Murata GRM188R61C105MA12 Series Bedienungsanleitung

GRM188R61C105MA12_ (0603, X5R:EIA, 1uF, DC16V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of May.17,2017,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

(3) Temperature Characteristics

(Public STD Code):X5R(EIA)

0.2 to 0.5

(5) Nominal

Capacitance

mark

(4)

Rated

Voltage

Packaging Unit

DC 16 V

Temp. Range

(Ref.Temp.)

(8) Packaging

-15 to 15 %

-55 to 85 °C

(25 °C)

0.5 min.

(1)-1 L

1.6±0.1

(1)-2 W

0.8±0.1

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

Chip Monolithic Ceramic Capacitor for General

Specifications and Test

Methods

(Operating

Temp. Range)

Temp. coeff

or　Cap. Change

±20 %

(6)

Capacitance

Tolerance

1 uF

0.8±0.1

-55 to 85 °C

f180mm Reel

PAPER W8P4

4000 pcs./Reel

f330mm Reel

PAPER W8P4

10000 pcs./Reel

(1)L/W

Dimensions (2)T

Dimensions (3)Temperature

Characteristics (4)Rated

Voltage (5)Nominal

Capacitance (6)Capacitance

Tolerance (8)Packaging Code



Code

GRM 18 8R6 1C 105 M A12 D

GRM188R61C105MA12-01 1

■Specifications and Test Methods

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated voltage

range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities.

Measurement Point　　 :

Between the terminations

Test Voltage 　　　　　　 :

250% of the rated voltage

Applied Time :

1 to 5 s

Charge/discharge current :

50mA max.

5 Insulation Resistance(I.R.) 

Measurement Point 　　: Between the terminations

Measurement Voltage :

DC Rated Voltage

Charging Time :

1 min

Charge/discharge current :

50mA max.

Measurement Temperature :

Room Temperature

6 Capacitance Shown in Rated value.

Measurement Temperature :

Room Temperature

7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.

D8,GRM31CR60J107 : 0.15 max

GRM31CR71E106 : 0.125 max

*1 For items listed in Table 1 on the left, the capacitance should

be measured using a voltage of 0.5+/-0.1Vrms instead of

1.0+/-0.2Vrms.

*2 For item GRM188R70J105, the capacitance should be measured

using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.

Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.

Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.

of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be

C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of

C7 : Within+/-22% (-55°C to +125°C) each temp. stage.

C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.

E7 : Within +22/-56% (-55°C to +125°C)

D7 : Within +22/-33% (-55°C to +125°C) · Measurement Voltage

D8 : Within +22/-33% (-55°C to +105°C) GRM152 B3 0J 104/224, GRM155 B1 0J 124 to 334,

GRM155 B3 0J 394 to 824, GRM155 B3 1A 124 to 105,

GRM188B10G106, GRM21BB10J106 　only : 0.20+/-0.05Vrms

　GRM21B R7 1A/1C 475 K/M E51, GRM219 R7 1A/1C 225

50% of B1: Within +10/-30% only : 0.5+/-0.1Vrms

the rated R1: Within +15/-40% GRM188R61H474 only : 1.5+/-0.3Vrms

voltage

･Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with the

capacitor side.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temperature(C)

Applying Voltage(VDC)

Reference Temp.+/-2

No bias

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp. +/-3

Reference Temp. +/-2

50% of

the rated voltage

(For B1,R1)

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp.+/-3

*Table 1

GRM033 B3/R6 1A 123 to 823

GRM033 B3/R6 1A 104

GRM155 B3/R6 1A124 to 105

GRM185 B3/R6 1C/1A105

GRM185 C8/D7 1A 105

GRM188 B3/R6 1C/1A225

GRM188 R7/C8/D7 1A 225

GRM188 B3/R6 1A 335

GRM219 B3/R6 1C/1A475

GRM219 C8 1A 475

GRM219 B3/R6 1A 106

GRM21B B3/R6 1D/1C/1A 106

GRM21B R7/C8 1A 106

GRM319 B3/R6 1C/1A106

Capacitance

Frequency

Voltage

*1 C≦

(10V min.)

