Intel 1037U Bedienungsanleitung
TECHNICAL MANUAL
Of
Intel 1037U CPU + Intel NM70 Chipset
Based Mini-ITX M/B
NO. G03-NL70IE1037-F
Revision: 3.0
Release date: May 8, 2014
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION .......................................................................................iv
ITEM CHECKLIST .....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM ....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................9
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................24
3-2 BIOS MENU SCREEN ................................................................................................25
3-3 FUNCTION KEYS .......................................................................................................25
3-4 GETTING HELP ..........................................................................................................26
3-5 MEMU BARS...............................................................................................................26
3-6 MAIN MENU ................................................................................................................27
3-7 ADVANCED MENU.....................................................................................................28
3-8 CHIPSET MENU..........................................................................................................33
3-9 BOOT MENU...............................................................................................................36
3-10 SECURITY MENU .......................................................................................................38
3-11 TURBOOC MENU .......................................................................................................39
3-12 SAVE & EXIT MENU...................................................................................................41
TABLE OF CONTENT
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
3.0 Third Edition May 8, 2014
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable(s)
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® 1037U dual-core CPU+ Intel® NM70 express chipset
Support 1 * DDRIII slot for SO-DIMM 1066/1333 MHz up to 8GB
Support 2 * SATAII (3Gb/s) Devices
Support half-size Mini-PCIE connector
Support m-SATA connector
Integrated with 24-bit dual channel LVDS header
Support HDMI and VGA Video Outputs
Support CPU Smart FAN
Support Watchdog Timer Technology
Support Windows8 OS
Support slim fan design
Support Thunder Protection Function
Compliance with EuP Standard
2
1-2 Specification
Spec Description
Design 6-layer PCB size: 16.8 x 12.0 cm
Embedded CPU
Intel® 1037U Dual Core CPU (1.8GHz)
Chipset Intel® NM70 Express Chipset
Memory
1* DDRIII SO-DIMM slot to support DDRIII 1066/1333 MHz
DDRIII SO-DIMM expandable to 8GB
NL70-IE1037-2G: onboard 2G DRAM
Expansion Slot 1 *halt-size Mini-PCIE slot
1* SIM slot
Storage 2* SATA II 3G/s Connector
1 * M-SATA Connector
LAN Chip
Integrated with Realtek RTL8111G PCI-E Gigabit LAN
chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip Realtek ALC887 HD Audio Codec integrated
Audio driver and utility included
BIOS 32M DIP Flash ROM
Multi I/O
Rear Panel I/O:
1* COM Port
1 * VGA port
2* USB 2.0/1.1 port
2* RJ-45 port
1* Line-Out port
Internal I/O Connectors& Headers:
1 *4-pin 10V~24V Internal Power connector
1 *4-pin SATA Power connector
1 * Front panel header
2 * 9-Pin USB 2.0/1.1 header for four USB 2.0/1.1 ports
3
5* COM header
1* TX-RXCOM header
1 * Parallel header
1 *GPIO header
1 *12-pin VGA header
1 *20-pin HDMI header
1 *24-bit Dual Channel LVDS header
1* LVDS inverter header
JP3: 1*LVDS panel brightness adjustment header
1*CPU fan header
2*System fan header
1-3 Layout Diagram
Rear IO Diagram
VGA Port
Line-Out Port
USB 2.0 Ports
COM1 Port
RJ-45 LAN Port
RJ-45 LAN Port
4
Motherboard Internal Diagram--Front
*Note: This manual serves as common manual for NL70-IE1037 & NL70-IE1037-2G series. The main
deference between the two models is NL70-IE1037-2G comes with onboard 2G DRAM.
10V~24V
Power Connector
DDRIII
SODIMM Slot
VGA Port
Intel CPU
Intel NM70 Chipset
Front Panel Header
M-SATA Connector
USB 2.0 Ports
RJ-45 LAN Port
Parallel Port Header
COM Port Headers
SATAII Ports
GPIO Header
SATA Hard Disk
Power-Out Connector
SYSFAN3 Header
Half-size
Mini-
PCIE
Connector
JP3
USB 2.0 Header
COM1 Port
HDMI Header
TX-RX COM1 Header
RJ-45 LAN Port
Line-Out Port
LVDS Header
LVDS Inverter
VGA Header
CPUFAN1 Header
Power Switch
Button
Reset Button
SYSFAN1 Header
SPEAKER_CON
Header
* DRAM 2G Onboard
(Optional for NL70-IE1037-2G)
5
The other diagrams used for illustration in this manual are from model NL70-IE1037, unless otherwise
stated.
Motherboard Internal Diagram--Back
SIM Card Slot
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1
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