Murata GJM0225C1E6R3DB01 Series Bedienungsanleitung

GJM0225C1E6R3DB01_ (01005, C0G:EIA, 6.3pF, DC25V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Mar.10,2017,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

0.2±0.02

-55 to 125 °C

0±30 ppm/°C

25 to 125 °C

(25 °C)

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

0.07 to 0.14

(5) Nominal

Capacitance

mark

(4)

Rated

Voltage

Packaging Unit

DC 25 V

Temp. Range

(Ref.Temp.)

(8) Packaging

Only Reflow Soldering

0.13 min.

(1)-1 L

0.4±0.02

(1)-2 W

0.2±0.02

This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment.

This product is applied for Only Reflow Soldering.

(2) T

f180mm Reel

EMBOSSED W4P1

40000 pcs./Reel

Chip Monolithic Ceramic Capacitor High-Q Type for General

Specifications and Test

Methods

(Operating

Temp. Range)

Temp. coeff

or　Cap. Change

±0.5 pF

(6)

Capacitance

Tolerance

6.3 pF

(1)L/W

Dimensions (2)T

Dimensions (3)Temperature

Characteristics (4)Rated

Voltage (5)Nominal

Capacitance (6)Capacitance

Tolerance (8)Packaging Code



Code

GJM 02 25C 1E 6R3 D B01 L

GJM0225C1E6R3DB01-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage

which may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage,

VP-P or VO-P, whichever is larger, should be maintained

within the rated voltage range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.

4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations

Test Voltage : 300% of the rated voltage

Applied Time : 1s to 5 s

Charge/discharge current : 50mA max.

5 Insulation Resistance(I.R.)

C≦ Measurement Point 　　 : Between the terminations

C＞ Measurement Voltage : DC Rated Voltage

C:Nominal Capacitance Charging Time : 2 min

Charge/discharge current : 50mA max.

Measurement Temperature : Room Temperature

6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature

30pF and over:Q≧1000

30pF and below:Q≧400+20C

C:Nominal Capacitance(pF)

8 Temperature Characteristics

Nominal values of the temperature coefficient is shown in Rated value.

The capacitance change should be measured after 5 minutes

of Capacitance

But,the Capacitance Change under 20℃is shown in Table A. at each specified temp. stage.

Capacitance value as a reference is the value in step 3.

Capacitance Drift

Within +/-0.2% or +/-0.05pF The capacitance drift is calculated by dividing the differences

(Whichever is larger.) between the maximum and minimum measured values in the

step 1,3 and 5 by the cap. value in step 3.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with

the capacitor side.

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Q Within the specified initial value. Total amplitude : 1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-5% or +/-0.5pF Pressurization method : Shown in Fig.2

Change (Whichever is larger) Flexure　　　　: 1mm

Holding Time : 5+/-1s

Soldering Method : Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method

Flux Solution of rosin ethanol 25(mass)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time :

2+/-0.5s

■Specifications and Test Methods

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GJM02 1

GJM03 2

GJM15 5

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

Capacitance

Frequency

Voltage

C≦1000pF

1.0+/-0.1MHz

0.5 to 5.0Vrms

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

JEMCGS-0004M 2

Resistance to Appearance No defects or abnormalities. <GJM02 size only>

Soldering Heat Test Method : Reflow soldering (hot plate)

Capacitance Within +/-2.5% or +/- 0.25pF Solder : Sn-3.0Ag-0.5Cu

Change (Whichever is larger) Solder Temp. : 270+/-5℃

Reflow Time : 10+/-0.5s

Q Within the specified initial value. Test Substrate : Glass epoxy PCB

Exposure Time : 24+/-2h

I.R. Within the specified initial value. Preheat :

120℃to 150℃for 1 min

Voltage proof No defects. <GJM03/GJM15 size>

Test Method : Solder bath method

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Immersion time :

10+/-0.5s

Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change

Capacitance Within +/-2.5% or +/- 0.25pF Perform the five cycles according to the four heat treatments

Change (Whichever is larger) shown in the following table.

Q Within the specified initial value.

I.R. Within the specified initial value.

Voltage proof No defects.

Exposure Time : 24+/-2h

High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

High Humidity Capacitance Within +/-7.5% or +/-0.75pF

Test Temperature :

40+/-2℃

(Steady) Change (Whichever is larger)

Test Humidity :

90%RH to 95%RH

Test Time :

500+/-12h

30pF and over : Q≧200 Applied Voltage : DC Rated Voltage

30pF and below : Q≧100+10C/3 Charge/discharge current : 50mA max.

Exposure Time :

24+/-2h

C:Nominal Capacitance(pF)

I.R. 

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃

Change (Whichever is larger)

Test Time :

1000+/-12h

Applied Voltage : 200% of the rated voltage

30pF and over　 : Q≧350 Charge/discharge current : 50mA max.

10pF and over , 30pF and below : Q≧275+5C/2 Exposure Time : 24+/-2h

10pF and below : Q≧200+10C

C:Nominal Capacitance (pF)

I.R. 

17 ESR

0.2pF ≦C ≦

Measurement Frequency :

1.0+/-0.1GHz

(GJM02)

1pF < C ≦ Measurement Temperature : Room Temp.

