Murata GRM153D80J105ME95 Series Bedienungsanleitung

GRM153D80J105ME95_ (0402, X6T:EIA, 1uF, DC6.3V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Feb.28,2017,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

(3) Temperature Characteristics

(Public STD Code):X6T(EIA)

0.1 to 0.35

(5) Nominal

Capacitance

mark

(4)

Rated

Voltage

Packaging Unit

DC 6.3 V

Temp. Range

(Ref.Temp.)

(8) Packaging

-33 to 22 %

-55 to 105 °C

(25 °C)

0.3 min.

(1)-1 L

1.0±0.05

(1)-2 W

0.5±0.05

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

Chip Monolithic Ceramic Capacitor for General

Specifications and Test

Methods

(Operating

Temp. Range)

Temp. coeff

or　Cap. Change

±20 %

(6)

Capacitance

Tolerance

1 uF

0.3±0.03

-55 to 105 °C

f180mm Reel

PAPER W8P2

10000 pcs./Reel

f330mm Reel

PAPER W8P2

50000 pcs./Reel

(1)L/W

Dimensions (2)T

Dimensions (3)Temperature

Characteristics (4)Rated

Voltage (5)Nominal

Capacitance (6)Capacitance

Tolerance (8)Packaging Code



Code

GRM 15 3D8 0J 105 M E95 D

GRM153D80J105ME95-01 1

■Specifications and Test Methods

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated voltage

range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities.

Measurement Point　　 :

Between the terminations

Test Voltage 　　　　　　 :

250% of the rated voltage

Applied Time :

1 to 5 s

Charge/discharge current :

50mA max.

5 Insulation Resistance(I.R.)

∙F (Whichever is smaller) Measurement Point 　　: Between the terminations

Measurement Voltage :

DC Rated Voltage

Charging Time :

1 min

Charge/discharge current :

50mA max.

Measurement Temperature :

Room Temperature

6 Capacitance Shown in Rated value.

Measurement Temperature :

Room Temperature

7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.

D8,GRM31CR60J107 : 0.15 max

GRM31CR71E106 : 0.125 max

*1 For items listed in Table 1 on the left, the capacitance should

be measured using a voltage of 0.5+/-0.1Vrms instead of

1.0+/-0.2Vrms.

*2 For item GRM188R70J105, the capacitance should be measured

using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.

Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.

Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.

of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be

C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of

C7 : Within+/-22% (-55°C to +125°C) each temp. stage.

C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.

E7 : Within +22/-56% (-55°C to +125°C)

D7 : Within +22/-33% (-55°C to +125°C) · Measurement Voltage : 0.20+/-0.05Vrms

D8 : Within +22/-33% (-55°C to +105°C)

50% of B1: Within +10/-30%

the rated R1: Within +15/-40%

voltage

･Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with the

capacitor side.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temperature(C)

Applying Voltage(VDC)

Reference Temp.+/-2

No bias

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp. +/-3

Reference Temp. +/-2

50% of

the rated voltage

(For B1,R1)

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp.+/-3

*Table 1

GRM033 B3/R6 1A 123 to 823

GRM033 B3/R6 1A104

GRM033 R6 1A224

GRM153 B3/R6 1A105

GRM155 B3/R6 1A124 to 105

GRM155 B3/R6 1A225

GRM185 B3/R6 1C/1A105

GRM185 C8/D7 1A105

GRM188 B3/R6 1C/1A225

GRM188 R7/C8/D7 1A 225

GRM188 B3/R6 1A335

GRM219 B3/R6 1C/1A475

GRM219 C8 1A 475

GRM219 B3/R6 1A106

GRM21B B3/R6 1C/1A 106

GRM21B R7/C8 1A 106

GRM319 B3/R6 1C/1A106

Capacitance

Frequency

Voltage

*1 C≦

(10V min.)

1.0+/-0.1kHz

1.0+/-0.2Vrms

*2 C≦

(6.3V max.)

1.0+/-0.1kHz

0.5+/-0.1Vrms

C＞

120+/-24Hz

0.5+/-0.1Vrms

JEMCGS-01735D 2

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

Kind of Vibration :

A simple harmonic motion

D.F. Within the specified initial value. 10Hz to 55Hz to 10Hz (1min)

Total amplitude :

1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-10% Pressurization method : Shown in Fig.2

Change Flexure　　　　: 1mm

Holding Time 　 :

5+/-1s

Soldering Method :

Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and

Test Method :

Solder bath method

continuously. Flux Solution of rosin ethanol 25(wt)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time

2+/-0.5s

Resistance Appearance No defects or abnormalities. <GRM03 size min.>

to Test Method : Solder bath method

Soldering Solder : Sn-3.0Ag-0.5Cu

Heat Solder Temp. :

270+/-5℃

Immersion time

10+/-0.5s

Capacitance Within +/-15% Exposure Time : 24+/-2h

Change Preheat : GRM31 size max.: 120℃to 150℃for 1 min

　GRM32 size　　　 : 100℃to 120℃for 1 min

and 170℃to 200℃for 1 min

· Initial measurement

D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Test Method : Reflow soldering (hot plate)

I.R. Within the specified initial value. Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Voltage proof No defects. Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

· Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Perform the five cycles according to the four heat treatments

shown in the following table.

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5%

Change E7 : Within +/-30%

D.F. Within the specified initial value.

I.R. Within the specified initial value. Exposure Time : 24+/-2h

· Initial measurement

Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

·GRM188B30J106M Measurement after test:

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Test Temperature :

40+/-2℃

High

Test Humidity :

90%RH to 95%RH

Humidity Capacitance Within +/-12.5%

Test Time :

500+/-12h

(Steady) Change

Applied Voltage :

DC Rated Voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max.

