Murata GRT32ER61E226ME13 Series Bedienungsanleitung

GRT32ER61E226ME13_ (1210, X5R:EIA, 22uF, DC25V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of May.10,2017,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

(3) Temperature Characteristics

(Public STD Code):X5R(EIA)

0.3 min.

(5) Nominal

Capacitance

mark

(4)

Rated

Voltage

Packaging Unit

DC 25 V

Temp. Range

(Ref.Temp.)

(8) Packaging

-15 to 15 %

-55 to 85 °C

(25 °C)

1.0 min.

(1)-1 L

3.2±0.3

(1)-2 W

2.5±0.2

This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic

equipment.

Please contact us when using this product for any other applications than described in the above.

Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).

(2) T

Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment

Specifications and Test

Methods

(Operating

Temp. Range)

Temp. coeff

or　Cap. Change

±20 %

(6)

Capacitance

Tolerance

22 uF

2.5±0.2

-55 to 85 °C

f180mm Reel

EMBOSSED W8P4

1000 pcs./Reel

f330mm Reel

EMBOSSED W8P4

4000 pcs./Reel

(1)L/W

Dimensions (2)T

Dimensions (3)Temperature

Characteristics (4)Rated

Voltage (5)Nominal

Capacitance (6)Capacitance

Tolerance (8)Packaging Code

(7)Murata’s Control

Code

GRT 32 ER6 1E 226 M E13 L

GRT32ER61E226ME13-01 1

Pre-and Post-Stress 

Electrical Test

2 High Temperature The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).

Exposure (Storage) specifications in the following table.

Set the capacitor for 1000±12h at maximum operating temperature ±3℃.

Appearance No marking defects Set for 24±2h at room temperature, then measure.

Capacitance R6, C8: Within ±12.5%

Change

Dissipation R6, C8: 0.2 max.

Factor

Insulation

More than 500MΩ or 25Ω ∙F (Whichever is smaller)

Resistance

3 Temperature Cycling The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).

specifications in the following table. Perform the 1000 cycles test according to the four heat treatments

Appearance No marking defects in the following table.

Set for 24±2h at room temperature, then measure.

Capacitance R6, C8: Within ±12.5%

Change

Dissipation R6, C8: 0.2 max.

Factor

・Initial measurement

Insulation Within the specified initial value.

Perform a heat treatment at 150+0/-10 ℃for 1h and then set

Resistance for 24±2h at room temperature.

Perform the initial measurement.

4 Destructive No defects or abnormalities Per EIA-469

Physical Analysis

5 Biased Humidity The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).

specifications in the following table.

Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)

Appearance No marking defects

at 85±3℃and 80 to 85% humidity for 1000±12h.

Remove and set for 24±2h at room temperature, then measure.

Capacitance R6,C8: Within ±12.5%

The charge/discharge current is less than 50mA.

Change

Dissipation R6,C8: 0.2 max

・Measurement after test

Factor

Perform a heat treatment at 150+0/–10°C for 1h and then let

sit for 24±2h at room temperature, then measure.

Insulation

More than 100MΩ or 5Ω ∙F (Whichever is smaller)

Resistance

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

Specifications.

AEC-Q200 Test Method

Step

Temp.

(C)

-55+0/-3

Room

Temp.

85 +3/-0 (For R6)

105+3/-0 (For C8)

Room

Temp.

Time

(min.)

153

JEMCGS-02088H 2

6 Operational Life The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).

specifications in the following table. Apply 100% of the rated voltage for 1000±12h at maximum operating

Appearance No marking defects

temperature ±3℃. Set for 24±2h at room temperature, then measure.

The charge/discharge current is less than 50mA.

Capacitance R6,C8: Within ±12.5%

Change

・Initial measurement

Dissipation R6,C8: 0.2max

Perform a heat treatment at 150+0/-10℃for 1h and then set

Factor for 24±2h at room temperature.

Perform the initial measurement.

・Measurement after test

Insulation

More than 100MΩ or 5Ω ∙F (Whichever is smaller) Perform a heat treatment at 150+0/–10°C for 1h and then let

Resistance

sit for 24±2h at room temperature, then measure.

