Murata GRM31MR71E824KA01 Series Bedienungsanleitung

GRM31MR71E824KA01_ (1206, X7R:EIA, 0.82uF, DC25V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Mar.1,2016,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

1.5 min.

(1)-1 L

3.2±0.15

(1)-2 W

1.6±0.15

Chip Monolithic Ceramic Capacitor for General

mark

(4)

Rated

Voltage

Packaging Unit

DC 25 V

Temp. Range

(Ref.Temp.)

(8) Packaging

Temp. coeff

or　Cap. Change

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

1.15±0.1

-55 to 125 °C

-15 to 15 %

-55 to 125 °C

(25 °C)

(6)

Capacitance

Tolerance

0.82 uF

Specifications and Test

Methods

(Operating

Temp. Range)

±10 %

(3) Temperature Characteristics

(Public STD Code):X7R(EIA)

0.3 to 0.8

(5) Nominal

Capacitance

f180mm Reel

EMBOSSED W8P4

3000 pcs./Reel

f330mm Reel

EMBOSSED W8P4

10000 pcs./Reel

(1)L/W

Dimensions

(2)T

Dimensions

(3)Temperature

Characteristics

(4)Rated

Voltage

(5)Nominal

Capacitance

(6)Capacitance

Tolerance

(8)Packaging

Code



Control Code

GRM 31 MR7 1E 824 K A01 L

GRM31MR71E824KA01-01 1

Temperature

Compensating Type

High Dielectric

Constant Type

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage

which may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage,

VP-P or VO-P, whichever is larger, should be maintained

within the rated voltage range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations

Test Voltage : 300% of the rated voltage

(Temperature compensating type)

250% of the rated voltage

(High dielectric constant type)

Applied Time : 1s to 5 s

Charge/discharge current : 50mA max.

5 Insulation Resistance(I.R.)

C≦ Measurement Point 　　 : Between the terminations

C＞ Measurement Voltage : DC Rated Voltage

C:Nominal Capacitance Charging Time : 2 min

Charge/discharge current : 50mA max.

Measurement Temperature : Room Temperature

6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature

(1)Temperature Compensating Type

7 Q or Dissipation Factor (D.F.)

30pF and over:Q≧1000 W.V.:100Vdc :0.025max.(C<0.068µF)

30pF and below:Q≧400+20C :0.05max.(C≧0.068µF)

C:Nominal Capacitance(pF) W.V.:50/35/25Vdc :0.025max.

W.V.:16/10Vdc :0.035max. (2)High Dielectric Constant Type

W.V.:6.3/4Vdc :0.05max.(C<3.3µF)

:0.1max. (C≧3.3µF)

Temperature No bias Nominal values of the B1,B3 : Within +/-10% The capacitance change should be measured after 5 min

Characteristics temperature coefficient is

　　 (-25°C to +85°C) at each specified temp. stage.

of Capacitance

shown in Rated value. R1,R7 : Within +/-15% In case of applying voltage, the capacitance change should be

　　 (-55°C to +125°C) measured after 1 min with applying voltage in equilibration of

But,the Capacitance Change R6 : Within +/-15% each temp. stage.

under 20℃is shown 　(-55°C to +85°C) Capacitance value as a reference is the value in step 3.

in Table A. C7 : Within +/-22%

　(-55°C to +125°C) (1)Temperature Compensating Type

C8 : Within +/-22% The capacitance drift is calculated by dividing the differences

Capacitance Drift *

　(-55°C to +105°C) between the maximum and minimum measured values in the

Within +/-0.2% or +/-0.05pF L8 : Within +/-15% step 1,3 and 5 by the cap. value in step 3.

(Whichever is larger.)

　(-55°C to +125°C)

*Not apply to 1X/25V : Within +15/-40%

　(+125°C to +150°C)

50% of - B1 : Within +10/-30% (2)High Dielectric Constant Type

the rated R1 : Within +15/-40%

voltage

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with

the capacitor side.

