Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE... Leitfaden

Order Number: 320028-001

Intel® Core™ 2 Duo Mobile

Processors on 45-nm process for

Embedded Applications

Thermal Design Guide

June 2008

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

TDG June 2008

2Order Number: 320028-001

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Core™ 2 Duo Mobile Processors—Contents

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG June 2008

3Order Number: 320028-001

Contents

1.0 Introduction ............................................................................................................. 6

1.1 Design Flow ....................................................................................................... 6

1.2 Definition of Terms ............................................................................................. 7

1.3 Reference Documents.......................................................................................... 8

1.4 Thermal Design Tool Availability ........................................................................... 8

2.0 Package Information ................................................................................................ 9

3.0 Thermal Specifications.............................................................................................10

3.1 Thermal Design Power........................................................................................10

3.2 Maximum Allowed Component Temperature ..........................................................10

4.0 Mechanical Specifications ........................................................................................11

4.1 Package Mechanical Requirements .......................................................................11

4.1.1 Die Pressure/Load Upper Limit..................................................................11

4.1.2 Die Pressure/Load Lower Limit..................................................................11

4.2 Package Keep Out Zones Requirements ................................................................11

4.3 Board Level Keep Out Zone Requirements.............................................................11

5.0 Thermal Solution Requirements...............................................................................15

5.1 Thermal Solution Characterization........................................................................15

5.1.1 Calculating the Required Thermal Performance for the Intel®Core™2 Duo

processor ..............................................................................................16

6.0 Reference Thermal Solutions ...................................................................................18

6.1 ATCA Reference Thermal Solution ........................................................................18

6.2 Keep Out Zone Requirements..............................................................................19

6.3 Thermal Performance.........................................................................................19

6.4 1U+ Reference Heatsink.....................................................................................19

6.4.1 Keep Out Zone Requirements...................................................................20

6.4.2 Thermal Performance..............................................................................20

6.5 Compact PCI Reference Heatsink .........................................................................21

6.5.1 Keep Out Zone Requirements...................................................................22

6.5.2 Thermal Performance..............................................................................22

6.6 Heatsink Fastener Assembly................................................................................22

6.7 Thermal Interface Material (TIM) .........................................................................22

6.8 Heatsink Orientation ..........................................................................................23

7.0 Thermal Metrology...................................................................................................24

7.1 Die Temperature Measurements ..........................................................................24

7.2 Power Simulation Software .................................................................................24

7.3 Additional Thermal Features................................................................................24

7.4 Local Ambient Temperature Measurement Guidelines..............................................24

7.4.1 Active Heatsink Measurements .................................................................25

7.4.2 Passive Heatsink Measurements................................................................25

8.0 Reliability Guidelines ...............................................................................................28

A Thermal Solution Component Suppliers....................................................................29

B Mechanical Drawings ...............................................................................................30

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 4

Figures—Core™ 2 Duo Mobile Processors

Figures

1 Thermal Design Process..............................................................................................7

2 Primary Side Keep Out Zone Requirements— Micro-FCPGA............................................12

3 Primary Side Keep Out Zone Requirements— Micro-FCBGA............................................13

4 Secondary Side Keep Out Zone Requirements..............................................................14

5 Processor Thermal Characterization Parameter Relationships .........................................16

6 AdvancedTCA* Reference Heatsink Assembly...............................................................18

7 AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate ......................19

8 1U Reference Heatsink Assembly ...............................................................................20

9 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate .......................................21

10 CompactPCI Reference Heatsink Assembly ..................................................................21

11 cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate .........................22

12 Heatsink Orientation Relative to Airflow Direction .........................................................23

13 Measuring TLA with an Active Heatsink .......................................................................26

14 Measuring TLA with a Passive Heatsink .......................................................................27

15 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)........ 31

16 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)........ 32

17 AdvancedTCA* Reference Heatsink Assembly...............................................................33

18 AdvancedTCA* Reference Heatsink.............................................................................34

19 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2).......... 35

20 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2).......... 36

21 CompactPCI* Reference Heatsink Assembly.................................................................37

22 CompactPCI* Reference Heatsink...............................................................................38

23 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2).................................39

