Murata GRM1555C1H560FA01 Series Bedienungsanleitung

GRM1555C1H560FA01_ (0402, C0G:EIA, 56pF, DC50V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Feb.9,2017,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

0.15 to 0.35

(5) Nominal

Capacitance

mark

(4)

Rated

Voltage

Packaging Unit

DC 50 V

Temp. Range

(Ref.Temp.)

(8) Packaging

0±30 ppm/°C

25 to 125 °C

(25 °C)

0.3 min.

(1)-1 L

1.0±0.05

(1)-2 W

0.5±0.05

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

Chip Monolithic Ceramic Capacitor for General

Specifications and Test

Methods

(Operating

Temp. Range)

Temp. coeff

or　Cap. Change

±1 %

(6)

Capacitance

Tolerance

56 pF

0.5±0.05

-55 to 125 °C

f330mm Reel

PAPER W8P2

50000 pcs./Reel

f180mm Reel

PAPER W8P2

10000 pcs./Reel

f180mm Reel

PAPER W8P1

20000 pcs./Reel

(1)L/W

Dimensions (2)T

Dimensions (3)Temperature

Characteristics (4)Rated

Voltage (5)Nominal

Capacitance (6)Capacitance

Tolerance (8)Packaging Code



Code

GRM 15 55C 1H 560 F A01 D

GRM1555C1H560FA01-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage

which may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage,

VP-P or VO-P, whichever is larger, should be maintained

within the rated voltage range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations

Test Voltage : 300% of the rated voltage

(Temperature compensating type)

250% of the rated voltage

(High dielectric constant type)

Applied Time : 1s to 5 s

Charge/discharge current : 50mA max.

5 Insulation Resistance(I.R.)

C≦ Measurement Point 　　 : Between the terminations

C＞ Measurement Voltage : DC Rated Voltage

C:Nominal Capacitance Charging Time : 2 min

Charge/discharge current : 50mA max.

Measurement Temperature : Room Temperature

6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature

7 Q

30pF and over:Q≧1000

30pF and below:Q≧400+20C

C:Nominal Capacitance(pF)

Temperature No bias

Nominal values of the temperature coefficient is shown in Rated value.

The capacitance change should be measured after 5 min

Characteristics at each specified temp. stage.

of Capacitance

But,the Capacitance Change under 25℃is shown in Table A. In case of applying voltage, the capacitance change should be

measured after 1 min with applying voltage in equilibration of

Capacitance Drift each temp. stage.

Within +/-0.2% or +/-0.05pF Capacitance value as a reference is the value in step 3.

(Whichever is larger.) The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in the

step 1,3 and 5 by the cap. value in step 3.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with

the capacitor side.

■Specifications and Test Methods

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

Capacitance

Frequency

Voltage

C≦1000pF

1.0+/-0.1MHz

0.5 to 5.0Vrms

C＞1000pF

1.0+/-0.1kHz

1.0+/-0.2Vrms

JEMCGS-0015S 2

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

Q Within the specified initial value. Kind of Vibration : A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude : 1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-5% or +/-0.5pF

Change (Whichever is larger) Pressurization method : Shown in Fig.2

Flexure　　　　: 1mm

Holding Time : 5+/-1s

Soldering Method : Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method

Flux Solution of rosin ethanol 25(wt)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time :

2+/-0.5s

Resistance to Appearance No defects or abnormalities. <GRM03 size min.>

Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Test Method : Solder bath method

Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Q Within the specified initial value.

Immersion time :

10+/-0.5s

Exposure Time : 24+/-2h

I.R. Within the specified initial value. Preheat :

GRM31 size max.: 120℃to 150℃for 1 min

　GRM32 size 　　 : 100℃to 120℃for 1 min

Voltage proof No defects.

and 170℃to 200℃for 1 min

Test Method : Reflow soldering (hot plate)

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF

Change (Whichever is larger) Perform the five cycles according to the four heat treatments

shown in the following table.

Q Within the specified initial value.

I.R. Within the specified initial value.

Voltage proof No defects.

Exposure Time : 24+/-2h

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Step

Temp.(C)

Time (min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp.

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-0015S 3

High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

High Humidity Capacitance Within +/-7.5% or +/-0.75pF

Test Temperature :

40+/-2℃

(Steady) Change (Whichever is larger)

Test Humidity :

90%RH to 95%RH

Test Time :

500+/-12h

Q 30pF and over:Q≧200 Applied Voltage : DC Rated Voltage

30pF and below :Q≧100+10C/3 Charge/discharge current : 50mA max.

Exposure Time :

24+/-2h

C:Nominal Capacitance(pF)

I.R. 

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃

Change (Whichever is larger)

Test Time :

1000+/-12h

Applied Voltage : 200% of the rated voltage

Q 30pF and over:Q≧350 Charge/discharge current : 50mA max.

10pF and over Exposure Time : 24+/-2h

30pF and below : Q≧275+5C/2

10pF and below : Q≧200+10C

C:Nominal Capacitance (pF)

I.R. 

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Table A

Char.

Capacitance Change from 25C (%)

-55C

-30C

-10C

Max.

Min.

Max.

Min.

Max.

Min.

