NEC V850/SB1TM Bedienungsanleitung

User’s Manual

V850/SB1TM, V850/SB2TM

32-Bit Single-Chip Microcontroller

Hardware

µµ

PD703030A

µµ

PD703034A

µµ

PD703030AY

µµ

PD703034AY

µµ

PD703031A

µµ

PD703035A

µµ

PD703031AY

µµ

PD703035AY

µµ

PD703032A

µµ

PD703036A

µµ

PD703032AY

µµ

PD703036AY

µµ

PD703033A

µµ

PD703037A

µµ

PD703033AY

µµ

PD703037AY

µµ

PD70F3032A

µµ

PD70F3035A

µµ

PD70F3032AY

µµ

PD70F3035AY

µµ

PD70F3033A

µµ

PD70F3037A

µµ

PD70F3033AY

µµ

PD70F3037AY

Printed in Japan

Document No. U13850EJ4V0UM00 (4th edition)

Date Published April 2001 N CP(K)

1998©

1999

2000

User’s Manual U13850EJ4V0UM

[MEMO]

User’s Manual U13850EJ4V0UM 3

NOTES FOR CMOS DEVICES

1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimatelydegradethedeviceoperation. Stepsmustbetakentostopgenerationofstaticelectricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulatorsthateasilybuildstaticelectricity. Semiconductordevicesmustbestoredandtransported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wriststrap. Semiconductordevicesmustnotbetouchedwith barehands. Similarprecautionsneed

to be taken for PW boards with semiconductor devices on it.

2 HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided

totheinputpins, it is possible that aninternalinputlevelmaybegenerated due to noise, etc., hence

causingmalfunction. CMOSdevicesbehave differentlythanBipolarorNMOSdevices. Inputlevels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to V

or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

3 STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does

not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the

reset signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

Purchase of NEC I2C components conveys a license under the Philips I2C Patent Rights to use these

components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined

by Philips.

V850 Family, V850/SA1, and V850/SB1, V850/SB2, IEBus, and Inter Equipment Bus are trademarks of NEC

Corporation.

Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or

other countries.

The export of these products from Japan is regulated by the Japanese government. The export of some or all of these

products may be prohibited without governmental license. To export or re-export some or all of these products from a

country other than Japan may also be prohibited without a license from that country. Please call an NEC sales

representative.

4User’s Manual U13850EJ4V0UM

License not needed:

PD70F3032A, 70F3032AY, 70F3033A, 70F3033AY,

70F3035A, 70F3035AY, 70F3037A, 70F3037AY

The customer must judge the need for license:

PD703030A, 703030AY, 703031A, 703031AY, 703032A,

703032AY, 703033A, 703033AY, 703034A, 703034AY,

703035A, 703035AY, 703036A, 703036AY, 703037A,

703037AY

M8E 00.4

The information in this document is current as of January, 2001. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or

data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all

products and/or types are available in every country. Please check with an NEC sales representative

for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.

NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of

third parties by or arising from the use of NEC semiconductor products listed in this document or any other

liability arising from the use of such products. No license, express, implied or otherwise, is granted under any

patents, copyrights or other intellectual property rights of NEC or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of customer's equipment shall be done under the full

responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third

parties arising from the use of these circuits, software and information.

While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers

agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize

risks of damage to property or injury (including death) to persons arising from defects in NEC

semiconductor products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment, and anti-failure features.

NEC semiconductor products are classified into the following three quality grades:

"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products

developed based on a customer-designated "quality assurance program" for a specific application. The

recommended applications of a semiconductor product depend on its quality grade, as indicated below.

Customers must check the quality grade of each semiconductor product before using it in a particular

application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's

data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not

intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness

to support a given application.

(Note)

(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.

(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for

NEC (as defined above).

•

User’s Manual U13850EJ4V0UM 5

Regional Information

Some information contained in this document may vary from country to country. Before using any NEC

product in your application, pIease contact the NEC office in your country to obtain a list of authorized

representatives and distributors. They will verify:

•

Device availability

•

Ordering information

•

Product release schedule

•

Availability of related technical literature

•

Development environment specifications (for example, specifications for third-party tools and

components, host computers, power plugs, AC supply voltages, and so forth)

•

Network requirements

In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary

from country to country.

NEC Electronics Inc. (U.S.)

Santa Clara, California

Tel: 408-588-6000

800-366-9782

Fax: 408-588-6130

800-729-9288

NEC Electronics (Germany) GmbH

Duesseldorf, Germany

Tel: 0211-65 03 02

Fax: 0211-65 03 490

NEC Electronics (UK) Ltd.

Milton Keynes, UK

Tel: 01908-691-133

Fax: 01908-670-290

NEC Electronics Italiana s.r.l.