7 External Visual No defects or abnormalities Visual inspection

8 Physical Dimension Within the specified dimensions Using Measuring instrument of dimension.

9 Resistance to Appearance No marking defects

Per MIL-STD-202 Method 215

Solvents Solvent 1 : 1 part (by volume) of isopropyl alcohol

Capacitance Within the specified tolerance 3 parts (by volume) of mineral spirits

Solvent 2 : Terpene defluxer

Solvent 3 : 42 parts (by volume) of water

Dissipation Within the specified initial value.

　　　　　　1 part (by volume) of propylene glycol monomethyl ether

Factor

　　　　　 1 part (by volume) of monoethanolamine

Insulation Within the specified initial value.

Resistance

10 Mechanical Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board).

Shock

Three shocks in each direction should be applied along 3 mutually

Capacitance Within the specified tolerance

perpendicular axes of the test specimen (18 shocks).

The specified test pulse should be Half-sine and should have a

Dissipation Within the specified initial value.

duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.

Factor

Insulation Within the specified initial value.

Resistance

11 Vibration Appearance No defects or abnormalities Solder the capacitor on the test substrate(glass epoxy board).

The capacitor should be subjected to a simple harmonic motion having

Capacitance Within the specified tolerance

a total amplitude of 1.5mm, the frequency being varied uniformly between

the approximate limits of 10 and 2000Hz. The frequency range, from

Dissipation Within the specified initial value. 10 to 2000Hz and return to 10Hz, should be traversed in

Factor approximately 20min. This motion should be applied for 12

items in each 3 mutually perpendicular directions (total of 36 times).

Insulation Within the specified initial value.

Resistance

12 Resistance to The measured and observed characteristics should satisfy the Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic

Soldering Heat specifications in the following table.

solder solution at 260±5℃for 10±1s.

Appearance No marking defects

Set at room temperature for 24±2h, then measure.

Capacitance Within the specified tolerance

・Initial measurement

Perform a heat treatment at 150+0/-10 ℃for 1h and then set

Dissipation Within the specified initial value.

for 24±2h at room temperature.

Factor Perform the initial measurement.

Insulation Within the specified initial value.

Resistance

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

Specifications.

AEC-Q200 Test Method

JEMCGS-02088H 3

13 Thermal Shock The measured and observed characteristics shall satisfy the Solder the capacitor on the test substrate(glass epoxy board).

specifications in the following table.

Perform the 300 cycles according to the two heat treatments listed

Appearance No marking defects

in the following table(Maximum transfer time is 20s).

Set for 24+/-2h at room temperature, then measure.

Capacitance R6,C8: Within ±12.5%

Change

Dissipation Within the specified initial value.

Factor

Insulation Within the specified initial value.

・Initial measurement

Resistance

Perform a heat treatment at 150+0/-10 for 1h and then set

for 24±2h at room temperature.

Perform the initial measurement.

14 ESD Appearance No marking defects

Per AEC-Q200-002

Voltage setting level : 2kV

Capacitance Within the specified tolerance

Dissipation Within the specified initial value.

Factor

Insulation Within the specified initial value.

Resistance

15 Solderability

(a) Preheat at 155℃for 4h. After preheating, immerse the capacitor

　　 in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-5902)

　　(25% rosin in mass proportion).

　Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃or

an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.

(b) should be placed into steam aging for 8h+/-15min.

　　 After preheating, immerse the capacitor in a solution of ethanol

　　(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in mass

　　proportion). Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃

　　or an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.

　　After preheating, immerse the capacitor in a solution of ethanol

　　(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in mass

　　proportion). Immerse in Sn-3.0Ag-0.5Cu solder solution or

an eutectic solder solution for 120+/-5s at 260+/-5℃.

16 Electrical Appearance No defects or abnormalities Visual inspection.

Chatacteri-

zation Capacitance Within the specified tolerance

The capacitance/Q/D.F. should be measured at 25℃at the

frequency and voltage shown in the table.

