as short as possible.

Crystal

VSSO

XTAL2

XTAL1

VSS

GND Plane

Separated GND Island on TOP layer

(carved out from global GND layer)

Via to GND

Plane

Via to GND

Plane

μC

Figure 1 Separated Ground Island for the Main Ocsillator

3.4 Power Supply Domains

All VDDC pins must be connected to one net on the PCB, even if they are internally connected by

each other, because the impedance of the external connection is much lower than the internal

connection.

A low inductance value for the connection of decoupling capacitors to the supply pins is required.

Therefor place the decoupling capacitors close to the corresponding power supply pin group.

All supply domains should be decoupled separately with Low ESR and Low ESL capacitors

(ceramic multilayer capacitors preferably)

Use the capacitors values for decoupling/stabilization as shown in Table 2.

Table 2 Decoupling / Stabilization Capacitor Values

Power Supply Domain

Number and Sizes of Decoupling / Stabilization capacitors

Pad Domain VDDP/VSS

100 nF to each VDDP pin, 20 μF or higher to one pin

Analog Domain VDDA/VSSA

100 nF to VDDA pin

Core Domain VDDC/VSS

XMC4500: 100 nF to each VDDC pin, 10 μF ±10% X7R to one pin

XMC4400/XMC4200: 100 nF to each VDDC pin, 4.7 μF ±10% X7R to one pin

Hibernate Domain VBAT

Any value, depends on hibernate time

All power supply pins (supplied from a voltage regulator) should be connected first to the

dedicated decoupling capacitor and then from the capacitors over vias to the power supply planes

All VSS pins should be connected to the GND layer

The power distribution from the regulator to each power plane should be made over filters (EMI

filter using ferrite beads).

PCB Design

XMC4000 Family

PCB Design Recommendations

Application Guide 9 V1.0, 2013-11

Inductance/ferrite beads in the range L ~5-10μH should be inserted in the supply paths at the

regulator output.

Avoid cutting the GND plane by via groups. A solid GND plane must be designed.

Depending on power dissipation (refer to the Data Sheet) the exposed pad should be connected to

sufficient GND area on all layers.

A power-plane/grounding concept example for the XMC4000 microcontrollers can be found in Figure

Figure 2 2-layer PCB Layout Example for Decoupling of XMC4000 (single sided assembly)

VSS

VBAT

VDDP

100

VAREF

VDDA

VDDC

VDDP

VDDC

VDDP on TOP Layer

VDDC on TOP Layer

VSS on TOP Layer

VBAT on TOP Layer

Bridge on Bottom Layer

Via to VSS/GND Layer

VSS on BOTTOM Layer

VDDP

VAREF on TOP Layer

VDDA on TOP Layer

VSS/GND

VDDPVAREF VSS /

GND

VDDA

TOP

Layer

BOTTOM

Layer

Published by Infineon Technologies AG

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