Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL... Leitfaden

Document Number: 318734-016

Intel®Core™2 Duo Processor

E8000∆and E7000∆Series, Intel®

Pentium®Dual-Core Processor

E6000∆and E5000∆Series, and

Intel®Celeron®Processor E3000∆

Series

Thermal and Mechanical Design Guidelines

August 2010

2 Thermal and Mechanical Design Guidelines

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countries.

*Other names and brands may be claimed as the property of others.

Thermal and Mechanical Design Guidelines 3

Contents

1Introduction ...................................................................................................... 9

1.1 Document Goals and Scope ...................................................................... 9

1.1.1 Importance of Thermal Management ............................................ 9

1.1.2 Document Goals ........................................................................ 9

1.1.3 Document Scope ...................................................................... 10

1.2 References ............................................................................................ 11

1.3 Definition of Terms................................................................................. 11

2Processor Thermal/Mechanical Information .......................................................... 13

2.1 Mechanical Requirements ........................................................................ 13

2.1.1 Processor Package .................................................................... 13

2.1.2 Heatsink Attach ........................................................................ 15

2.1.2.1 General Guidelines ..................................................... 15

2.1.2.2 Heatsink Clip Load Requirement .................................. 15

2.1.2.3 Additional Guidelines .................................................. 16

2.2 Thermal Requirements ........................................................................... 16

2.2.1 Processor Case Temperature ...................................................... 16

2.2.2 Thermal Profile ......................................................................... 17

2.2.3 Thermal Solution Design Requirements ....................................... 17

2.2.4 TCONTROL ................................................................................... 18

2.3 Heatsink Design Considerations ............................................................... 19

2.3.1 Heatsink Size ........................................................................... 20

2.3.2 Heatsink Mass .......................................................................... 20

2.3.3 Package IHS Flatness ................................................................ 21

2.3.4 Thermal Interface Material ......................................................... 21

2.4 System Thermal Solution Considerations .................................................. 22

2.4.1 Chassis Thermal Design Capabilities ............................................ 22

2.4.2 Improving Chassis Thermal Performance ..................................... 22

2.4.3 Summary ................................................................................ 23

2.5 System Integration Considerations ........................................................... 23

3Thermal Metrology ............................................................................................ 25

3.1 Characterizing Cooling Performance Requirements ..................................... 25

3.1.1 Example .................................................................................. 26

3.2 Processor Thermal Solution Performance Assessment ................................. 27

3.3 Local Ambient Temperature Measurement Guidelines ................................. 27

3.4 Processor Case Temperature Measurement Guidelines ................................ 30

4Thermal Management Logic and Thermal Monitor Feature ...................................... 31