Milano, Italy

Tel: 02-66 75 41

Fax: 02-66 75 42 99

NEC Electronics (Germany) GmbH

Benelux Office

Eindhoven, The Netherlands

Tel: 040-2445845

Fax: 040-2444580

NEC Electronics (France) S.A.

Velizy-Villacoublay, France

Tel: 01-3067-5800

Fax: 01-3067-5899

NEC Electronics (France) S.A.

Madrid Office

Madrid, Spain

Tel: 091-504-2787

Fax: 091-504-2860

NEC Electronics (Germany) GmbH

Scandinavia Office

Taeby, Sweden

Tel: 08-63 80 820

Fax: 08-63 80 388

NEC Electronics Hong Kong Ltd.

Hong Kong

Tel: 2886-9318

Fax: 2886-9022/9044

NEC Electronics Hong Kong Ltd.

Seoul Branch

Seoul, Korea

Tel: 02-528-0303

Fax: 02-528-4411

NEC Electronics Singapore Pte. Ltd.

Novena Square, Singapore

Tel: 253-8311

Fax: 250-3583

NEC Electronics Taiwan Ltd.

Taipei, Taiwan

Tel: 02-2719-2377

Fax: 02-2719-5951

NEC do Brasil S.A.

Electron Devices Division

Guarulhos-SP, Brasil

Tel: 11-6462-6810

Fax: 11-6462-6829

J01.2

6User’s Manual U13850EJ4V0UM

Major Revisions in This Edition

Page Description

p. 33 Modification of 1.2.3 Ordering information (V850/SB1)

p. 43 Modification of 1.3.3 Ordering information (V850/SB2)

p. 62 Modification of description in 2.3 (5) P40 to P47 (Port 4)

p. 63 Modification of description in 2.3 (6) P50 to P57 (Port 5)

p. 63 Modification of description in 2.3 (7) P60 to P65 (Port 6)

p. 64 Modification of description in 2.3 (9) P90 to P96 (Port 9)

p. 67 Modification of Caution in 2.3 (11) (b) (ii) WAIT (Wait)

p. 67 Addition of 2.3 (14) CLKOUT (Clock Out)

p. 154 Addition of 5.8 (1) Acknowledging interrupt servicing after execution of EI instruction

p. 173 Addition of 6.6 Notes on Power Save Function

p. 177 Modification of Caution in 7.1.3 (2) Capture/compare registers n0 (CR00, CR10)

p. 178 Modification of Caution in 7.1.3 (3) Capture/compare registers n1 (CR01, CR11)

p. 206 Modification of Figure 7-34 Data Hold Timing of Capture Register

p. 206 Addition of 7.2.7 (6) (c) One-shot pulse output function

p. 348 Modification of Figure 11-2 A/D Converter Mode Register 1 (ADM1)

p. 356 Addition of description in 11.5 Low Power Consumption Mode

p. 423 Addition of Caution in CHAPTER 18 FLASH MEMORY

p. 444 Addition of Table 19-5 Acknowledge Signal Output Condition of Control Field

p. 452 Addition of description 19.1.8 Bit format

p. 457 Modification of Caution in 19.3.2 (1) (a) Communication enable flag (ENIEBUS)

p. 463 Addition of Note in Figure 19-18 Timing of INTIE2 Interrupt Generation in Locked State (for (4) and

(5))

p. 464 Addition of Remark in 19.3.2 (6) IEBus telegraph length register (DLR)

p. 466 Addition of Remark in 19.3.2 (7) IEBus data register (DR)

p. 466 Addition of description in 19.3.2 (7) (a) When transmission unit

p. 467 Modification of description in 19.3.2 (8) (a) Slave request flag (SLVRQ)

p. 468 Addition of Caution in 19.3.2 (8) (b) Arbitration result flag (ARBIT)

p. 469 Addition of description for Caution in 19.3.2 (8) (e) Lock status flag (LOCK)

p. 470 Addition of Table 19-8 Reset Condition of Each Flag of ISR Register

p. 480 Addition of 19.4.3 Communication error source processing list

p. 490 Modification of Figure 19-34 Master Transmission (Interval of Interrupt Occurrence)

p. 491 Modification of Figure 19-35 Master Reception (Interval of Interrupt Occurrence)

p. 492 Modification of Figure 19-36 Slave Transmission (Interval of Interrupt Occurrence)

p. 493 Modification of Figure 19-37 Slave Reception (Interval of Interrupt Occurrence)

The mark shows major revised points.

User’s Manual U13850EJ4V0UM 7

INTRODUCTION

Readers This manual is intended for users who wish to understand the functions of the V850/SB1 and

V850/SB2 and design application systems using the V850/SB1 or V850/SB2.

Purpose This manual is intended to give users to an understanding of the hardware functions described in the

Organization below.

