Murata ZRA21MR61C226ME11 Series Bedienungsanleitung

ZRA21MR61C226ME11_ (, X5R:EIA, 22uF, DC16V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

*Nominal value

4.Rated value

5.Package

Product specifications in this catalog are as of Apr.3,2018,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

(5) Nominal

Capacitance

mark

(4)

Rated

Voltage

Packaging Unit

DC 16 V

Temp. Range

(Ref.Temp.)

(8) Packaging

-15 to 15 %

-55 to 85 °C

(25 °C)

(3) Temperature Characteristics

(Public STD Code):X5R(EIA)

Only Reflow Soldering

L2*

2.0

W2*

1.25

This product specification is applied to Chip Multilayer Ceramic Capacitors on Interposer Board used for General Electronic equipment.

This product is applied for Only Reflow Soldering.

Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose

Specifications and Test

Methods

(Operating

Temp. Range)

Temp. coeff

or　Cap. Change

±20 %

(6)

Capacitance

Tolerance

22 uF

-55 to 85 °C

(1)-1 L1

(1)-2 W1

(2) T

f180mm Reel

EMBOSSED W8P4

3000 pcs./Reel

2.4±0.1

1.65±0.1

1.15+0.05/-0.15

0.7±0.1

0.8±0.1

(1)L/W

Dimensions (2)T

Dimensions (3)Temperature

Characteristics (4)Rated

Voltage (5)Nominal

Capacitance (6)Capacitance

Tolerance (8)Packaging Code



Code

ZRA 21 MR6 1C 226 M E11 L

ZRA21MR61C226ME11-01 1

■Specifications and Test Methods

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated voltage

range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.

4 Voltage proof No defects or abnormalities.

Measurement Point　　 :

Between the terminations

Test Voltage 　　　　　　 :

250% of the rated voltage

Applied Time :

1 to 5 s

Charge/discharge current :

50mA max.

To apply the test voltge through the Interposer board termination.

5 Insulation Resistance(I.R.)

∙F (Whichever is smaller) Measurement Point 　　: Between the terminations

Measurement Voltage :

DC Rated Voltage

Charging Time :

1 min

Charge/discharge current :

50mA max.

Measurement Temperature :

Room Temperature

To apply the test voltge through the Interposer board termination.

6 Capacitance Shown in Rated value.

Measurement Temperature :

Room Temperature

7 Dissipation Factor (D.F.) 0.1 max.

To apply the test voltge through the Interposer board termination.

Temperature No bias B3 : Within +/-15% (-25°C to +85°C) The capacitance change should be measured after 5 min.

Characteristics R6 : Within +/-15% (-55°C to +85°C) at each specified temp. stage.

of Capacitance

R7 　　: Within +/-15% (-55°C to +125°C) Capacitance value as a reference is the value in step 3.

C7 : Within +/-22% (-55°C to +125°C)

C8 : Within +/-22% (-55°C to +105°C) · Measurement Voltage : Less than 1.0Vrms

(Refer to the individual data sheet)

To apply the test voltge through the Interposer board termination.

･Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Applied Force　　　　　　　　: 10N

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with the

capacitor side.

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

Kind of Vibration :

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude :

1.5mm

D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Capacitance

Frequency

Voltage

C≦

(10V min.)

1.0+/-0.1kHz

1.0+/-0.2Vrms

C≦

(6.3V max.)

1.0+/-0.1kHz

0.5+/-0.1Vrms

C＞

120+/-24Hz

0.5+/-0.1Vrms

Step

Temperature(C)

Applying Voltage(VDC)

Reference Temp.+/-2

No bias

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp. +/-3

Reference Temp. +/-2

JEMCGS-05963 2

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test Pressurization method : Shown in Fig.2

Flexure　　　　: 1mm

Capacitance Within +/-10%

Holding Time 　 :

5+/-1s

Change

Soldering Method :

Reflow soldering

12 Solderability of 95% of the terminations is to be soldered evenly and

Test Method :

Solder bath method

Interposer board termination continuously.

Flux　　　　　　　　　　　　　　　 :

Solution of rosin ethanol 25(mass)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time

2+/-0.5s

Resistance Appearance No defects or abnormalities.

Test Conditions　　　　　　　 :

Reflow method

to Solder : Sn-3.0Ag-0.5Cu

Soldering Capacitance Within +/-7.5% Solder Temp. : 255+/-10℃[Peak Temperature]

Heat

Change Heat Time of over 200°C : 120s max.

Exposure Time : 24+/-2h

D.F. Within the specified initial value. Preheat :

150℃to 160℃for 2 min

I.R. Within the specified initial value. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

Voltage proof No defects. let sit for 24+/-2h at room temperature,then measure.

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Perform the five cycles according to the four heat treatments

shown in the following table.

Capacitance Within +/-7.5%

Change

D.F. Within the specified initial value.

I.R. Within the specified initial value. Exposure Time : 24+/-2h

Voltage proof No defects. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Test Temperature :

40+/-2℃

High

Test Humidity :

90%RH to 95%RH

Humidity Capacitance Within +/-12.5%

Test Time :

500+/-12h

(Steady) Change

Test Voltage 　　　　 :

DC Rated Voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

I.R.  let sit for 24+/-2h at room temperature,then measure.

· Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Test Temperature :

Max. Operating Temp. +/-3℃

Capacitance Within +/-12.5%

Test Time :

1000+/-12h

Change

Test Voltage 　　　　 :

100% of the rated voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

· Measurement after test

I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Step

Temp.(C)

Time

(min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-05963 3

Derating conditions on Voltage and Temperature (for Rated Voltage 100Vdc max.)

