LG KG195 Bedienungsanleitung

Date: September, 2007 / Issue 1.0

Service Manual Model : KG195

Service Manual

KG195

Internal Use Only

- 1 -

LGE Internal Use Only

Only for training and service purposes

AMENDMENT RECORD SHEET

For details of previous history refer to archival documents.

KG195 SERVICE MANUAL V1.5

AMENDMENT RECORD

New Issue Number - Date Changes This Issue, Page and Description Remarks

Draft 1.00 20.07.2007 All for Publication First draft Issue

Issue Number Date

Draft 1.00 20.07.2007

- 2 -

LGE Internal Use Only

Only for training and service purposes

- 3 -

LGE Internal Use Only

Only for training and service purposes

1. Introduction ..................................... 5

2. Precautions for Repair Work ......... 7

3. UNIT SPECIFICATION ................... 12

4. Circuit Description.........................23

4.1 LOGIC BLOCK DIAGRAM.....................24

4.2 LOGIC....................................................25

4.2.1 INTRODUCTION ............................25

4.2.2 SYSTEM BLOCK DIAGRAM ..........25

4.2.3 MEMORY SUBSYSTEM ................26

4.2.4 MTK6226 BASE BAND CHIP .........28

4.2.5 PMU IC MT 6305 ............................29

4.2.6 KEY SWITCHES.............................34

4.2.7 VIBRATOR .....................................35

4.2.8 KEY BACKLIGHT LED ...................35

4.2.9 BATTERY CHARGING...................36

4.2.10 REAL-TIME CLOCK (RTC) ..........39

4.2.11 EXTERNAL INTERFACE .............40

4.2.12 SIM INTERFACE ..........................41

4.2.13 SIGNAL CONTROL PATH FOR

BACKLIGHT LED, CAMERA FLASH

LED AND INDICATOR LED..........42

4.2.14 DISPLAY SYSTEM.......................44

4.2.15 CAMERA.......................................46

4.2.16 AUDIO SUBSYSTEM ...................47

4.2.17 FM interface..................................50

4.2.18 Bluetooth interface........................51

4.2.19 RF Sub-systems ...........................52

5. Servicing........................................ 56

5.1 STRUCTURE.........................................57

5.2 ACCESSORIES.....................................61

5.3 EXPLODED DIAGRAM..........................63

5.4 DISASSEMBLY......................................66

5.5 SOLDERING..........................................70

6. Repairing ....................................... 72

6.1 TESTING ...............................................73

6.2 TROUBLE SHOOTING..........................85

6.3 Circuit Diagrams ....................................85

7. Device Information...................... 109

8. ATE TOOL .....................................128

9. Swoftware Download

Procedure .....................................176

9.1 Install Leo Download tool.....................176

9.2 Connect Download cable with

computer and mobile ...........................179

9.3 Install SW.............................................179

Table of Contents

- 4 -

LGE Internal Use Only

Only for training and service purposes

Table Of Contents

- 5 -

LGE Internal Use Only

Only for training and service purposes

SECTION 1

Introduction

- 6 -

LGE Internal Use Only

Only for training and service purposes

1. Introduction

This is the Electronic Service Manual for KG195 Triple Band GSM Digital Cellular Telephone from LG.

It contains specific information on repair and test procedures.

For details of user functions, general operation and installation, please refer to the User Guide.

The Service Manual is set out in the following sections.

1. Precautions for Repair Work: provides general guidelines for undertaking safe and efficient repair

work.

2. Unit Specification: provides the technical specifications for KG195 Triple Band GSM Digital

Cellular Telephone.

3. Introduction of Service Level:

a) Service Level 1: describes definition of Service Level 1, equipment and tools required for this

level.

b) Service Level 2: describes definition, equipment and tools required for Service Level 2.

4. Circuit Description: provides functional details of the circuits, block diagrams and component

purpose descriptions.

5. Servicing: defines the jigs, fixtures and test configurations required for servicing the product; and

describes the processes of assembly and disassembly.

6. Troubleshooting: provides an aid to fault finding the product. Includes, using the signal levels and

plots at various parts of the circuit.