4.1 Processor Power Dissipation .................................................................... 31

4.2 Thermal Monitor Implementation ............................................................. 31

4.2.1 PROCHOT# Signal .................................................................... 32

4.2.2 Thermal Control Circuit ............................................................. 32

4.2.2.1 Thermal Monitor ........................................................ 32

4.2.3 Thermal Monitor 2 .................................................................... 33

4.2.4 Operation and Configuration ...................................................... 34

4.2.5 On-Demand Mode ..................................................................... 35

4 Thermal and Mechanical Design Guidelines

4.2.6 System Considerations .............................................................. 35

4.2.7 Operating System and Application Software Considerations ........... 36

4.2.8 THERMTRIP# Signal .................................................................. 36

4.2.9 Cooling System Failure Warning ................................................. 36

4.2.10 Digital Thermal Sensor .............................................................. 37

4.2.11 Platform Environmental Control Interface (PECI) .......................... 38

5Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 39

5.1 Overview of the BTX Reference Design ..................................................... 39

5.1.1 Target Heatsink Performance ..................................................... 39

5.1.2 Acoustics ................................................................................. 40

5.1.3 Effective Fan Curve ................................................................... 41

5.1.4 Voltage Regulator Thermal Management ...................................... 42

5.1.5 Altitude ................................................................................... 43

5.1.6 Reference Heatsink Thermal Validation ........................................ 43

5.2 Environmental Reliability Testing ............................................................. 43

5.2.1 Structural Reliability Testing ...................................................... 43

5.2.1.1 Random Vibration Test Procedure ................................ 43

5.2.1.2 Shock Test Procedure ................................................. 44

5.2.2 Power Cycling .......................................................................... 45

5.2.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 46

5.3 Material and Recycling Requirements........................................................ 46

5.4 Safety Requirements .............................................................................. 47

5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........ 47

5.6 Preload and TMA Stiffness ....................................................................... 48

5.6.1 Structural Design Strategy ......................................................... 48

5.6.2 TMA Preload verse Stiffness ....................................................... 48

6ATX Thermal/Mechanical Design Information ........................................................ 51

6.1 ATX Reference Design Requirements ........................................................ 51

6.2 Validation Results for Reference Design .................................................... 53

6.2.1 Heatsink Performance ............................................................... 53

6.2.2 Acoustics ................................................................................. 54

6.2.3 Altitude ................................................................................... 54

6.2.4 Heatsink Thermal Validation ....................................................... 55

6.3 Environmental Reliability Testing ............................................................. 55

6.3.1 Structural Reliability Testing ...................................................... 55

6.3.1.1 Random Vibration Test Procedure ................................ 55

6.3.1.2 Shock Test Procedure ................................................. 56

6.3.2 Power Cycling .......................................................................... 57

6.3.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 58

6.4 Material and Recycling Requirements........................................................ 58

6.5 Safety Requirements .............................................................................. 59

6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ...... 59

6.7 Reference Attach Mechanism ................................................................... 60

6.7.1 Structural Design Strategy ......................................................... 60

6.7.2 Mechanical Interface to the Reference Attach Mechanism .............. 61

7Intel® Quiet System Technology (Intel® QST) ...................................................... 63

7.1 Intel® QST Algorithm .............................................................................. 63

7.1.1 Output Weighting Matrix ............................................................ 64

7.1.2 Proportional-Integral-Derivative (PID) ......................................... 64

7.2 Board and System Implementation of Intel® QST ....................................... 66

Thermal and Mechanical Design Guidelines 5

7.3 Intel® QST Configuration and Tuning ........................................................ 68

7.4 Fan Hub Thermistor and Intel® QST ......................................................... 68

Appendix A LGA775 Socket Heatsink Loading ........................................................................ 69

A.1 LGA775 Socket Heatsink Considerations ................................................... 69

A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel®

Reference Design ................................................................................... 69

A.3 Heatsink Preload Requirement Limitations ................................................. 69

A.3.1 Motherboard Deflection Metric Definition...................................... 70

A.3.2 Board Deflection Limits .............................................................. 71

A.3.3 Board Deflection Metric Implementation Example ......................... 72

A.3.4 Additional Considerations........................................................... 73

A.3.4.1 Motherboard Stiffening Considerations ......................... 74

A.4 Heatsink Selection Guidelines .................................................................. 74

Appendix B Heatsink Clip Load Metrology ............................................................................. 75

B.1 Overview .............................................................................................. 75

B.2 Test Preparation .................................................................................... 75

B.2.1 Heatsink Preparation ................................................................. 75

B.2.2 Typical Test Equipment ............................................................. 78

B.3 Test Procedure Examples ........................................................................ 78

B.3.1 Time-Zero, Room Temperature Preload Measurement ................... 79

B.3.2 Preload Degradation under Bake Conditions ................................. 79

Appendix C Thermal Interface Management .......................................................................... 81

C.1 Bond Line Management .......................................................................... 81

C.2 Interface Material Area ........................................................................... 81

C.3 Interface Material Performance ................................................................ 81

Appendix D Case Temperature Reference Metrology ............................................................... 83

D.1 Objective and Scope............................................................................... 83

D.2 Supporting Test Equipment ..................................................................... 83

D.3 Thermal Calibration and Controls ............................................................. 85