0.58

-0.24

0.40

-0.17

0.25

-0.11

0.87

-0.48

0.59

-0.33

0.38

-0.21

2.33

0.72

1.61

0.50

1.02

0.32

3.02

1.28

2.08

0.88

1.32

0.56

4.09

2.16

2.81

1.49

1.79

0.95

5.46

3.28

3.75

2.26

2.39

1.44

8.78

5.04

6.04

3.47

3.84

2.21

JEMCGS-0015S 4

Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

　　　　　　　　　　　: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Land Dimensions

Fig.3

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Solder Resist

ChipCapacitor

Land

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

JEMCGS-0015S 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

1.2 Dimensions of Tape

(1)GRM01/GRM02 (W4P1 CODE:L) (in:mm)

Package

GRM Type

*3 Nominal value

0.2±0.05

0.26

0.46

0.4 max.

GRM02

0.4±0.02

0.2±0.02

0.23

0.43

0.5 max.

0.4±0.05

GRM01

0.25±0.013

0.125±0.013

0.145

0.27

Type

Dimensions(Chip)

A*3

B *3

Type

GRMMD

5(LWTDimensions Tolerance:±0.05)

180mm reel

330mm reel

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

GRM01

50000(W4P1)

GRM02

40000(W4P1)

15000(W8P2)

50000(W8P2)

GRM03

15000(W8P2)

50000(W8P2)

15000(W8P2)

30000(W8P1)

50000(W8P2)

10000(W8P2)

50000(W8P2)

GRM15

20000(W8P2)

50000(W8P2)

3/X

10000(W8P2)

50000(W8P2)

10000(W8P2)

20000(W8P1)

50000(W8P2)

5(LWTDimensions Tolerance:±0.1min.)

10000(W8P2)

40000(W8P2)

5 (LW Dimensions Tolerance:±0.1min.

and TDimensions Tolerance:±0.05)

10000(W8P2)

50000(W8P2)

5(LW Dimensions Tolerance:±0.2

and TDimensions:0.5 +0/-0.1)

10000(W8P2)

GRM18/GRMJN

4000

10000

GRM21

4000

10000

A/B

3000

4000

3000

10000

GRM31

6/9

4000

10000

B/M/X

3000

10000

2000

6000

GRM32

4000

10000

A/M

3000

10000

2000

8000

2000

6000

R/D/E

1000

4000

GRM43

1000

500

5000

N/R/D

1000

4000

2000

500

1500

GRM55

1000

500

5000

N/C/R/D

1000

4000

300

1500

5(LWTDimensions Tolerance:±0.07)

10000(W8P2)

50000(W8P2)

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25

JEMCGP-01796F 6

　(2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F)

(in:mm)

L W

GRMMD

X 0.5±0.025 0.25±0.025 0.25±0.025 0.32 0.58

0.6±0.03 0.3±0.03 0.2 +0.02/-0.04 0.37 0.67

0.6±0.09 0.3±0.09 0.2±0.02 0.42 0.72

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05 *3 Nominal value

　(3)GRM033/155(W8P1 CODE:W) (in:mm)

L W

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

Type

Dimensions(Chip)

A *3

B *3

GRM03

0.5 max.

0.65

1.15

1.0±0.2

0.5±0.2

0.78

1.29

1.0±0.05

0.5±0.05

0.65

1.15

0.3±0.03

0.5 max.

GRM03

0.6±0.09

0.3±0.09

0.44

0.74

0.8 max.

GRM15

Package

GRM Type

Type

Dimensions(Chip)

A *3

B *3

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

JEMCGP-01796F 7

　(4)GRM18/GRMJN/GRM21/GRM31/GRM32

(in:mm)

L W

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

50.5±0.05

0.6 +0.05/-0.1

0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

GRMJN 7 1.8±0.1 1.0±0.1 0.7±0.1 1.20±0.10 2.10±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

2.5±0.2

2.5±0.3 2.5±0.3

Plastic Tape

2.5 max.

3.0 max.

3.7 max.

GRM32

3.2±0.3

2.5±0.2

2.80±0.20

3.50±0.20

1.7 max.

Paper Tape

0.85±0.1

3.2±0.15

1.6±0.15

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

GRM31

3.2±0.15

1.6±0.15

2.00±0.20

3.60±0.20

1.15 max.

3.2±0.2

1.6±0.2

2.5 max.

2.0±0.2

1.25±0.2

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

1.05±0.10

1.85±0.10

GRM21

2.0±0.1

1.25±0.1

1.55±0.15

2.30±0.15

0.85±0.1

GRM18

0.5 +0/-0.1

0.8 max.

Paper Tape

1.6±0.2

0.8±0.2

1.10±0.10

2.00±0.10

1.15 max.

Package

GRM Type

Type

Dimensions(Chip)

Dimensions

of Tape

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796F 8

(5)GRM43/55 (in:mm)

L W

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

GRM55

5.7±0.4

5.0±0.4

5.2

6.1

2.5 max.

3.7 max.

GRM43

4.5±0.4

3.2±0.3

3.6

4.9

2.5 max.

3.7 max.

Package

GRM Type

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.0±0.1

4.0±0.1

Ｂ

*：2.0±0.1

0.3±0.1

JEMCGP-01796F 9

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRM01/02

8.0 max.

5±1.5

GRMMD/03/15/18/

JN/21/31/32

16.5 max.

10±1.5

GRM43/55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in:mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796F 10

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