LG G3100 Bedienungsanleitung

Table Of Contents

1. INTRODUCTION................................…5

1.1 Purpose ............................................….

1.2 Regulatory Information ..........................

1.3 Abbreviations .........................................

2. PERFORMANCE ..............................….9

2.1 H/W Features .....................................…..

2.2 Technical Specification ..........................

3. TECHNICAL BRIEF ............................15

3.1 Transceiver ......…………………………..

3.2 Power Amplifier Module .....................….

3.3 13MHz Clock ……..………………………

3.4 Power Supplies for RF Circuits .........….

3.5 Testing Set-up and Checking Signals.….

3.6 Digital Main Processor ………………..….

3.7 Analog Main Processor ......................….

3.8 Power Management …….....................…

3.9 Memories ……………….....................….

3.10 Display and Interface ........................... .

3.11 Keypad Switches and Scanning ........ .

3.12 Microphone ........................................ .

3.13 Earpiece .....................………………..…

3.14 Hands free / Headset Interface ………..

3.15 Key Back-light Illumination ...............….

3.16 LCD Back-light Illumination ……………

3.17 Speaker & MIDI IC ..........................….

4. TROUBLE SHOOTING ................… 56

4.1 RF Components .............................….

4.2 Rx Trouble ..........................................

4.3 Tx Trouble ..........................................

4.4 Power On Trouble ..........................….

4.5 Charging Trouble ...........................….

4.6 LCD Trouble .......................................

4.7 Receiver Trouble ................................

4.8 Speaker Trouble .................................

4.9 Mic. Trouble ...................................….

4.10 Vibrator Trouble ...............................

4.11 Key Backlight LED Trouble ..............

4.12 SIM Detect Trouble ..........................

4.13 Earphone Trouble ............................

4.14 HFK Trouble ......................................

5. DISASSEMBLY INSTRUCTION .... 105

5.1 Disassembly .......................................

6. SOFTWARE DOWNLOAD ............. 108

6.1 Download Setup ............................…..

6.2 Download Procedure .......................…..

7. BLOCK DIAGRAM ........................... 114

101

105

108

109

-3 -

9. PCB LAYOUT .................................. 119

10. ENGINEERING MODE .................. 121

10.1 BB Test [MENU 1] .....................……

10.2 RF Test [MENU 2] .....................……

10.3 MF Mode [MENU 3] ...................……

10.4 Trace option [MENU 4] ..............……

10.5 Call Timer [MENU 5] ..................……

10.6 Fact. Reset [MENU 6] ................……

10.7 S/W version [MENU 7] ...............……

11. STAND ALONE TEST ................... 125

11.1 What’s the Standalone Test? .....……

11.2 Standalone Test Equipment Setup…

11.3 H/W Test …….............................……

11.4 Tx Stand alone Test Setting …………..

11.5 Rx Stand alone Test Setting …………..

12. AUTO CALIBRATION ................... 132

12.1 Overview ....................................……

12.2 Equipment List ............................……

12.3 Equipment Setup ….........................…

12.4 AGC for RX ..…………………………..

12.5 APC for TX ……..………………………

12.7 How to do calibration .................……

13. EXPLODED VIEW &

REPLACEMENT PART LIST ...…. 137

13.1 Exploded View ...........................……

13.2 Accessory ...............................……..

13.3 Replacement Parts

< Mechanic component > ……………..

Replacement Parts

< Main component > ………………….

121

123

124

125

126

127

128

130

132

133

134

135

137

139

140

142

-4 -

8. CIRCUIT DIAGRAM ......................... 115

8.1 Main Chipset and Memory ..............…..

8.2 Audio Part ………………….........……….

8.3 PMIC, LCD and I/O Connector …......….

8.4 RF Part ………..................................…..

115

116

117

118

9.1 Rear Part …………………...............…..

9.2 Front Part ………………….........……….

119

120

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of G3100.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There may be risks of toll fraud associated

with your telecommunications system. System users are responsible for programming and configuring the

equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune

from the above case but will prevent unauthorized use of common-carrier telecommunication service of

facilities accessed through or connected to it. The manufacturer will not be responsible for any charges

that are resulted from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone service

until repair can be done. A telephone company may temporarily disconnect service as long as repair is

not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of this phone or compatibility with the network,

the telephone company is required to give advanced written notice to the user, allowing the user to take

appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and

may void any remaining warranty.