1.0+/-0.1kHz

1.0+/-0.2Vrms

*2 C≦

(6.3V max.)

1.0+/-0.1kHz

0.5+/-0.1Vrms

C＞

120+/-24Hz

0.5+/-0.1Vrms

JEMCGS-00019G 2

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

D.F. Within the specified initial value.

Kind of Vibration :

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude :

1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-10% Pressurization method : Shown in Fig.2

Change Flexure　　　　: 1mm

Holding Time 　 :

5+/-1s

Soldering Method :

Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and

Test Method :

Solder bath method

continuously. Flux Solution of rosin ethanol 25(wt)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time

2+/-0.5s

Resistance Appearance No defects or abnormalities. <GRM03 size min.>

to Test Method : Solder bath method

Soldering Solder : Sn-3.0Ag-0.5Cu

Heat Solder Temp. :

270+/-5℃

Immersion time

10+/-0.5s

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 　: Within +/-7.5% Exposure Time : 24+/-2h

Change GRM188B30J106M : Within +/-12.5% Preheat : GRM31 size max.: 120℃to 150℃for 1 min

　GRM32 size　　　 : 100℃to 120℃for 1 min

and 170℃to 200℃for 1 min

· Initial measurement

D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Test Method : Reflow soldering (hot plate)

I.R. Within the specified initial value. Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Voltage proof No defects. Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

· Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Perform the five cycles according to the four heat treatments

shown in the following table.

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5%

Change E7 : Within +/-30%

D.F. Within the specified initial value.

I.R. Within the specified initial value. Exposure Time : 24+/-2h

· Initial measurement

Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

·GRM188B30J106M Measurement after test:

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Test Temperature :

40+/-2℃

High

Test Humidity :

90%RH to 95%RH

Humidity Capacitance Within +/-12.5%

Test Time :

500+/-12h

(Steady) Change

Applied Voltage :

DC Rated Voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max.

· Initial measurement

I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

· Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Step

Temp.(C)

Time

(min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-00019G 3

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Test Temperature :

Max. Operating Temp. +/-3℃

Capacitance Within +/-12.5%

Test Time :

1000+/-12h

Change

Applied Voltage :

125% of the rated voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

I.R.  · Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Recommended derating conditions on voltage and temperature

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

These Part Numbers are designed for use in the circuits where

continuous applied voltage to the capacitor is derated than rated

voltage, and guarantee Durability Test with 125% × rated voltage

as testing voltage at the maximumoperating temperature.

The voltage and temperature derating conditions on the left are

recommended for use to ensure the same reliability level as

normal specification.

JEMCGS-00019G 4

Test method : Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

　Fig.3

Solder Resist

Chip Capacitor

Land

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

JEMCGS-00019G 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

1.2 Dimensions of Tape

(1)GRM01/GRM02 (W4P1 CODE:L) (in mm)

Package

GRM Type

*3 Nominal value

0.2±0.05

0.26

0.46

0.4 max.

GRM02

0.4±0.02

0.2±0.02

0.23

0.43

0.5 max.

0.4±0.05

GRM01

0.25±0.013

0.125±0.013

0.145

0.27

Type

Dimensions(Chip)

A*3

B *3

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25





Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

GRM01

50000(W4P1)

GRM02

40000(W4P1)

15000(W8P2)

50000(W8P2)

GRM03

15000(W8P2)

50000(W8P2)

15000(W8P2)

30000(W8P1)

50000(W8P2)

GRM15

20000(W8P2)

50000(W8P2)

3/X

10000(W8P2)

50000(W8P2)

5(LWTDimensions Tolerance:±0.1min.)