D.4 IHS Groove ........................................................................................... 85

D.5 Thermocouple Attach Procedure ............................................................... 89

D.5.1 Thermocouple Conditioning and Preparation ................................. 89

D.5.2 Thermocouple Attachment to the IHS .......................................... 90

D.5.3 Solder Process ......................................................................... 95

D.5.4 Cleaning and Completion of Thermocouple Installation .................. 98

D.6 Thermocouple Wire Management ........................................................... 102

Appendix E Balanced Technology Extended (BTX) System Thermal Considerations .................. 103

Appendix F Fan Performance for Reference Design .............................................................. 107

Appendix G Mechanical Drawings ....................................................................................... 109

Appendix H Intel® Enabled Reference Solution Information ................................................... 125

6 Thermal and Mechanical Design Guidelines

Figures

Figure 2-1. Package IHS Load Areas ................................................................... 13

Figure 2-2. Processor Case Temperature Measurement Location ............................. 17

Figure 2-3. Example Thermal Profile.................................................................... 18

Figure 3-1. Processor Thermal Characterization Parameter Relationships ................. 26

Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink29

Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ... 29

Figure 4-1. Thermal Monitor Control.................................................................... 33

Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering .............................. 34

Figure 4-3. TCONTROL for Digital Thermal Sensor ..................................................... 37

Figure 5-1. Effective TMA Fan Curves with Reference Extrusion .............................. 42

Figure 5-2. Random Vibration PSD ...................................................................... 44

Figure 5-3. Shock Acceleration Curve .................................................................. 44

Figure 5-4. Intel Type II TMA 65W Reference Design ............................................. 47

Figure 5-5. Upward Board Deflection During Shock ............................................... 48

Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly

Stiffness .................................................................................................... 49

Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features ....... 50

Figure 6-1. E18764-001 Reference Design – Exploded View ................................... 52

Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease ....................... 52

Figure 6-3. Random Vibration PSD ...................................................................... 56

Figure 6-4. Shock Acceleration Curve .................................................................. 56

Figure 6-5. Upward Board Deflection during Shock ................................................ 60

Figure 6-6. Reference Clip/Heatsink Assembly ...................................................... 61

Figure 6-7. Critical Parameters for Interfacing to Reference Clip ............................. 62

Figure 6-8. Critical Core Dimension ..................................................................... 62

Figure 7-1. Intel® QST Overview ........................................................................ 64

Figure 7-2. PID Controller Fundamentals ............................................................. 65

Figure 7-3. Intel® QST Platform Requirements ..................................................... 66

Figure 7-4. Example Acoustic Fan Speed Control Implementation ........................... 67

Figure 7-5. Digital Thermal Sensor and Thermistor ............................................... 68

Figure 7-6. Board Deflection Definition ................................................................ 71

Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflection Limit ....... 73

Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View .. 76

Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View ...... 77

Figure 7-10. Preload Test Configuration ............................................................... 77

Figure 7-11. Omega Thermocouple ..................................................................... 84

Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit ..... 86

Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit (Old

Drawing) ................................................................................................... 87

Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ................ 88

Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775 Socket 88

Figure 7-16. Inspection of Insulation on Thermocouple .......................................... 89

Figure 7-17. Bending the Tip of the Thermocouple ................................................ 90

Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach .......... 90

Figure 7-19. Thermocouple Bead Placement ......................................................... 91

Figure 7-20. Position Bead on the Groove Step ..................................................... 92

Figure 7-21. Detailed Thermocouple Bead Placement ............................................ 92

Figure 7-22. Third Tape Installation .................................................................... 93

Figure 7-23. Measuring Resistance between Thermocouple and IHS ........................ 93

Figure 7-24. Applying Flux to the Thermocouple Bead ........................................... 94

Figure 7-25. Cutting Solder ................................................................................ 94

Figure 7-26. Positioning Solder on IHS ................................................................ 95

Thermal and Mechanical Design Guidelines 7

Figure 7-27. Solder Station Setup ....................................................................... 96