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

■Specifications and Test Methods

Item

Specification

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

Step

Temperature(C)

Applying Voltage(VDC)

Reference Temp.+/-2

No bias

Min.Operating Temp.+/-3

Reference Temp.+/-2

Max.Operating Temp.+/-3

Reference Temp.+/-2

50% of

the rated voltage

(For B1,R1)

Min.Operating Temp.+/-3

Reference Temp.+/-2

Max.Operating Temp.+/-3

Capacitance

Frequency

Voltage

C≦1000pF

1.0+/-0.1MHz

0.5 to 5.0Vrms

C＞1000pF

1.0+/-0.1kHz

1.0+/-0.2Vrms

Capacitance

Frequency

Voltage

C≦

1.0+/-0.1kHz

1.0+/-0.2Vrms

C＞

120+/-24Hz

0.5+/-0.1Vrms

JEMCGS-0001U 2

Temperature

Compensating Type

High Dielectric

Constant Type

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

Q or D.F. Within the specified initial value. Kind of Vibration : A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude : 1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-5% or +/-0.5pF Within +/-10%

Change (Whichever is larger) Pressurization method : Shown in Fig.2

Flexure　　　　: 1mm

Holding Time : 5+/-1s

Soldering Method : Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method

Flux Solution of rojin ethanol 25(wt)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time :

2+/-0.5s

Resistance to Appearance No defects or abnormalities. <GRM03 size min.>

Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Within +/-7.5% Test Method : Solder bath method

Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Q or D.F. Within the specified initial value.

Immersion time :

10+/-0.5s

Exposure Time : 24+/-2h

I.R. Within the specified initial value. Preheat :

GRM31 size max.: 120℃to 150℃for 1 min

　GRM32 size 　　 : 100℃to 120℃for 1 min

Voltage proof No defects.

and 170℃to 200℃for 1 min

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

Test Method : Reflow soldering (hot plate)

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF Within +/-7.5%

Change (Whichever is larger) Perform the five cycles according to the four heat treatments

shown in the following table.

Q or D.F. Within the specified initial value.

I.R. Within the specified initial value.

Voltage proof No defects.

Exposure Time : 24+/-2h

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Step

Temp.(C)

Time (min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp.

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-0001U 3

Temperature

Compensating Type

High Dielectric

Constant Type

High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

High Humidity Capacitance Within +/-7.5% or +/-0.75pF Within +/-12.5%

Test Temperature :

40+/-2℃

(Steady) Change (Whichever is larger)

Test Humidity :

90%RH to 95%RH

Test Time :

500+/-12h

Q or D.F. 30pF and over:Q≧200 W.V.:100Vdc :0.05max.(C<0.068µF) Applied Voltage : DC Rated Voltage

30pF and below

　:0.075max.(C≧0.068µF)

Charge/discharge current : 50mA max.

:Q≧100+10C/3 W.V.:50/35/25Vdc :0.05max.

Exposure Time :

24+/-2h

W.V.:16/10Vdc :0.05max.

C:Nominal Capacitance(pF) W.V.:6.3/4Vdc :0.075max.(C<3.3µF)

:0.125max.(C≧3.3µF)

I.R. 

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within +/-3% or +/-0.3pF Within +/-12.5% Test Temperature : Max. Operating Temp. +/-3℃

Change (Whichever is larger)

Test Time :

1000+/-12h

Applied Voltage : 200% of the rated voltage

Q or D.F. 30pF and over:Q≧350 W.V.:100Vdc :0.05max.(C<0.068µF) Charge/discharge current : 50mA max.

10pF and over

:0.075max.(C≧0.068µF)

Exposure Time : 24+/-2h

30pF and below W.V.:50/35/25Vdc :0.05max.

: Q≧275+5C/2 W.V.:16/10Vdc :0.05max. ･Initial measurement for high dielectric constant type

10pF and below W.V.:6.3/4Vdc :0.075max.(C<3.3µF) Apply 200% of the rated DC voltage at the max. operating

: Q≧200+10C :0.125max.(C≧3.3µF) temp. +/-3°C for 1h and then let sit for 24+/-2h at room temperature,

then measure.

C:Nominal Capacitance (pF)

I.R. 

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

Table A

Char.

Capacitance Change from 20C (%)

-55℃

-25℃

-10℃

Max.

Min.

Max.

Min.

Max.

Min.

