Murata GRT31CC81E475ME01 Series Bedienungsanleitung

GRT31CC81E475ME01_ (1206, X6S, 4.7uF, DC25V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Apr.17,2015,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

1.5 min.

(1)-1 L

3.2±0.2

(1)-2 W

1.6±0.2

Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment

mark

(4)

Rated

Voltage

Packaging Unit

DC 25 V

Temp. Range

(Ref.Temp.)

(8) Packaging

Temp. coeff

or　Cap. Change

This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic

equipment.

Please contact us when using this product for any other applications than described in the above.

Do not use these products in applications critical to passenger safetyand car driving function (e.g. ABS, AIRBAG, etc.).

(2) T

1.6±0.2

-55 to 105 °C

-22 to 22 %

-55 to 105 °C

(25 °C)

(6)

Capacitance

Tolerance

4.7 uF

Specifications and Test

Methods

(Operating

Temp. Range)

±20 %

(3) Temperature Characteristics

(Public STD Code):X6S(EIA)

0.3 to 0.8

(5) Nominal

Capacitance

f180mm Reel

EMBOSSED W8P4

2000 pcs./Reel

f330mm Reel

EMBOSSED W8P4

6000 pcs./Reel

(1)L/W

Dimensions

(2)T

Dimensions

(3)Temperature

Characteristics

(4)Rated

Voltage

(5)Nominal

Capacitance

(6)Capacitance

Tolerance

(8)Packaging

Code

(7)Murata’s

Control Code

GRT 31 CC8 1E 475 M E01 L

GRT31CC81E475ME01-01 1

Pre-and Post-Stress 

Electrical Test

2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at maximumoperating

Exposure (Storage) specifications in the following table.

temperature ±3℃.

Appearance No marking defects Set for 24±2 hours at room temperature, then measure.

Capacitance R6, C8: Within ±12.5%

Change

Dissipation R6, C8: 0.2 max.

Factor

Insulation

25Ω・F min.

Resistance

3 Temperature Cycling The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under

specifications in the following table. the same conditions as (18). Perform the 1000 cycles test according

Appearance No marking defects to the four heat treatments in the following table.

Capacitance R6, C8: Within ±7.5% Set for 24±2 hours at room temperature, then measure.

Change

Dissipation R6, C8: 0.2 max.

Factor

Insulation

50Ω・F min.

Resistance

・Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10 ℃for one hour and then set

for 24±2 hours at room temperature.

Perform the initial measurement.

4 Destructive No defects or abnormalities Per EIA-469

Physical Analysis

5 Biased Humidity The measured and observed characteristics should satisfy the

Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)

specifications in the following table.

at 85±3℃and 80 to 85% humidity for 1000±12 hours.

Appearance No marking defects

Remove and set for 24±2 hours at room temperature, then measure.

Capacitance R6,C8: Within ±12.5%

The charge/discharge current is less than 50mA.

Change

Dissipation R6,C8: 0.2 max

・Measurement after test for high dielectric constant type

Factor

Perform a heat treatment at 150+0/–10°C for one hour and then let

sit for 24±2 hours at room temperature, then measure.

Insulation

5Ω・F min.

Resistance

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

AEC-Q200 Test Method

Specifications.

Step

Temp.

(C)

-55+0/-3

Room

Temp.

85 +3/-0 (For R6)

105+3/-0 (For C8)

Room

Temp.

Time

(min.)

153

JEMCGS-01744J 2

6 Operational Life The measured and observed characteristics should satisfy the Apply 100% of the rated voltage for 1000±12 hours at maximum operating

specifications in the following table.

temperature ±3℃. Set for 24±2 hours at room temperature, then measure.

Appearance No marking defects The charge/discharge current is less than 50mA.

Capacitance R6,C8: Within ±12.5%

Change

・Initial measurement for high dielectric constant type

Dissipation R6,C8: 0.2max

Perform a heat treatment at 150+0/-10℃for one hour and then set

Factor for 24±2 hours at room temperature.

Perform the initial measurement.

・Measurement after test for high dielectric constant type

Insulation

5Ω・F min. Perform a heat treatment at 150+0/–10°C for one hour and then let

Resistance

sit for 24±2 hours at room temperature, then measure.