10000(W8P2)

40000(W8P2)

5 (LW Dimensions Tolerance:±0.1min.

and TDimensions Tolerance:±0.05)

10000(W8P2)

50000(W8P2)

5(LW Dimensions Tolerance:±0.2

and TDimensions:0.5 +0/-0.1)

10000(W8P2)

40000(W8P2)

GRM18/GRMJN

4000

10000

GRM21

4000

10000

A/B

3000

4000

3000

10000

GRM31

6/9

4000

10000

B/M/X

3000

10000

2000

6000

GRM32

4000

10000

A/M

3000

10000

2000

8000

2000

6000

R/D/E

1000

4000

GRM43

1000

500

5000

N/R/D

1000

4000

500

2000

500

1500

4000

GRM55

1000

300

1500

50000(W8P2)

5000

N/R/D

1000

5(LWTDimensions Tolerance:±0.05)

GRMMD

Type

5(LWTDimensions Tolerance:±0.07)

10000(W8P2)

20000(W8P1)

10000(W8P2)

JEMCGP-01796G 6

　(2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F) (in mm)

L W

GRMMD

X 0.5±0.025 0.25±0.025 0.25±0.025 0.32 0.58

0.6±0.03 0.3±0.03 0.2 +0.02/-0.04 0.37 0.67

0.6±0.09 0.3±0.09 0.2±0.02 0.42 0.72

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05 *3 Nominal value

(3)GRM033/GRM155(W8P1 CODE:W) (in mm)

L W

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

Type

Dimensions(Chip)

A *3

B *3

GRM03

0.5 max.

0.65

1.15

1.0±0.2

0.5±0.2

0.78

1.29

1.0±0.05

0.5±0.05

0.65

1.15

0.3±0.03

0.5 max.

GRM03

0.6±0.09

0.3±0.09

0.44

0.74

0.8 max.

GRM15

Package

GRM Type

Type

Dimensions(Chip)

A *3

B *3

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

JEMCGP-01796G 7

　(4)GRM18/GRMJN/GRM21/GRM31/GRM32 (in mm)

L W

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

50.5±0.05

0.6 +0.05/-0.1

0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

GRMJN 7 1.8±0.1 1.0±0.1 0.7±0.1 1.20±0.10 2.10±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

2.5±0.2

2.5±0.3 2.5±0.3

Plastic Tape

2.5 max.

3.0 max.

3.7 max.

GRM32

3.2±0.3

2.5±0.2

2.80±0.20

3.50±0.20

1.7 max.

Paper Tape

0.85±0.1

3.2±0.15

1.6±0.15

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

GRM31

3.2±0.15

1.6±0.15

2.00±0.20

3.60±0.20

1.15 max.

3.2±0.2

1.6±0.2

2.5 max.

2.0±0.2

1.25±0.2

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

1.05±0.10

1.85±0.10

GRM21

2.0±0.1

1.25±0.1

1.55±0.15

2.30±0.15

0.85±0.1

GRM18

0.5 +0/-0.1

0.8 max.

Paper Tape

1.6±0.2

0.8±0.2

1.10±0.10

2.00±0.10

1.15 max.

Package

GRM Type

Type

Dimensions(Chip)

Dimensions

of Tape

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796G 8

(5)GRM43/GRM55 (in mm)

L W

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

GRM55

5.7±0.4

5.0±0.4

5.2

6.1

2.5 max.

3.7 max.

GRM43

4.5±0.4

3.2±0.3

3.6

4.9

2.5 max.

3.7 max.

Package

GRM Type

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.0±0.1

4.0±0.1

Ｂ

*：2.0±0.1

0.3±0.1

JEMCGP-01796G 9

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRM01/GRM02

8.0 max.

5±1.5

GRMMD/GRM03/GRM15/

GRM18/GRMJN/GRM21/

GRM31/GRM32

16.5 max.

10±1.5

GRM43/GRM55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796G 10

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