JVC KD-AR960 Bedienungsanleitung

SERVICE MANUAL

2005/2

CD/SD RECEIVER

MA14220052

KD-AR960,KD-LH910

TABLE OF CONTENTS

1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22

5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26

Area suffix

J --------------- Northern America

ARSENAL rogo

LINE IN

KD-AR960 KD-LH910



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1-2 (No.MA142)

SPECIFICATION

Design and specifications are subject to change without notice.

AUDIO AMPLIFIER SECTION

Power Output 20 W RMS ×4 Channels at 4 Ωand [< or =] 1% THD+N

Signal to Noise Ratio 80 dBA (reference: 1 W into 4 Ω)

Load Impedance 4 Ω(4 Ωto 8 Ωallowance)

Equalizer Control Range Low ±12 dB (60 Hz, 80 Hz, 100 Hz, 120 Hz)

Mid ±12 dB (Fix)

High ±12 dB (8 kHz, 10 kHz, 12 kHz, 15 kHz)

Frequency Response 40 Hz to 20 000 Hz

Line-In Level/Impedance KD-AR960 1.5 V/20 kΩload

Line-Out Level/Impedance KD-AR960 5.0 V/20 kΩload (full scale)

KD-LH910 4.0 V/20 kΩload (full scale)

Output Impedance 1 kΩ

Subwoofer-Out Level/Impedance 2.0 V/20 kΩload (full scale)

Other Terminals CD changer, LINE IN (for KD-AR960)

TUNER SECTION

Frequency Range FM 87.5 MHz to 107.9 MHz (with channel interval set to 200 kHz)

87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz)

AM 530 kHz to 1 710 kHz (with channel interval set to 10 kHz)

531 kHz to 1 602 kHz (with channel interval set to 9 kHz)

FM Tuner Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)

50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)

Alternate Channel Selectivity (400 kHz) 65 dB

Frequency Response 40 Hz to 15 000 Hz

Stereo Separation 35 dB

Capture Ratio 1.5 dB

AM Tuner Sensitivity 20 µV

Selectivity 35 dB

CD/SD PLAYER SECTION

Type Compact disc player

Signal Detection System Non-contact optical pickup (semiconductor laser)

Number of Channels 2 channels (stereo)

Frequency Response 5 Hz to 20 000 Hz

Dynamic Range 96 dB

Signal-to-Noise Ratio 98 dB

Wow and Flutter Less than measurable limit

MP3 (MPEG1/2 Audio Layer 3) Max. Bit Rate: 320 kbps

WMA (Windows Media Audio) Max. Bit Rate: 192 kbps

Playable SD Card Format Fat 12/16

Storage Up to 512 MB

Playable Audio Format for SD Card MP3/WMA

GENERAL

Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)

Grounding System Negative ground

Allowable Operating Temperature 0°C to +40°C (32°F to 104°F)

Dimensions (W ×H ×D) Installation Size (approx.) 182 mm ×52 mm ×159 mm (7-3/16" ×2-1/16" ×6-5/16")

Panel Size (approx.) 188 mm ×58 mm ×12 mm (7-7/16" ×2-5/16" ×1/2")

Mass (approx.) 1.7 kg (3.8 lbs) (excluding accessories)

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(No.MA142)1-3

SECTION 1

PRECAUTIONS

1.1 Safety Precautions

!Burrs formed during molding may be left over on some parts of the chassis. Therefore,

pay attention to such burrs in the case of preforming repair of this system.

!Please use enough caution not to see the beam directly or touch it in case of an

adjustment or operation check.

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1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser

diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

1.2.1 Grounding to prevent damage by static electricity

Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.

Be careful to use proper grounding in the area where repairs are being performed.

(1) Ground the workbench

Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the

traverse unit (optical pickup) on it.

(2) Ground yourself

Use an anti-static wrist strap to release any static electricity built up in your body.

(3) Handling the optical pickup

• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical

pickup are shorted. After replacement, return the shorted parts to their original condition.

(Refer to the text.)

• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily

destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.

(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the

replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a

time when attaching it to the connector.

(3) Handle the flexible cable carefully as it may break when subjected to strong force.

(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the CD pickup unit.

• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit.

(If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by static electricity.)

• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.

(caption)

Anti-static wrist strap

Conductive material

(conductive sheet) or iron plate

Flexible wire

CD mechanism assembly

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SECTION 2

SPECIFIC SERVICE INSTRUCTIONS

This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.

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1-6 (No.MA142)

SECTION 3

DISASSEMBLY

3.1 Main body section

3.1.1 Removing the front panel assembly

(See Fig.1)

(1) Push the detach button in the lower right part of the front

panel assembly.