7 External Visual No defects or abnormalities Visual inspection

8 Physical Dimension Within the specified dimensions Using calipers

9 Resistance to Appearance No marking defects

Per MIL-STD-202 Method 215

Solvents Capacitance Within the specified tolerance Solvent 1 : 1 part (by volume) of isopropyl alcohol

Change

3 parts (by volume) of mineral spirits

Dissipation R6,C8: 0.125max Solvent 2 : Terpene defluxer

Factor

Solvent 3 : 42 parts (by volume) of water

　　　　　　1 part (by volume) of propylene glycol monomethyl ether

　　　　　 1 part (by volume) of monoethanolamine

Insulation

50Ω・F min.

Resistance

10 Mechanical Appearance No marking defects

Three shocks in each direction should be applied along 3 mutually

Shock Capacitance Within the specified tolerance

perpendicular axes of the test specimen (18 shocks).

Change

The specified test pulse should be Half-sine and should have a

Dissipation R6,C8: 0.125max

duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.

Factor

Insulation

50Ω・F min.

Resistance

11 Vibration Appearance No defects or abnormalities

Solder the capacitor to the test jig (glass epoxy board) in the same

Capacitance Within the specified tolerance

manner and under the same conditions as (18). The capacitor

Change

should be subjected to a simple harmonic motion having a total

Dissipation R6,C8: 0.125max

amplitude of 1.5mm, the frequency being varied uniformly between

Factor the approximate limits of 10 and 2000Hz. The frequency range, from

10 to 2000Hz and return to 10Hz, should be traversed in

approximately 20 minutes. This motion should be applied for 12

Insulation

50Ω・F min. items in each 3 mutually perpendicular directions (total of 36 times).

Resistance

12 Resistance to The measured and observed characteristics should satisfy the

Immerse the capacitor in a eutectic solder solution at 260±5℃for

Soldering Heat specifications in the following table.

10±1 seconds. Set at room temperature for 24±2 hours, then

Appearance No marking defects

measure.

Capacitance Within the specified tolerance

Change

・Initial measurement for high dielectric constant type

Dissipation R6,C8: 0.125max

Perform a heat treatment at 150+0/-10 ℃for one hour and then set

Factor

for 24±2 hours at room temperature.

Perform the initial measurement.

Insulation 50Ω・F min.

Resistance

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

AEC-Q200 Test Method

Specifications.

JEMCGS-01744J 3

13 Thermal Shock The measured and observed characteristics shall satisfy the

Fix the capacitor to the supporting jig in the same manner and under

specifications in the following table.

the same conditions as (18). Perform the 300 cycles according to

Appearance No marking defects

the two heat treatments listed in the following table (Maximum

Capacitance R6,C8: Within ±10.0%

transfer time is 20 seconds).

Change

Set for 24±2 hours at room temperature, then measure.

Dissipation R6,C8: 0.125max

Factor

Insulation

50Ω・F min.

Resistance

・Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10 for one hour and then set

for 24±2 hours at room temperature.

Perform the initial measurement.

14 ESD Appearance No marking defects

Per AEC-Q200-002

Capacitance Within the specified tolerance

Voltage setting level : 2kV

Change

Dissipation R6,C8: 0.125max

Factor

Insulation

50Ω・F min.

Resistance

15 Solderability

(a) Preheat at 155℃for 4 hours. After preheating, immerse the

　　capacitor in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-

　　5902) (25% rosin in weight proportion). Immerse in

　eutectic solder solution for 5+0/-0.5 seconds at 235±5℃.

(b) Should be placed into steam aging for 8 hours±15 minutes.

　　After preheating, immerse the capacitor in a solution of

　　ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight

　　proportion). Immerse in eutectic solder solution for 5+0/-0.5

　　seconds at 235±5℃.

　　After preheating, immerse the capacitor in a solution of

　　ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight

　　proportion). Immerse in eutectic solder solution for 120±5 seconds

at 260±5℃.

16 Electrical Appearance No defects or abnormalities Visual inspection.

Chatacteri- Capacitance Within the specified tolerance

The capacitance/Q/D.F. should be measured at 25℃at the

zation Change

frequency and voltage shown in the table.