Figure 7-28. View Through Lens at Solder Station ................................................. 97

Figure 7-29. Moving Solder back onto Thermocouple Bead ..................................... 97

Figure 7-30. Removing Excess Solder .................................................................. 98

Figure 7-31. Thermocouple placed into groove ..................................................... 99

Figure 7-32. Removing Excess Solder .................................................................. 99

Figure 7-33. Filling Groove with Adhesive .......................................................... 100

Figure 7-34. Application of Accelerant ............................................................... 100

Figure 7-35. Removing Excess Adhesive from IHS .............................................. 101

Figure 7-36. Finished Thermocouple Installation ................................................. 101

Figure 7-37. Thermocouple Wire Management .................................................... 102

Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified . 104

Figure 7-39. Thermal sensor Location Illustration ............................................... 105

Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height

Restrictions for Enabling Components - Sheet 1 ........................................... 110

Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height

Restrictions for Enabling Components - Sheet 2 ........................................... 111

Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height

Restrictions for Enabling Components - Sheet 3 ........................................... 112

Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 ......................... 113

Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 ......................... 114

Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 ......................... 115

Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 ......................... 116

Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 ......................... 117

Figure 7-48. ATX Reference Clip – Sheet 1 ......................................................... 118

Figure 7-49. ATX Reference Clip - Sheet 2 ......................................................... 119

Figure 7-50. Reference Fastener - Sheet 1 ......................................................... 120

Figure 7-51. Reference Fastener - Sheet 2 ......................................................... 121

Figure 7-52. Reference Fastener - Sheet 3 ......................................................... 122

Figure 7-53. Reference Fastener - Sheet 4 ......................................................... 123

Figure 7-54. Intel® E18764-001 Reference Solution Assembly .............................. 124

Tables

Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ........... 22

Table 2–2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions .. 22

Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance39

Table 5–2. Acoustic Targets ............................................................................... 40

Table 5–3. VR Airflow Requirements .................................................................... 42

Table 5–4. Processor Preload Limits .................................................................... 49

Table 6–1. E18764-001 Reference Heatsink Performance ...................................... 53

Table 6–2. Acoustic Results for ATX Reference Heatsink (E18764-001) .................... 54

Table 7–1. Board Deflection Configuration Definitions ............................................ 70

Table 7–2. Typical Test Equipment ...................................................................... 78

Table 7–3. Fan Electrical Performance Requirements ........................................... 107

Table 7–4. Intel® Representative Contact for Licensing Information of BTX Reference

Design .................................................................................................... 125

Table 7–5. E18764-001 Reference Thermal Solution Providers ............................. 125

Table 7–6. BTX Reference Thermal Solution Providers ......................................... 126

8 Thermal and Mechanical Design Guidelines

Revision History

Revision

Number Description Revision

001 •Initial release. January 2008

002 •Added Intel® Core™2 Duo processor E8300 and E7200 April 2008

003 •Added Intel® Core™2 Duo processor E8600 and E7300 August 2008

004 •Added Intel® Pentium dual-core processor E5200 August 2008

005 •Added Intel® Core™2 Duo processor E7400 October 2008

006 •Added Intel® Pentium dual-core processor E5300 December 2008

007 •Added Intel® Pentium dual-core processor E5400

•Added Intel® Core™2 Duo processor E7500 January 2009

008 •Added Intel® Pentium dual-core processor E6300 May 2009

009 •Added Intel® Core™2 Duo processor E7600 June 2009

010 •Added Intel® Pentium dual-core processor E6500 August 2009

011 •Intel® Celeron® processor E3x00 series August 2009

012 •Added Intel® Pentium dual-core processor E6600

•Intel® Celeron® processor E3400 January 2010

013 •Added Intel® Pentium dual-core processor E5500 April 2010

014 •Added Intel® Pentium dual-core processor E6700 June 2010

015 •Added Intel® Pentium dual-core processor E5700 August 2010

016

•Added Intel® Pentium dual-core processor E6800

•Added Intel® Celeron® processor E3500

•Changed the processor numbering from Intel Celeron processor E3x00

series to Intel Celeron processor E3000 series.