(2) Take out the front panel assembly.

Fig.1

3.1.2 Removing the heat sink

(See Fig.2)

(1) From the left side of the main body, remove the two screws

Aand two screws Battaching the heat sink.

(2) Take out the heat sink.

Fig.2

Front panel assembly

Detach button

Heat sink

AAB

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3.1.3 Removing the top chassis assembly

(See Figs.3 to 6)

• Prior to performing the following procedures, remove the heat

sink.

Reference:

Remove the front panel assembly as required.

(1) From the bottom side of the main body, remove the two

screws Cattaching the top chassis assembly to the bottom

chassis assembly. (See Fig.3)

(2) From the both and back sides of the main body, remove the

four screws Dattaching the top chassis assembly to the

bottom chassis assembly. (See Figs.4 to 6)

(3) From the left side of the main body, remove the screw Eat-

taching the top chassis assembly. (See Fig.5)

(4) Lift the top chassis assembly in the direction of the arrow,

and disconnect the connector CN501 on the CD mecha-

nism assembly from the connector CN702 on the main

board. (See Figs.5 and 6)

(5) Take out the top chassis assembly from the bottom chassis

assembly.

Fig.3

Fig.4

Fig.5

Fig.6

Top chassis assembly

Bottom chassis assembly

Top chassis assembly

Bottom chassis assembly

CD mechanism assembly

Main board CN702 CN501

Top chassis assembly

Bottom chassis assembly Rear bracket

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3.1.4 Removing the front chassis

(See Figs.7 and 8)

• Prior to performing the following procedure, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the both sides of the top chassis assembly, remove

the two screws Fattaching the front chassis. (See Figs.7

and 8)

(2) Take out the front chassis forward.

Fig.7

Fig.8

3.1.5 Removing the CD mechanism assembly

(See Fig.9)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

Reference:

Remove the front chassis as required.

(1) From the inside of the top chassis assembly, remove the

three screws Gattaching the CD mechanism assembly.

Reference:

When attaching the screw G, attach it with the mecha

heat sink.

(2) Remove the mecha heat sink from the CD mechanism as-

sembly, and take out the CD mechanism assembly from

the top chassis.

Reference:

When attaching the mecha heat sink, pass the craws of it

through the slots aof CD mechanism assembly.

Fig.9

Top chassis assembly

Front chassis

Top chassis assembly

Front chassis

Top chassis

Slots a

Mecha heat sink

G GCD mechanism assembly

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3.1.6 Removing the main board

(See Figs.10 and 11)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the back side of the bottom chassis assembly, re-

move the two screws Hattaching the rear bracket to the

bottom chassis assembly. (See Fig.10)

(2) From the top side of the bottom chassis assembly, remove

the two screws Jattaching the main board to the bottom

chassis assembly. (See Fig.11)

(3) Release the stopper of the connector CN701 on the main

board in an upward direction, disconnect the card wire from

the connector CN701. (See Fig.11)

(4) Disconnect the wire from the connector of the front door

mechanism assembly. (See Fig.11)

(5) Disconnect the wire from the connector CN951 on the main

board. (See Fig.11)

Reference:

After connecting the wires, fix the wires with the wire

clamp.

(6) Take out the main board with the rear bracket from the bot-

tom chassis assembly.

Fig.10

Fig.11

Rear bracket

Bottom chassis assembly

Connector

CN701

Stopper

Bottom chassis assembly

CN951 Wire clamps

Main board

Card wire

Front door mechanism assembly

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1-10 (No.MA142)

3.1.7 Removing the rear bracket

(See Fig.12)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink, top chassis assembly and main

board.

(1) From the back side of the main board, remove the wires

from the rear bracket in the direction of the arrow.

(2) Remove the screw K, three screws Land screw Mattach-

ing the rear bracket to the main board.

Reference:

After attaching the rear bracket to the main board, pass

the wires through the wire holder and insert them into the

slots of the rear bracket.

(3) Take out the rear bracket from the main board.

Fig.12

3.1.8 Removing the front door mechanism assembly

(See Fig.13)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink, top chassis assembly and main

board.

(1) From the top side of the bottom chassis assembly, remove

the screw Nattaching the FPC guide to the bottom chassis.

(2) Remove the five screws Pattaching the front door mecha-

nism assembly to the bottom chassis.

Reference:

When attaching the screws Nand P, apply a locking

agent them.

(3) Take out the front door mechanism assembly from the bot-

tom chassis.

Fig.13

Rear bracket

L K

Main board

Wire holder

Slots

Wire (KD-AR960)

Wire

Rear bracket

Bottom chassis

FPC guide

Front door mechanism assembly

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