24 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2).................................40

25 1U Reference Heatsink Assembly ...............................................................................41

26 1U Reference Heatsink..............................................................................................42

Tables

1 Definition of Terms.....................................................................................................7

2 Thermal Specifications for the Intel®Core™2 Duo processor..........................................10

3 Required Heatsink Thermal Performance (ΨJA).............................................................17

4 Reliability Requirements............................................................................................28

5 Reference Heatsink ..................................................................................................29

6 Mechanical Drawings ................................................................................................30

Core™ 2 Duo Mobile Processors—Tables

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG June 2008

5Order Number: 320028-001

Revision History

Date Revision Description

June 2008 1.0 First Public release.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 6

Introduction—Core™ 2 Duo Mobile Processors

1.0 Introduction

The power dissipation of electronic components has risen along with the increase in complexity of

computer systems. To ensure quality, reliability, and performance goals are met over the product’s life

cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat

dissipation include selective use of airflow ducting, and/or the use of heatsinks.

The goals of this document are to:

• Identify the thermal and mechanical specification for the device.

• Describe a reference thermal solution that meets the specifications.

A properly designed thermal solution will adequately cool the device at or below the thermal

specification. This is accomplished by providing a suitable local-ambient temperature, ensuring

adequate local airflow, and minimizing the die to local-ambient thermal resistance. Operation outside

the functional limits can degrade system performance and may cause permanent changes in the

operating characteristics of the component.

This document describes thermal design guidelines for the Intel® Core™ 2 Duo Mobile Processors on

45-nm process for Embedded Applications in the micro Flip Chip Pin Grid Array (micro-FCPGA)

package and the micro Flip Chip Ball Grid Array (micro-FCBGA) package. The information provided in

this document is for reference only and additional validation must be performed prior to implementing

the designs into final production. The intent of this document is to assist each original equipment

manufacturer (OEM) with the development of thermal solutions for their individual designs. The final

heatsink solution, including the heatsink, attachment method, and thermal interface material (TIM)

must comply with the mechanical design, environmental, and reliability requirements delineated in

the processor datasheet. It is the responsibility of each OEM to validate the thermal solution design

with their specific applications.

This document addresses thermal and mechanical design specifications for the Intel Core 2 Duo

processor only. For thermal design information on other Intel components, refer to the respective

component datasheets.

1.1 Design Flow

Several tools are available from Intel to assist with the development of a reliable, cost-effective

thermal solution. Figure 1 illustrates a typical thermal solution design process with available tools

noted. The tools are available through your local Intel field sales representative.

Core™ 2 Duo Mobile Processors—Introduction

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG June 2008

7Order Number: 320028-001

1.2 Definition of Terms

Figure 1. Thermal Design Process

Table 1. Definition of Terms (Sheet 1 of 2)

Term Definition

FCPGA Flip Chip Pin Grid Array. A pin grid array packaging technology where the die is

exposed on the package substrate.

FCBGA Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is

exposed on the package substrate.

TJUNCTION-MAX Maximum allowed component (junction) temperature. Also referred to as TJ-MAX

TDP Thermal Design Power. Thermal solutions should be designed to dissipate this

target power level.

TLA Local ambient temperature. This is the temperature measured inside the chassis,

approximately 1 inch upstream of a component heatsink. Also referred to as TA.

ΨJA Junction-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using the total package power. Defined as (TJUNCTION – TLA) /

Total Package Power

ΨTIM Thermal interface material thermal characterization parameter. A measure of

thermal interface material performance using total package power. Defined as (T

CASE – T JUNCTION)/ Total Package Power. Also referred to as ΨJS.

ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using total package power. Defined as (T SINK – T JUNCTION)/

Total Package Power.