Dissipation R6.C8 :0.125max

Factor

Insulation More than 1000MΩ or 50Ω ∙ F (Whichever is smaller) The insulation resistance should be measured with a DC voltage not

Resistance

exceeding the rated voltage at 25℃and maximumoperating temperature※

25℃within 1min of charging.

Insulation More than 100MΩ or 5Ω ∙ F (Whichever is smaller)

Resistance

※85+3/-0℃(For R6), 105+3/-0℃(For C8)

85℃(For R6)

105℃(For C8)

Dielectric No failure No failure should be observed when 250% of the rated voltage is

Strength applied between the terminations for 1 to 5s, provided the

charge/ discharge current is less than 50mA.

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

Specifications.

AEC-Q200 Test Method

95% of the terminations is to be soldered evenly and continuously.

Step

Temp.

(℃)

-55+0/-3

105+3/-0 (For C8)

85+3/-0 (For R6)

Time

(min.)

15±3

Char.

Item

R6,C8

6.3V max.

(C≦10F)

R6,C8

10V min.

(C≦10F)

R6,C8

(10F< C)

Frequency

10.1kHz

12024Hz

Voltage

0.50.1Vrms

10.2Vrms

0.50.1Vrms

JEMCGS-02088H 4

17 Board Flex Appearance No marking defects

Solder the capacitor on the test substrate(glass epoxy board)

shown in Fig1.

Then apply a force in the direction shown in Fig 2 for 5±1s

Capacitance Within specified tolerance

The soldering should be done by the reflow method and should be

conducted with care so that the soldering is uniform and free of defects

such as heat shock.

Dissipation Within the specified initial value.

Factor

Insulation Within the specified initial value.

Resistance

(in mm)

　　　　　　　　　　　　　　　　　Fig.2

18 Terminal Appearance No marking defects

Solder the capacitor on the test substrate(glass epoxy board)

Strength

shown in Fig3.

Capacitance Within specified tolerance Then apply 18N* force in parallel with the test jig for 60s.

The soldering should be done either with an iron or using the reflow

Dissipation Within the specified initial value. method and should be conducted with care so that the soldering is

Factor uniform and free of defects such as heat shock

Insulation Within the specified initial value.

Resistance

（in mm）

19 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.

< Chip L dimension : 2.5mm max. > Apply a force.

< Chip Length : 2.5mm max. >

< Chip L dimension : 3.2mm min. >

< Chip Length : 3.2mm min. >

Speed supplied the Stress Load : *0.5mm / s

*GRT03: 0.1mm/s

　　Chip thickness ≧1.25mm rank : 54.5N

Chip thickness > 0.5mm rank : 20N

Chip thickness = 0.5mm rank : 8N

Chip thickness = 0.3mm rank : 5N

Chip thickness < 0.3mm rank : 2.5N

Chip thickness < 1.25mm rank : 15N

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

Specifications.

AEC-Q200 Test Method

t : 1.6mm

(GRT03,15:0.8mm)

Fig.3

Fig.4

*2N(GRT03,15)

t : 1.6mm

(GRT03,15:0.8mm)

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Fig.1

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

ﾗﾝﾄﾞ

f4.5

Solder resist

Baked electrode

or copper foil

Iron Board

0.6L

Type

GRT03

0.3

0.9

0.3

GRT15

0.5

1.5

0.6

GRT18

0.6

2.2

0.9

GRT21

0.8

3.0

1.3

GRT31

2.0

4.4

1.7

GRT32

2.0

4.4

2.6

Type

GRT03

0.3

0.9

0.3

GRT15

0.4

1.5

0.5

GRT18

1.0

3.0

1.2

GRT21

1.2

4.0

1.65

GRT31

2.2

5.0

2.0

GRT32

2.2

5.0

2.9

Flexure：≦2

(Chip thickness＞0.85mm rank

High Dielectric Type)

Flexure：≦1

(Chip thickness≦0.85mm rank

High Dielectric Type)

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

JEMCGS-02088H 5

20 Capacitance Temperature R6 : Within ±15% The capacitance change should be measured after 5min at

Characteristics 　　　(-55℃to +85℃) each specified temperature stage.