Test method : Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm

Copper foil thickness : 0.035mm

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

　Fig.3

SolderResist

ChipCapacitor

Land

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

Type

Dimension (mm)

ZRA21

1.2

4.0

1.65

Type

Dimension (mm)

ZRA21

1.2

4.0

1.65

Derated products*1 are suitable for use in circuits where continuous

applied voltage and temperature to the capacitor is derated (below

rated voltage and temperature).

A reliability assurance level equivalent to standard products*2 can be

secured by restricting the voltage and temperature according to the

derating conditions in the chart.

*1 Derated Products: The test voltage of these products is less than

150% of the rated voltage in the Durability / OperationalLife Test.

*2 Standard Products: The test voltage of these products is 150% of

the rated voltage and over in the Durability / OperationalLife Test.

JEMCGS-05963 4

There are only Plastic Tape for MLCC on Interposer.

1.Tape Carrier Packaging(Packaging Code:L/K)

1.1 Minimum Quantity(pcs./reel)



Plastic Tape

Code:K

ZRA21 M -

ZRA21 N8000

1.2 Dimensions of Tape

(in:mm)

L W T

M1.15+0.05/-0.15 1.7 max.

N1.35+0.05/-0.1 2.5 max.

ｔ

ZRA21

2.4±0.1

1.65±0.1

1.75±0.10

2.60±0.10

Type

Dimensions

3000

2000

Package

ZRA Type

Type



Plastic Tape

Code:L

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1

JEMCGP-01561H 5

Package

ZRA Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

ZRA21

16.5 max.

10±1.5

-3.0



 min.



2.0±0.5

ZRA

(in:mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

JEMCGP-01561H 6

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in:mm)

1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2. There are possibly

to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1 to 0.6N*in the direction as shown below.

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

Package

ZRA Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

Tail vacant Section

Chip-mounting Unit

Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

165～180°

Top tape

JEMCGP-01561H 7

Caution

■Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

　for the prevention of defects which might directly cause damage to the third party's life, body or property.

　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

　　　⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment

　　　⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.

■Storage and Operation condition

1. The performance of chip MLCC on Interposer (ZR□series, henceforth just "capacitors") may be affected by the

storage conditions. Please use them promptly after delivery.

1-1. Maintain appropriate storage for the capacitors using the following conditions:

Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.

High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging

materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.

In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,

also check the solderability before use.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen

sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes. The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and

carefully confirm the various characteristics in actual use conditions and the actual system.

[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]



-20

-10

-15

-5

Temperature (C)

-75 -50 -25 025 50 75 100 125 150

Capacitance Change(%)

-20

-10

-15

-5

Temperature (C)

-75 -50 -25 025 50 75 100

Capacitance Change(%)

JEMCGC-01559G 8

2.Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC capacitor

DC Voltage DC Voltage+AC AC Voltage Pulse Voltage

(E：Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4.Type of Applied Voltage and Self-heating Temperature

1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the

continuous application of an AC voltage or pulse voltage.

When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current

or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits

of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is

used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

The load should be contained so that the self-heating

　of the capacitor body remains below 20°C ,

　whenmeasuring at an ambient temperature of 25°C.

Caution

10 1 2 3

Current (Ar.m.s.)

4 5 6

Temperature Rise (℃)

100kHz

100 Ripple Current

500kHz

1MHz

[Example of Temperature Rise (Heat Generation) in Chip

Multilayer Ceramic Capacitors in Contrast to Ripple Current]

Sample: R(R1) characteristics 10 Rated voltage: DC10V

JEMCGC-01559G 9

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type

capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a

capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change

sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the

capacitance.

(1) Determine whether the capacitance change caused

by the applied voltage is within the allowed range .

(2) In the DC voltage characteristics, the rate of

capacitance change becomes larger as voltage

increases, even if the applied voltage is below

the rated voltage. When a high dielectric constant

type capacitor is used in a circuit that requires a

tight (narrow) capacitance tolerance (e.g., a time

constant circuit), please carefully consider the

voltage characteristics, and confirm the various

characteristics in the actual operating conditions

　of the system.

2. The capacitance values of high dielectric

constant type capacitors changes depending

on the AC voltage applied.

Please consider the AC voltage characteristics

when selecting a capacitor to be used in a

AC circuit.

6. Capacitance Aging

[Example of Change Over Time (Aging characteristics) ]

1. The high dielectric constant type capacitors

have an Aging characteristic in which the capacitance

value decreases with the passage of time.

When you use a high dielectric constant type

capacitors in a circuit that needs a tight (narrow)

capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the characteristics

of these capacitors, such as their aging, voltage,

and temperature characteristics. In addition,

check capacitors using your actual appliances

at the intended environment and operating conditions.

7.Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or

a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability

may be deteriorated.

3. When printed circuit boards are piled up or handled, the corner

　of another printed circuit board

should not be allowed to hit the capacitor in order to avoid

a crack or other damage to the capacitor.

Caution

-100

-80

-60

-40

-20

010 20 30

DC Voltage (V) 40 50

[Example of DC Voltage Characteristics]

Sample: R(R1) Characteristics 

Capacitance Change (%)

00.5 1

AC Voltage (Vr.m.s.) 1.5 2

[Example of AC Voltage Characteristics]

Sample: X7R(R7) Characteristics 

Capacitance Change (%)

-10

-20

-30

-40

-50

-60

Floor

Crack

Mounting printed circuit board

Crack

-10

-20

-30

-40

100

1000

10000

Time(h)

Capacitance Change(%)

C0G(5C)

X7R(R7)

X5R(R6)

JEMCGC-01559G 10

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