Dissipation R6.C8 :0.125max

Factor

Insulation

50Ω・F min. The insulation resistance should be measured with a DC voltage not

Resistance

exceeding the rated voltage at 25℃and maximum operating temperature※

25℃within 1 minute of charging.

Insulation

5Ω・F min.

Resistance

※85+3/-0℃(For R6), 105+3/-0℃(For C8)

85℃(For R6)

105℃(For C8)

Dielectric No failure No failure should be observed when 250% of the rated voltage is

Strength applied between the terminations for 1 to 5 seconds, provided the

charge/ discharge current is less than 50mA.

95% of the terminations is to be soldered evenly and continuously.

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

AEC-Q200 Test Method

Specifications.

Step

Temp.

(℃)

-55+0/-3

105+3/-0 (For C8)

85+3/-0 (For R6)

Time

(min.)

15±3

Char.

Item

R6,C8

6.3V max.

(C≦10F)

R6,C8

10V min.

(C≦10F)

R6,C8

(10F< C)

Frequency

10.1kHz

12024Hz

Voltage

0.50.1Vrms

10.2Vrms

0.50.1Vrms

JEMCGS-01744J 4

17 Board Flex Appearance No marking defects

Solder the capacitor on the test jig (glass epoxy board) shown in

Fig1 using a eutectic solder. Then apply a force in the direction

shown in Fig 2 for 5±1sec. The soldering should be done by the

reflow method and should be conducted with care so that the

Capacitance Within specified tolerance

soldering is uniform and free of defects such as heat shock.

Change

Dissipation R6,C8: 0.125max

Factor

Insulation

50Ω・F min.

Resistance

(in mm)

18 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in

Strength Fig.3 using a eutectic solder. Then apply *18N force in parallel with

Capacitance Within specified tolerance the test jig for 60sec.

Change The soldering should be done either with an iron or using the reflow

Dissipation R6,C8: 0.125max method and should be conducted with care so that the soldering is

Factor uniform and free of defects such as heat shock

Insulation

50Ω・F min.

Resistance

（in mm）

19 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.

< Chip L dimension : 2.5mm max. > Apply a force.

< Chip Length : 2.5mm max. >

< Chip L dimension : 3.2mm min. >

< Chip Length : 3.2mm min. >

Speed supplied the Stress Load : *0.5mm / sec.

*GRT03: 0.1mm/sec.

Chip thickness < 1.25mm rank : 15N

　　Chip thickness ≧1.25mm rank : 54.5N

Chip thickness > 0.5mm rank : 20N

Chip thickness ≦0.5mm rank : 8N

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

AEC-Q200 Test Method

Specifications.

t : 1.6mm

(GRT03,15:0.8mm)

Fig.3

Fig.4

*2N(GRT03,15)

t : 1.6mm

(GRT03,15:0.8mm)

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Fig.1

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

ﾗﾝﾄﾞ

f4.5

Solder resist

Baked electrode

or copper foil

Iron Board

Flexure：≦2

(Chip thickness＞0.85mm rank

High Dielectric Type)

Flexure：≦1

(Chip thickness≦0.85mm rank

High Dielectric Type))

Capacitance meter

支持台

ｺﾝﾃﾞﾝｻ

Fig.2

Pressurizing

speed:1.0mm/sec

Pressurize

114

0.6L

Type

GRT03

0.3

0.9

0.3

GRT15

0.5

1.5

0.6

GRT18

0.6

2.2

0.9

GRT21

0.8

3.0

1.3

GRT31

2.0

4.4

1.7

Type

GRT03

0.3

0.9

0.3

GRT15

0.4

1.5

0.5

GRT18

1.0

3.0

1.2

GRT21

1.2

4.0

1.65

GRT31

2.2

5.0

2.0

JEMCGS-01744J 5

20 Capacitance Capacitance R6 : Within ±15% The capacitance change should be measured after 5 min. at

Temperature Change 　　　(-55℃to +85℃) each specified temperature stage.

Characteristics The ranges of capacitance change compared with the above 25℃

C8 : Within ±22% value over the temperature ranges shown in the table should be

　　　(-55℃to +105℃)within the specified ranges.

・Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10℃for one hour

and then set for 24±2 hours at room temperature.

Perform the initial measurement.

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

AEC-Q200 Test Method

Specifications.

Step

Temperature.(C)

25±2

-55±3

25±2

85±3（for R6）, 105±3（for C8）

25±2

JEMCGS-01744J 6

1.Tape Carrier Packaging(Packaging Code:D/E/F/L/J/K)

1.1 Minimum Quantity(pcs./reel)

φ180mm reel φ330mm reel

Paper Tape Plastic Tape Paper Tape Plastic Tape

Code:D/E Code:L Code:J/ F Code:K

GRT03 15000 50000

5(Dimensions Tolerance:±0.05) 10000 50000

5(Dimensions Tolerance:±0.1min.) 10000 40000

GRT18 4000 10000

64000 10000

94000 10000

B3000 10000

64000 10000

94000 10000

M3000 10000

C2000 6000

N2000 8000

D/E 1000 4000

1.2 Dimensions of Tape

(1)GRT03/15(Paper Tape) (in mm)

*3 Nominal value

Type

GRT21

GRT31

GRT15

Package

GRT Type

GRT32

GRT15 GRT15 GRT15

(Dimensions Tolerance

±0.05)

(Dimensions Tolerance

±0.1)

(Dimensions Tolerance

±0.2)

A *3 0.37 0.39 0.65 0.70 0.75

B *3 0.67 0.69 1.15 1.20 1.35

ｔ0.5 max. 0.5 max. 0.8 max. 0.8 max. 0.8 max.

Code

GRT03

(Dimensions Tolerance

±0.03)

GRT03

(Dimensions Tolerance

±0.05)

±0.03 0.37 0.67

±0.05 0.39 0.69

±0.05 0.65 1.15

±0.1 0.70 1.20

±0.2 0.75 1.35

GRT03

GRT15

0.5 max.

0.8 max.

A *3

B *3

ｔ

Type

LW Dimensions

Tolerance(Chip)

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

JEMCGP-01742F 7

　(2)GRT18/21/31/32(Paper Tape) (in mm)

　(3)GRT21/31/32(Plastic Tape)

Package

GRT Type

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.8±0.1

0.8±0.15

±0.2 0.8±0.2

1.10±0.10 2.00±0.10

0.6±0.1

0.6+0/-0.15

0.85±0.1

0.85+0/-0.2

6 ±0.15 0.6±0.1

9 ±0.2 within 0.85±0.1

±0.15 within

±0.1

LW Dimensions

Tolerance(Chip)

GRT21

GRT31

T Dimensions

(Chip)

1.1 max.

1.55±0.15

2.30±0.15

2.00±0.20

1.05±0.10

1.85±0.10

±0.15 within

GRT18

Type

3.60±0.20

±0.1 1.25±0.1

1.45±0.20 2.25±0.20 1.7 max.

B ±0.15

1.25±0.15

±0.2

1.25±0.2

±0.15 1.15±0.1

±0.2 1.15±0.15

C ±0.2 1.6±0.2 2.5 max.

N 1.35±0.15 2.5 max.

D 2.0±0.2 3.0 max.

E 2.5±0.2 3.7 max.

LW Dimensions

Tolerance(Chip)

T Dimensions

(Chip)

1.7 max.

L:±0.3

W:±0.2

GRT32

2.80±0.20

3.50±0.20

GRT31

1.90±0.20

3.50±0.20

2.0 max.

Type

GRT21

1.50±0.20

2.30±0.20

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.5 max.(T≦1.8mm)

Ｂ

*：2.0±0.1

0.3±0.1

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01742F 8

Package

GRT Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

φ21±0.8

ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 2.2.

Hole for Chip : As specified in 2.2.

Base Tape : As specified in 2.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRT32 max.

16.5 max.

10±1.5

φ180+0/-3.0

φ330±2.0

φ50 min.

φ13±0.5

2.0±0.5

Chip

(in mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01742F 9

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)

1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1. There are possibly

to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.

* GRT03:0.05N to 0.5N

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

Package

GRT Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

Tail vacant Section

Chip-mounting Unit

Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

165 to 180°

Top tape

JEMCGP-01742F 10

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