· Initial measurement

I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

· Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Step

Temp.(C)

Time

(min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-01735D 3

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Test Temperature :

Max. Operating Temp. +/-3℃

Capacitance Within +/-12.5%

Test Time :

1000+/-12h

Change

Applied Voltage :

100% of the rated voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

I.R.  · Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Recommended derating conditions on voltage and temperature

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

These Part Numbers are designed for use in the circuits where

continuous applied voltage to the capacitor is derated than rated

voltage, and guarantee Durability Test with 100% × rated voltage

as testing voltage at the maximumoperating temperature.

The voltage and temperature derating conditions on the left are

recommended for use to ensure the same reliability level as

normal specification.

JEMCGS-01735D 4

Test method : Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

　Fig.3

Solder Resist

Chip Capacitor

Land

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

JEMCGS-01735D 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

1.2 Dimensions of Tape

(1)GRM01/GRM02 (W4P1 CODE:L) (in mm)

Package

GRM Type

*3 Nominal value

0.2±0.05

0.26

0.46

0.4 max.

GRM02

0.4±0.02

0.2±0.02

0.23

0.43

0.5 max.

0.4±0.05

GRM01

0.25±0.013

0.125±0.013

0.145

0.27

Type

Dimensions(Chip)

A*3

B *3

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25

5(LWTDimensions Tolerance:±0.05)

GRMMD

Type

5(LWTDimensions Tolerance:±0.07)

10000(W8P2)

50000(W8P2)

300

1500

5000

N/R/D

1000

4000

GRM55

1000

500

2000

500

1500

5000

N/R/D

1000

4000

GRM43

1000

500

R/D/E

1000

4000

2000

6000

3000

10000

2000

8000

6000

GRM32

4000

10000

A/M

3000

10000

2000

10000

GRM31

6/9

4000

10000

B/M/X

4000

3000

10000

GRM21

4000

10000

A/B

3000

GRM18/GRMJN

4000

10000

5(LW Dimensions Tolerance:±0.2

and TDimensions:0.5 +0/-0.1)

10000(W8P2)

50000(W8P2)

5 (LW Dimensions Tolerance:±0.1min.

and T Dimensions Tolerance:±0.05)

10000(W8P2)

50000(W8P2)

10000(W8P2)

20000(W8P1)

50000(W8P2)

5(LWTDimensions Tolerance:±0.1min.)

10000(W8P2)

40000(W8P2)

50000(W8P2)

3/X

10000(W8P2)

50000(W8P2)

10000(W8P2)

50000(W8P2)

GRM15

20000(W8P2)

50000(W8P2)

15000(W8P2)

30000(W8P1)

50000(W8P2)

15000(W8P2)

50000(W8P2)

GRM03

15000(W8P2)

GRM02

40000(W4P1)

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

GRM01

50000(W4P1)





Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

JEMCGP-01796G 6

　(2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F) (in mm)

L W

GRMMD

X 0.5±0.025 0.25±0.025 0.25±0.025 0.32 0.58

0.6±0.03 0.3±0.03 0.2 +0.02/-0.04 0.37 0.67

0.6±0.09 0.3±0.09 0.2±0.02 0.42 0.72

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05 *3 Nominal value

(3)GRM033/GRM155(W8P1 CODE:W) (in mm)

L W

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

Type

Dimensions(Chip)

A *3

B *3

GRM03

0.5 max.

0.65

1.15

1.0±0.2

0.5±0.2

0.78

1.29

1.0±0.05

0.5±0.05

0.65

1.15

0.3±0.03

0.5 max.

GRM03

0.6±0.09

0.3±0.09

0.44

0.74

0.8 max.

GRM15

Package

GRM Type

Type

Dimensions(Chip)

A *3

B *3

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

JEMCGP-01796G 7

　(4)GRM18/GRMJN/GRM21/GRM31/GRM32 (in mm)

L W

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

50.5±0.05

0.6 +0.05/-0.1

0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

GRMJN 7 1.8±0.1 1.0±0.1 0.7±0.1 1.20±0.10 2.10±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

2.5±0.2

2.5±0.3 2.5±0.3

Plastic Tape

2.5 max.

3.0 max.

3.7 max.

GRM32

3.2±0.3

2.5±0.2

2.80±0.20

3.50±0.20

1.7 max.

Paper Tape

0.85±0.1

3.2±0.15

1.6±0.15

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

GRM31

3.2±0.15

1.6±0.15

2.00±0.20

3.60±0.20

1.15 max.

3.2±0.2

1.6±0.2

2.5 max.

2.0±0.2

1.25±0.2

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

1.05±0.10

1.85±0.10

GRM21

2.0±0.1

1.25±0.1

1.55±0.15

2.30±0.15

0.85±0.1

GRM18

0.5 +0/-0.1

0.8 max.

Paper Tape

1.6±0.2

0.8±0.2

1.10±0.10

2.00±0.10

1.15 max.

Package

GRM Type

Type

Dimensions(Chip)

Dimensions

of Tape

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796G 8

(5)GRM43/GRM55 (in mm)

L W

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

GRM55

5.7±0.4

5.0±0.4

5.2

6.1

2.5 max.

3.7 max.

GRM43

4.5±0.4

3.2±0.3

3.6

4.9

2.5 max.

3.7 max.

Package

GRM Type

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.0±0.1

4.0±0.1

Ｂ

*：2.0±0.1

0.3±0.1

JEMCGP-01796G 9

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRM01/GRM02

8.0 max.

5±1.5

GRMMD/GRM03/GRM15/

GRM18/GRMJN/GRM21/

GRM31/GRM32

16.5 max.

10±1.5

GRM43/GRM55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796G 10

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