2pF < C ≦ Measurement Instrument : Equivalent to E4991A

5pF < C ≦

10pF < C ≦

C:Nominal Capacitance (pF)

ESR

0.1pF ≦C ≦

Measurement Frequency :

1.0+/-0.2GHz

(GJM03/GJM15)

1pF < C ≦ Measurement Temperature : Room Temp.

5pF < C ≦ Measurement Instrument : Equivalent to BOONTON Model 34A

C:Nominal Capacitance (pF)

10pF < C ≦

Measurement Frequency :

500+/-50MHz

Measurement Temperature : Room Temp.

Measurement Instrument : Equivalent to HP8753B

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Step

Temp.(C)

Time (min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp.

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-0004M 3

Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness :0.8mm

　　　　　　　　　　　: Solder resist

(Coat with heat resistant resin for solder)

for GJM02 for GJM03/15

　Copper foil thickness : 0.018mm 　Copper foil thickness : 0.035mm

　　　　　　　　　　Fig.1 (in mm)

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Land Dimensions

Fig.3

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GJM02

0.2

0.56

0.23

GJM03

0.3

0.9

0.3

GJM15

0.4

1.5

0.5

Table A

Char.

Capacitance Change from Value at Reference temp. (%)

-55℃

-30

-25℃

-10℃

Max.

Min.

Max.

Min.

Max.

Min.

Max.

Min.

0.54

-0.23

0.33

-0.14

0.22

-0.09

0.82

-0.45

0.49

-0.27

0.33

-0.18

1.37

-0.90

0.82

-0.54

0.55

-0.36

2.56

-1.88

1.54

-1.13

1.02

-0.75

0.58

-0.24

0.40

-0.17

0.25

-0.11

0.87

-0.48

0.59

-0.33

0.38

-0.21

Solder Resist

Chip Capacitor

Land

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

Type

Dimension (mm)

GJM02

0.2

0.56

0.23

GJM03

0.3

0.9

0.3

GJM15

0.4

1.5

0.5

JEMCGS-0004M 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F)

1.1 Minimum Quantity(pcs./reel)



Plastic Tape Paper Tape

Code:D/E Code:W Code:L Code:J/F

GJM02

40000 (W4P1)

GJM03

15000(W8P2) 30000(W8P1) 50000(W8P2)

GJM15 10000(W8P2) 20000(W8P1) 50000(W8P2)

1.2 Dimensions of Tape (in mm)

(1)GJM02 <Plastic Tape W4P1 CODE:L>

L W T

GJM02 2 0.4±0.02 0.2±0.02 0.2±0.02 0.23 0.43 0.5 max.

*3 Nominal value

(2)GJM03/GJM15 <Paper Tape W8P2 CODE:D/E/J/F> (in mm)

L W T

GJM03 3 0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67 0.5 max.

GJM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

Type

Dimensions(Chip)

A *3

B *3

Type

Dimensions(Chip)

A *3

Package

GJM Type

Type



Paper Tape

*1,*2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

JEMCGP-01914B 5

　(3)GJM03/GJM15 <Paper Tape W8P2 CODE:W> (in mm)

L W T

GJM03 3 0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67 0.5 max.

GJM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

Package

GJM Type

Type

Dimensions(Chip)

A *3

B *3

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

JEMCGP-01914B 6

Package

GJM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GJM02

8.0 max.

5±1.5

GJM03/GJM15

16.5 max.

10±1.5

-3.0



 min.



2.0±0.5

Chip

(in mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01914B 7

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in mm)

1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.

There are possibly to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.

* GJM02/GJM03:0.05N to 0.5N

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

Package

GJM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

Tail vacant Section

Chip-mounting Unit

Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

165～180°

Top tape

JEMCGP-01914B 8

Caution

■Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

　for the prevention of defects which might directly cause damage to the third party's life, body or property.

　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

　　　⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment

　　　⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.

■Storage and Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:

Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance.

Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,

as prolonged storage may cause oxidation of the terminations (outer electrodes).

(2) Please confirm solderability before using after six months.

Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen

sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes. The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and

carefully confirm the various characteristics in actual use conditions and the actual system.

[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]



-20

-10

-15

-5

Temperature (C)

-75 -50 -25 025 50 75 100 125 150

Capacitance Change(%)

-20

-10

-15

-5

Temperature (C)

-75 -50 -25 025 50 75 100

Capacitance Change(%)

JEMCGC-2703M 9

2.Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC capacitor

DC Voltage DC Voltage+AC AC Voltage Pulse Voltage

(E：Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4.Type of Applied Voltage and Self-heating Temperature

1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the

continuous application of an AC voltage or pulse voltage.

When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current

or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits

of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is

used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

1-1. The load should be contained to the level

　such that when measuring at atmospheric

　　temperature of 25°C, the product's self-heating

　　 remains below 20°C and the surface

temperature of the capacitor in the actual circuit

remains within the maximum operating

temperature.

Caution

100

0 1 2 3

Current (Ar.m.s.) 4 5 6

TemperatureRise (C)

[Example of Temperature Rise (Heat Generation) in Chip

Monolithic Ceramic Capacitors in Contrast to Ripple Current]

Sample:R(R1) characteristics 10 Rated voltage: DC10V

Ripple Current

100kHz

500kHz

1MHz

JEMCGC-2703M 10

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