August 2010

Introduction

Thermal and Mechanical Design Guidelines 9

1Introduction

1.1 Document Goals and Scope

1.1.1 Importance of Thermal Management

The objective of thermal management is to ensure that the temperatures of all

components in a system are maintained within their functional temperature range.

Within this temperature range, a component is expected to meet its specified

performance. Operation outside the functional temperature range can degrade system

performance, cause logic errors or cause component and/or system damage.

Temperatures exceeding the maximum operating limit of a component may result in

irreversible changes in the operating characteristics of this component.

In a system environment, the processor temperature is a function of both system and

component thermal characteristics. The system level thermal constraints consist of the

local ambient air temperature and airflow over the processor as well as the physical

constraints at and above the processor. The processor temperature depends in

particular on the component power dissipation, the processor package thermal

characteristics, and the processor thermal solution.

All of these parameters are affected by the continued push of technology to increase

processor performance levels and packaging density (more transistors). As operating

frequencies increase and packaging size decreases, the power density increases while

the thermal solution space and airflow typically become more constrained or remains

the same within the system. The result is an increased importance on system design

to ensure that thermal design requirements are met for each component, including the

processor, in the system.

1.1.2 Document Goals

Depending on the type of system and the chassis characteristics, new system and

component designs may be required to provide adequate cooling for the processor.

The goal of this document is to provide an understanding of these thermal

characteristics and discuss guidelines for meeting the thermal requirements imposed

on single processor systems using the Intel® Core™2 Duo processor E8000, E7000

series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron®

processor E3000 series.

The concepts given in this document are applicable to any system form factor. Specific

examples used will be the Intel enabled reference solution for ATX/uATX systems. See

the applicable BTX form factor reference documents to design a thermal solution for

that form factor.

Introduction

10 Thermal and Mechanical Design Guidelines

1.1.3 Document Scope

This design guide supports the following processors:

•Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel®

Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190

•Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel®

Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200

•Intel® Pentium® dual-core processor E5000 series with 2 MB cache applies to

Intel® Pentium® dual-core processors E5700, E5500, E5400, E5300, and E5200

•Intel® Pentium® dual-core processor E6000 series with 2 MB cache applies to

Intel® Pentium® dual-core processor E6800, E6700, E6600, E6500, and E6300

•Intel® Celeron® processor E3000 series with 1 MB cache applies to the Intel®

Celeron® processor E3500, E3400, E3300, and E3200

In this document when a reference is made to “the processor” it is intended that this

includes all the processors supported by this document. If needed for clarity, the

specific processor will be listed.

In this document, when a reference is made to the “the reference design” it is

intended that this means ATX reference designs (E18764-001) supported by this

document. If needed for clarify, the specific reference design will be listed.

In this document, when a reference is made to “the datasheet”, the reader should

refer to the Intel®Core™2 Duo Processor E8000 and E7000 Series Datasheet, Intel®

Pentium®Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel®

Celeron®Processor E3000 Series Datasheet. If needed for clarity the specific

processor datasheet will be referenced.

Chapter 2 of this document discusses package thermal mechanical requirements to

design a thermal solution for the processor in the context of personal computer

applications.

Chapter 3 discusses the thermal solution considerations and metrology

recommendations to validate a processor thermal solution.

Chapter 4 addresses the benefits of the processor’s integrated thermal management

logic for thermal design.

Chapter 5 gives information on the Intel reference thermal solution for the processor

in BTX platform.

Chapter 6 gives information on the Intel reference thermal solution for the processor

in ATX platform.

Chapter 7 discusses the implementation of acoustic fan speed control.

The physical dimensions and thermal specifications of the processor that are used in

this document are for illustration only. Refer to the datasheet for the product

dimensions, thermal power dissipation and maximum case temperature. In case of

conflict, the data in the datasheet supersedes any data in this document.

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