°C Degrees in Celsius

CFM Volumetric airflow rate in cubic feet per minute

in. Inches

LFM Airflow velocity in linear feet per minute

PCB Printed circuit board

TSINK Heatsink temperature measured on the underside of the heatsink base.

•Package Level Thermal Models

•Thermal Model User’s Guide

Step 1: Thermal Simulation

•Reference Heatsinks

•Reference Mounting Hardware

•Vendor Contacts

Step 2: Heatsink Design

and Selection

Step 3: Thermal Validation

•Thermal Testing Software

•Thermal Test Vehicle

•User Guides

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 8

Introduction—Core™ 2 Duo Mobile Processors

1.3 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the

following documents:

• Intel® Core™2 Duo Processor for Intel® Centrino® Duo Mobile Technology Datasheet

Documents are located at developer.intel.com. Contact your Intel field sales representative for

additional information.

1.4 Thermal Design Tool Availability

Intel provides thermal simulation models of the device and a thermal model user’s guide to aid

system designers in simulating, analyzing, and optimizing thermal solutions in an integrated, system-

level environment. The models are for use with commercially available Computational Fluid Dynamics

(CFD)-based thermal analysis tools including Flotherm* (version 7.1 or higher) by Flomerics, Inc. or

Icepak* by Fluent, Inc. Contact your Intel representative to order the thermal models and associated

user’s guides.

TIM Thermal Interface Material – the thermally conductive compound between the

heatsink and die. This material fills air gaps and voids, and enhances spreading of

the heat from the die to the heatsink.

UA unit of measure used to define server rack spacing height. 1U is equal to 1.75

inches, 2U equals 3.50 inches, etc.

WWatt

Table 1. Definition of Terms (Sheet 2 of 2)

Term Definition

Core™ 2 Duo Mobile Processors—Package Information

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG June 2008

9Order Number: 320028-001

2.0 Package Information

The Intel® Core™2 Duo Processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well

as 479-ball Micro-FCBGA packages. The Intel® Core™2 Duo Processor SFF processor (LV and ULV) is

available in 956-ball Micro-FCBGA packages. The package mechanical dimensions can be found in the

product’s datasheet.

The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors are electrically

conductive. Care should be taken to prevent the capacitors from contacting any other electrically

conductive materials. Doing so may short the capacitors and possibly damage the device or render it

inactive.

The processor package has mechanical load limits that are specified in the processor datasheet. These

load limits should not be exceeded during heatsink installation, removal, mechanical stress testing, or

standard shipping conditions. The heatsink mass can also add additional dynamic compressive load to

the package during a mechanical shock event. Amplification factors due to the impact force during

shock must be taken into account in dynamic load calculations. The total combination of dynamic and

static compressive load should not then exceed the processor datasheet compressive dynamic load

specification during a vertical shock. It is not recommended to use any portion of the processor

substrate as a mechanical reference or load bearing surface in either static or dynamic compressive

load conditions.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008 TDG

Order Number: 320028-001 10

Thermal Specifications—Core™ 2 Duo Mobile Processors

3.0 Thermal Specifications

3.1 Thermal Design Power

The Thermal Design Power (TDP) specification is listed in Table 2. Heat transfer through the micro-

FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity

without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage

conditions.

3.2 Maximum Allowed Component Temperature

The device must maintain a maximum temperature at or below the value specified in Table 2. The

thermal solution is required to meet the temperatures specification while dissipating the Thermal

Design Power.

Table 2. Thermal Specifications for the Intel®Core™2 Duo processor

CPU Processor SKU# TDP (W) TJ-MAX

(°C) TJ-MIN

(°C)

Intel® Core™ 2 Duo

Mobile Processors

on 45-nm process

Standard Voltage (Core 2 Duo-6M, Celeron-2M) 35

105 0Low Voltage (Core 2 Duo -3M) 17

Ultra Low Voltage (Core 2 Duo -2M, Celeron) 10

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