1. INTRODUCTION

-5 -

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information such as

the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system

boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

1. INTRODUCTION

-6-

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RateBER

BasebandBB

Automatic Power ControlAPC

-7-

1. INTRODUCTION

Wireless Application ProtocolWAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

-8-

1. INTRODUCTION

2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Standard Battery

Li-ion, 850 mAh

Size: 42.08 ×66.65 ×9.3mm

Weight: 29.32g

Stand by Current

Under the minimum current consumption environment

(such as paging period 9), the level of standby current

is below 4mA.

Talk time Up to 3hours (GSM TX Level 7)

Stand by time Up to 200hours (Paging Period: 9, RSSI: -85 dBm)

Charging time 3hours

RX Sensitivity GSM, EGSM: -105dBm, DCS: -105dBm

TX output power GSM, EGSM: 32dBm(Level 5),

DCS: 29dBm(Level 0)

SIM card type 3V Small

Display 128 ×96 pixel 65K Color

Status Indicator

Hard icons. Key Pad;

0 ~ 9, #, *, Up/Down Navigation Key

Confirm Key, Clear Key, Back Key,

Send Key, END/PWR Key

ANT Internal

EAR Phone Jack Yes

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

2. PERFORMANCE

GPRS compatibility Class 10

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

C-Mike Yes

-9-

Travel Adapter Yes

Options Hands-free kit, CLA, Data Kit

Receiver Yes

2.2 Technical Specification

Item Description Specification

1Frequency Band

GSM

TX: 890 + n ×0.2 MHz

RX: 935 + n ×0.2 MHz (n=1~124)

EGSM

TX: 890 + (n-1024) ×0.2 MHz

RX: 935 + (n-1024) ×0.2 MHz (n=975~1024)

DCS

TX: 1710 + (n-512) ×0.2 MHz

RX: 1805 + (n-512) ×0.2 MHz (n=512~885)

2Phase Error RMS < 5 degrees

Peak < 20 degrees

3Frequency Error < 0.1 ppm

4Power Level

Level Power Toler. Level Power Toler.

6 31dBm ±3dB 14 15dBm ±3dB

7 29dBm ±3dB 15 13dBm ±3dB

8 27dBm ±3dB 16 11dBm ±5dB

9 25dBm ±3dB 17 9dBm ±5dB

10 23dBm ±3dB 18 7dBm ±5dB

11 21dBm ±3dB 19 5dBm ±5dB

12 19dBm ±3dB

GSM, EGSM

5 33dBm ±2dB 13 17dBm ±3dB

Level Power Toler. Level Power Toler.

1 28dBm ±3dB 9 12dBm ±4dB

2 26dBm ±3dB 10 10dBm ±4dB

3 24dBm ±3dB 11 8dBm ±4dB

4 22dBm ±3dB 12 6dBm ±4dB

5 20dBm ±3dB 13 4dBm ±4dB

6 18dBm ±3dB 14 2dBm ±5dB

7 16dBm ±3dB 15 0dBm ±5dB

DCS

0 30dBm ±2dB 8 14dBm ±3dB

- 10 -

2. PERFORMANCE

5Output RF Spectrum

(due to modulation)

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

6,000 -71

GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

DCS

Output RF Spectrum

(due to switching

transient)

GSM, EGSM

Offset from Carrier (kHz). Max. dBm

400 -19

600 -21

1,200 -21

1,800 -24

- 11 -

Item Description Specification

2. PERFORMANCE

Item Description Specification

Output RF Spectrum

(due to switching

transient)

Offset from Carrier (kHz). Max. dBm

400 -22

600 -24

1,200 -24

1,800 -27

7Spurious Emissions Conduction, Radiation

8Bit Error Rate

GSM, EGSM

BER (Class II) < 2.439% @-102 dBm

DCS

BER (Class II) < 2.439% @-100 dBm

9RX Level Report Accuracy ±3 dB

10 SLR 8±3 dB

11 Sending Response

300 -12

1,000 -6

2,000 -6

3,000 -6

Frequency (Hz) Max.(dB) Min.(dB)

100 -

200 -

4,000 -

3,400 -9

-12

12 RLR 2±3 dB

GSM

- 12 -

2. PERFORMANCE

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