2C/0C

0.82

-0.45

0.49

-0.27

0.33

-0.18

1.37

-0.90

0.82

-0.54

0.55

-0.36

2.56

-1.88

1.54

-1.13

1.02

-0.75

1.32

0.41

0.88

0.27

1.65

0.14

1.10

0.09

2.36

-0.45

1.57

-0.30

1.70

0.72

1.13

0.48

2.03

0.45

1.35

0.30

2.74

-0.14

1.83

-0.09

2.30

1.22

1.54

0.81

2.63

0.95

1.76

0.63

3.35

0.36

2.23

0.24

3.07

1.85

2.05

1.23

3.40

1.58

2.27

1.05

4.12

0.99

2.74

0.66

4.94

2.84

3.29

1.89

5.65

2.25

3.77

1.50

JEMCGS-0001U 4

Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

　　　　　　　　　　　: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Land Dimensions

Fig.3

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

SolderResist

ChipCapacitor

Land

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

JEMCGS-0001U 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

1.2 Dimensions of Tape

(1)GRM01/02 (W4P1 CODE:L) (in:mm)

*3 Nominal value

10000(W8P2)

50000(W8P2)

4000

GRM55

GRM43

GRM32

GRM31

GRM21

GRM15

5(LW Dimensions Tolerance:±0.2

and T Dimensions:0.5 +0/-0.1)

5(LWT Dimensions Tolerance:±0.1min.)

5(LWT Dimensions Tolerance:±0.05)

R/D/E

GRM01

GRM02

3/X

5 (LW Dimensions Tolerance:±0.1min.

and T Dimensions Tolerance:±0.05)

GRM03

GRM18

A/B

6/9

M/X

10000(W8P2)

4000

N/R/D

4000

50000(W4P1)

N/C/R/D

A/M

Package

GRM Type

15000(W8P2)

20000(W8P2)

10000(W8P2)

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

4000

30000(W8P1)

20000(W8P1)

40000(W4P1)

3000

2000

3000

300

50000(W8P2)

2000

1000

10000

500

1000

500

1000

500

3000

10000

40000(W8P2)

50000(W8P2)

10000

1500

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

8000

6000

4000

10000

6000

10000





Type

1500

5000

4000

5000

4000

2000

0.145

0.27

0.4 max.

0.2±0.02

0.23

0.43

0.125±0.013

0.4±0.05

0.25±0.013

Type

0.2±0.05

0.26

GRM02

GRM01

0.4±0.02

15000(W8P2)

50000(W8P2)

0.5 max.

0.46

Dimensions(Chip)

A *3

B *3

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25

JEMCGP-01796E 6

　(2)GRM03/15(W8P2 CODE:D/E/J/F)

(in:mm)

L W

2 0.2 +0.02/-0.04

0.3±0.03 0.5 max.

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05 *3 Nominal value

　(3)GRM033/155(W8P1 CODE:W) (in:mm)

L W

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

0.5 max.

Dimensions(Chip)

A *3

B *3

1.0±0.2

0.5±0.2

0.65

0.78

1.15

1.29

0.74

0.8 max.

0.5±0.05

0.3±0.03

0.65

1.15

Type

Dimensions(Chip)

0.6±0.03

GRM03

0.6±0.09

0.3±0.03

0.3±0.09

Package

GRM Type

A *3

B *3

0.37

0.67

GRM03

GRM15

1.0±0.05

Type

0.44

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

JEMCGP-01796E 7

　(4)GRM18/21/31/32 (in:mm)

L W

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

50.5±0.05

6 0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2 3.7 max.

Dimensions

of Tape

Package

GRM Type

1.15 max.

2.0±0.1

2.0±0.2

1.25±0.1

0.85±0.1

1.7 max.

Plastic Tape

Type

Dimensions(Chip)

1.6±0.2

Plastic Tape

2.5 max.

3.0 max.

2.5 max.

3.2±0.3

1.6±0.15

1.6±0.2

2.5±0.2

GRM32

2.80±0.20

3.50±0.20

1.7 max.

GRM31

2.00±0.20

3.60±0.20

1.15 max.

0.85±0.1

1.6±0.15

Paper Tape

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

3.2±0.15

3.2±0.2

GRM21

1.55±0.15

2.30±0.15

Paper Tape

1.05±0.10

1.85±0.10

1.25±0.2

0.8±0.2

0.8 max.

0.5 +0/-0.1

GRM18

1.10±0.10

2.00±0.10

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796E 8

(5)GRM43/55 (in:mm)

L W

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

3.7 max.

4.5±0.4

3.2±0.3

5.7±0.4

5.0±0.4

GRM55

5.2

6.1

2.5 max.

3.7 max.

Package

GRM Type

GRM43

3.6

4.9

2.5 max.

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.0±0.1

4.0±0.1

Ｂ

*：2.0±0.1

0.3±0.1

JEMCGP-01796E 9

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRM01/02

8.0 max.

5±1.5

GRM03/15/18/21/31/32

16.5 max.

10±1.5

GRM43/55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in:mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796E 10

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