7. Device Information: provides functional information and pin-outs of most of the semiconductor

devices within the HHP.

8. Glossary: terms used in this GSM and this manual.

1. Introduction

- 7 -

LGE Internal Use Only

Only for training and service purposes

SECTION 2

Precautions

for Repair Work

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2. Precautions for Repair Work

AC Power Cord:

Care must be taken not to damage the AC power cord as fire or electric shock may result.

Battery Pack:

Only use the specified batteries and chargers with this equipment.

Do not short the battery terminals together.

Keep the battery pack away from fire and sources of ignition.

Remember to recharge the battery pack after each use.

Before Powering up the Equipment:

• Only switch on the telephone’s power once the test or installation set-up is complete.

• Switching on at the wrong time may result in electric shock or damage to system components.

• Always ensure that the power is switched off before making connections / disconnection’s.

• It is important to check that the correct DC voltage is applied to the equipment to prevent electrical

damage.

Component Polarity:

Always check the polarity of connections and components before soldering.

Particular attention must be paid to IC.s, diodes, transistors, capacitors and any other semiconductor

device that is polarity dependent.

Electrostatic Damage (ESD):

Semiconductor devices are easily damaged by electrostatic discharge. Many of the procedures

detailed in this manual involve disassembly of the equipment and therefore handling of the printed

circuit boards.

To protect these devices from ESD a wrist strap connected to ground must be worn.

In addition to this the work surface must be covered with an anti-electrostatic mat, which should also

be grounded.

If printed circuit boards are to be stored without being re-assembled into their equipment, then they

must be kept in an anti-electrostatic bag.

2. Precautions for Repair Work

LGE Internal Use Only

Only for training and service purposes

Important

CAUTION:

Please read the following cautions, notes and warnings before progressing through

this manual or undertaking any repair action.

Remember: SAFETY FIRST!

- 9 -

2. Precautions for Repair Work

Electrostatic Damage (ESD):

Semiconductor devices are easily damaged by electrostatic discharge. Many of the procedures

detailed in this manual involve disassembly of the equipment and therefore handling of the printed

circuit boards.

To protect these devices from ESD a wrist strap connected to ground must be worn.

In addition to this the work surface must be covered with an anti-electrostatic mat, which should also

be grounded.

If printed circuit boards are to be stored without being re-assembled into their equipment, then they

must be kept in an anti-electrostatic bag.

Grounding:

Each piece of test equipment should be electrically grounded. A third (grounding) pin is provided as a

safety feature. Ensure that the electrical outlet also contains this feature.

Cosmetic Protection during Repair Work:

Always ensure that the working surface is kept clean and free from abrasive materials.

The LCD is very susceptible to scratches and damage. It should be covered with clear adhesive vinyl

while the equipment is disassembled.

Storage of Faulty Components:

Any components that are replaced due to failure should be kept safely in an antielectrostatic container.

NEC’s Quality or Research & Development Departments may require them to make quality and

reliability investigations.

No Fault Found Equipment:

In some cases the reported symptom may not be apparent. You may subject the equipment to a

controlled amount of stress, vibration and temperature variation to see if the fault occurs.

Care should be taken not to apply excessive stress or vibration or extreme temperature variations as

further faults may develop.

Soldering and Disordering:

The solder used is only Pb-free.

Fast, accurate and high quality soldering is required to minimise the risk of heat damage to the

electronic components. It is necessary to adjust the temperature of soldering tip to 330 degrees or

less. The soldering tip should not be in contact with components or PCB tracks for longer than 4

seconds (average). This time depends on temperature conditions of parts.

Heat the pad on the PCB and the lead, quickly apply solder, remove heat and cool. After soldering is

complete, ensure that all solder joints are of good quality - no dry joints, solder bridges, cracks or

excess solder. The majority of chip components are machine mounted using solder paste. Removal of

the solder is not sufficient for chip component removal. Each solder point must be heated

simultaneously and quickly (to prevent component and PCB damage). When the solder has melted,

remove the component with tweezers.

LGE Internal Use Only

Only for training and service purposes

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