Intel Bay Trail Series Bedienungsanleitung

TECHNICAL MANUAL

Intel Bay Trail Series CPU

Based Mini-ITX M/B

NO. G03-NC52-F

Revision: 1.0

Release date: February 6, 2015

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION ...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION .......................................................................................iv

ITEM CHECKLIST .....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION .........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING .....................................................................................................7

2-2 CONNECTORS AND HEADERS................................................................................10

2-2-1 CONNECTORS .............................................................................................10

2-2-2 HEADERS .....................................................................................................12

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP .....................................................................................................16

3-2 BIOS MENU SCREEN ................................................................................................17

3-3 FUNCTION KEYS .......................................................................................................17

3-4 GETTING HELP ..........................................................................................................18

3-5 MEMU BARS...............................................................................................................18

3-6 MAIN MENU ................................................................................................................19

3-7 ADVANCED MENU.....................................................................................................20

3-8 CHIPSET MENU..........................................................................................................26

3-9 SECURITY MENU .......................................................................................................29

3-10 BOOT MENU...............................................................................................................30

3-11 SAVE & EXIT MENU...................................................................................................31

TABLE OF CONTENT

iii

Environmental Safety Instruction

 Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

 Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

 The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

 Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition February 6, 2015

Item Checklist

 Motherboard

 DVD for motherboard utilities

 User’s Manual

 Cable(s)

 I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

 Onboard Intel® Bay Trail Series Processor, with low power consumption never

denies high performance

 Support 2 * DDR3L 1066/1333 MHz SO-DIMM up to 16GB, support dual channel

function

 Onboard RTL8111G Gigabit Ethernet LAN chip

 Integrated ALC887 HD audio chip

 Support full-size Mini-PCIE connector

 Support m-SATA connector

 Support USB 3.0 data transport demands

 Integrated with 24-bit dual channel LVDS header

 Support VGA display output & DVI-D display output

 Support 1 * SATAII (3Gb/s) Device

 Supports ACPI S3 Function

 Support CPU Smart FAN

 Support Thunder Protection Function

 Compliance with EuP Standard

 All Solid Capacitor design

1-2 Specification

Spec Description

Design  Mini-ITX form factor ;

 PCB size: 17.0 x 17.0 cm

Embedded CPU

 Intel® Bay Trail-D/M/I series CPU

Memory Slot

 2* DDR3L SO-DIMM slot for un-buffered 2* 1066/1333

MHz

DDR3L SO-DIMM expandable to 16GB

 Support dual channel function

Expansion Slot  1* Full-size Mini-PCIE slot

Storage

 1* SATA II 3G/s Connector

 1 * M-SATA Connector

LAN Chip

 Integrated with Realtek RTL8111G PCI-E Gigabit LAN

chip

 Support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

Audio Chip  Realtek ALC887 HD Audio Codec integrated

 Audio driver and utility included

BIOS  64M DIP Flash ROM

Multi I/O

Rear Panel I/O:

 1* PS/2 keyboard connector

 1* PS/2 mouse connector

 1 * VGA port

 1 * DVI-D port

 1* USB 3.0 port

 2* USB 2.0/1.1 port

 1* RJ-45 LAN port

 1* Audio Line-in connector

 1* Audio Line-out connector

 1* Audio MIC connector

Internal I/O Connectors& Headers:

 1 *24-pin main power connector

 1*CPU fan connector

 1*System fan connector

 1 * Front panel audio header

 1 * HDMI_SPDIF header

 1 * COM header

 1 * Front panel header

 1* LVDS inverter header

 1 * LVDS header

1-3 Layout Diagram

Rear IO Diagram

MIC-IN

Line-OUT

PS/2

Keyboard Port

USB 2.0 Ports

RJ-45 LAN Port

PS/2

Mouse Port

DVI-

D Port

VGA Port

USB 3.0 Port

Line-IN

Motherboard Internal Diagram

Note: 1. Priority should be given to SODIMM1 slot when installing only one compatible memory

modules. 2. The module should be DDR3L 1.35V SODIMM and not exceeding 8GB total capacity.