Capacitance value as a reference is the value in step 3.

C8 : Within ±22%

　　　(-55℃to +105℃)

・Initial measurement

Perform a heat treatment at 150+0/-10℃for one hour

and then set for 24±2 hours at room temperature.

Perform the initial measurement.

■AEC-Q200 Murata Standard Specification and Test Methods

AEC-Q200 Test Item

Specifications.

AEC-Q200 Test Method

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

JEMCGS-02088H 6

1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K)

1.1 Minimum Quantity(pcs./reel)

GRT03

GRT18

1.2 Dimensions of Tape

(1)GRT03/15(Paper Tape W8P2 Code:D/E/J/F) (in mm)

*3 Nominal value

1.0±0.2

0.5±0.2

0.78

1.29

1.0±0.15

0.5±0.15

0.72

1.25

1.0±0.1

0.5±0.1

0.70

1.20

0.5±0.05

GRT15

1.0±0.05

0.5±0.05

0.2 +0.02/-0.04

0.65

1.15

0.8 max.

0.6±0.05

0.3±0.05

0.39

0.69

0.37

0.67

0.5 max.

GRT03

0.6±0.03

0.3±0.03

Type

Dimensions Tolerance(Chip)

A *3

B *3

8000

D/E

1000

4000

GRT32

2000

10000

2000

6000

4000

10000

3000

10000

GRT31

4000

10000

4000

10000

GRT21

4000

10000

3000

4000

10000

5(LWTDimensions

　　　　　Tolerance:±0.1min.)

10000(W8P2)

40000(W8P2)

5(LWTDimensions

　　　　　Tolerance:±0.05)

10000(W8P2)

20000(W8P1)

50000(W8P2)

GRT15

20000(W8P2)

50000(W8P2)

15000(W8P2)

30000(W8P1)

50000(W8P2)

Code:K

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

Package

GRT Type

Type

φ180mm reel

φ330mm reel

Code:D/E

Code:W

Code:L

Code:J/F

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

JEMCGP-01742H 7

　(2)GRT03/15Paper Tape W8P1 Code:W) (in mm)

W T

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

GRT15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

　(3)GRT18/21/31/32(Paper Tape) (in mm)

W T

1.6±0.1 0.8±0.1 0.8±0.1

1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

0.6±0.1

0.6+0/-0.15

0.85±0.1

0.85+0/-0.2

2.0±0.15 1.25±0.15 0.85±0.1

6 0.6±0.1

3.2±0.2 1.6±0.2

0.85±0.1

1.6±0.15

2.00±0.20

3.60±0.20

GRT21

2.0±0.1

1.25±0.1

1.55±0.15

GRT18

1.05±0.10

1.85±0.10

1.1 max.

2.30±0.15

GRT31

3.2±0.15

GRT03

0.5 max.

Type

Dimensions Tolerance(Chip)

Package

GRT Type

Type

Dimensions Tolerance(Chip)

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

JEMCGP-01742H 8

　(4)GRT21/31/32(Plastic Tape) (in mm)

W T

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20 1.7 max.

2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

3.2±0.15 1.6±0.15 1.15±0.1

1.15±0.15

C 1.6±0.2 2.5 max.

N 1.35±0.15 2.5 max.

D 2.0±0.2 3.0 max.

E 2.5±0.2 3.7 max.

GRT32

3.2±0.3

2.5±0.2

2.80±0.20

3.50±0.20

3.2±0.2

1.6±0.2

2.30±0.20

2.0 max.

GRT31

1.90±0.20

3.50±0.20

1.7 max.

GRT21

1.50±0.20

Type

Dimensions Tolerance(Chip)

Package

GRT Type

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01742H 9

Package

GRT Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

φ21±0.8

ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRT32 max.

16.5 max.

10±1.5

φ180+0/-3.0

φ330±2.0

φ50 min.

φ13±0.5

2.0±0.5

Chip

(in mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01742H 10

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