Intel CPU

LVDS Header

Front Panel

Audio Header

Front Panel Header

M-SATA

Hard Disk

Connector

SATAII Port

(SATA2)

PS/2 Keyboard

over

PS/2 Mouse Port

USB 3.0 Port

Audio

Connectors

SYSFAN Header

Full-Size

Mini-PCIE

Connector

CPUFAN Header

Serial Port Header

HDMI_SPDIF

Header

VGA Port

DVI-D Port

USB 2.0 Ports

ATXPWR

Main

Power connector

LVDS Inverter

DDR3L

SODIMM Slot

(SODIMM1)

DDR3L

SODIMM Slot

(SODIMM2)

Motherboard Jumper Position

Jumper

Jumper Name Description

JP3 INVERTER1 Back Light VCC 3.3V/5V/12V Select 4-pin Block

JP4 LVDS VCC 3.3V/5V/12V Select 4-pin Block

JBAT CMOS RAM Clear Function Setting 3-pin Block

ME_RTC Clear ME RTC Function Setting 2-pin Block

JP6 Mini-PCIE (MMPE) Slot VCC 3.3V/3VSB Select 3-pin Block

JP8 K/B Power on Function Select 3-pin Block

JBAT

JP8

JP6

JP4

JP3

ME_RTC

Inhaltsverzeichnis

Andere Intel Hauptplatine Handbücher

Intel

Intel Celeron 847 Bedienungsanleitung

Intel

Intel D955XCS Bedienungsanleitung

Intel

Intel 1037U Bedienungsanleitung

Intel

Intel DX48BT2 - Desktop Board Extreme Series... Bedienungsanleitung

Intel

Intel G37706-001 Bedienungsanleitung

Intel

Intel DH61SKCH Bedienungsanleitung

Intel

Intel D845PEMY Bedienungsanleitung

Intel

Intel DB65AL Bedienungsanleitung

Intel

Intel Z68 Bedienungsanleitung

Intel

Intel Desktop Board D850EMV2 Bedienungsanleitung

Intel

Intel Desktop Board D845GVFN Bedienungsanleitung

Intel

Intel D845HV Bedienungsanleitung

Intel

Intel D875PBZ - Desktop Board Motherboard Bedienungsanleitung

Intel

Intel D815EGEWLU - P3 Socket 370 MicroATX... Bedienungsanleitung

Intel

Intel D865PERL Bedienungsanleitung

Intel

Intel BLKD201GLY2 - SiS662 DDR2 533 VGA LAN PCI 2SATA Audio Mini ITX 10Pack... Konfigurationshandbuch

Intel

Intel Desktop Board D915PSY Bedienungsanleitung

Intel

Intel DQ77MK Bedienungsanleitung

Intel

Intel BOXDQ67EPB3 Bedienungsanleitung

Intel

Intel D865PCK Bedienungsanleitung

Intel

Intel iSBC 86/12 Kurzanleitung

Intel

Intel BLKD510MO Konfigurationshandbuch

Intel

Intel DH57JG Bedienungsanleitung

Intel

Intel BLKDH61WWB3 Bedienungsanleitung

Beliebte Hauptplatine Handbücher anderer Marken

DFI

DFI SD170 Bedienungsanleitung

ASROCK

ASROCK ROMED8-2T Bedienungsanleitung

Asus

Asus P2L97A Bedienungsanleitung

Winmate

Winmate IC70 Bedienungsanleitung

Asus

Asus MES-B Bedienungsanleitung

Grantech

Grantech SYS8F377VGGA-3OMN Bedienungsanleitung

Telit Wireless Solutions

Telit Wireless Solutions SL869-3DR Bedienungsanleitung

Texas Instruments

Texas Instruments ADS8372EVM Bedienungsanleitung

Commell

Commell MS-C73 Bedienungsanleitung

Gigabyte

Gigabyte GA-9IVDT Bedienungsanleitung

IBT Technologies

IBT Technologies MB860 Bedienungsanleitung

Nvidia

Nvidia TEGRA DG-04927-001_V01 Bedienungsanleitung

Asus

Asus F1A55-M LX PLUS R2.0 Bedienungsanleitung

EPC

EPC EPC9147C Bedienungsanleitung

Asus

Asus EX-B760M-V5 D4 Bedienungsanleitung

EPOX

EPOX MU-8KHA0010 Bedienungsanleitung

Ski-Doo

Ski-Doo Bombardier MPEM 219 700 090 Bedienungsanleitung

Epson

Epson S5U13700P00C000 Bedienungsanleitung