Organization The V850/SB1, V850/SB2 User’s Manual is divided into two parts: hardware (this manual) and

architecture (V850 FamilyTM User’s Manual Architecture).

Hardware Architecture

•Pin function

•CPU function

•Internal peripheral function

•Flash memory programming

•IEBus controller (V850/SB2 only)

•Data type

•Register set

•Instruction format and instruction set

•Interrupt and exception

•Pipeline operation

How to Read This Manual It is assumed that the reader of this manual has general knowledge in the fields of

electrical engineering, logic circuits, and microcontrollers.

To find out the details of a register whose name is known:

→Refer to APPENDIX A REGISTER INDEX.

To find out the details of a function, etc., whose name is known:

→Refer to APPENDIX C INDEX.

To understand the details of a instruction function:

→Refer to V850 Family User’s Manual Architecture available separately.

How to read register formats:

→Names of bits whose numbers are enclosed in a square are defined in the device file under

reserved words.

To understand the overall functions of the V850/SB1 and V850/SB2:

→Read this manual in accordance with the CONTENTS.

8User’s Manual U13850EJ4V0UM

Conventions Data significance: Higher digits on the left and lower digits on the right

Active low: xxx (overscore over pin or signal name)

Memory map address: Higher addresses at the top and lower addresses at the bottom

Note: Footnote for items marked with Note in the text

Caution: Information requiring particular attention

Remark: Supplementary information

Number representation: Binary … xxxx or xxxxB

Decimal … xxxx

Hexadecimal … xxxxH

Prefixes indicating power of 2 (address space, memory capacity):

K (kilo): 210 … 1024

M (mega): 220 … 10242

G (giga): 230 … 10243

Related Documents The related documents indicated in this publication may include preliminary versions.

However, preliminary versions are not marked as such.

Related documents for V850/SB1 and V850/SB2

Document Name Document No.

V850 Family User’s Manual Architecture U10243E

V850/SB1, V850/SB2 User’s Manual Hardware This manual

PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, 70F3033AY Data Sheet U14734E

PD703032A, 703032AY, 70F3032A, 70F3032AY Data Sheet U14893E

PD703034A, 703034AY, 703035A, 703035AY, 70F3035A, 70F3035AY Data Sheet U14780E

PD703037A, 703037AY, 70F3037A, 70F3037AY Data Sheet U14894E

User’s Manual U13850EJ4V0UM 9

Related documents for development tool (user’s manual)

Document Name Document No.

IE-703002-MC (In-Circuit Emulator) U11595E

IE-703037-MC-EM1 (In-Circuit Emulator Option Board) U14151E

Operation U14568E

C Language U14566E

Assembly Language U14567E

CA850 (Ver. 2.30 or Later) (C Compiler

Package)

Project Manager U14569E

ID850 (Ver. 2.20 or Later) (Integrated Debugger) Operation WindowsTM Based U14580E

SM850 (Ver. 2.20 or Later) (System Simulator) Operation Windows Based U14782E

SM850 (Ver. 2.00 or Later) (System Simulator) External Part User Open Interface Specifications U14873E

Basics U13430E

Installation U13410E

RX850 (Ver. 3.13 or Later) (Real-Time OS)

Technical U13431E

Fundamental U13773E

Installation U13774E

RX850 Pro (Ver. 3.13) (Real-Time OS)

Technical U13772E

RD850 (Ver. 3.01) (Task Debugger) U13737E

RD850 Pro (Ver. 3.01) (Task Debugger) U13916E

AZ850 (Ver. 3.0) (System Performance Analyzer) Operation U14410E

PG-FP3 (Flash Memory Programmer) U13502E

User’s Manual U13850EJ4V0UM

CONTENTS

CHAPTER 1 INTRODUCTION .......................................................................................................... 29

1.1 General .................................................................................................................................. 29

1.2 V850/SB1 ............................................................................................................................... 31

1.2.1 Features (V850/SB1) ...............................................................................................................31

1.2.2 Application fields (V850/SB1) ..................................................................................................32

1.2.3 Ordering information (V850/SB1).............................................................................................33

1.2.4 Pin configuration (top view) (V850/SB1) ..................................................................................34

1.2.5 Function blocks (V850/SB1) ....................................................................................................37

1.3 V850/SB2 ............................................................................................................................... 41

1.3.1 Features (V850/SB2) ...............................................................................................................41

1.3.2 Application fields (V850/SB2) ..................................................................................................42

1.3.3 Ordering information (V850/SB2).............................................................................................43

1.3.4 Pin configuration (top view) (V850/SB2) ..................................................................................44

1.3.5 Function blocks (V850/SB2) ....................................................................................................47

CHAPTER 2 PIN FUNCTIONS......................................................................................................... 51

2.1 List of Pin Functions ............................................................................................................ 51

2.2 Pin States .............................................................................................................................. 58

2.3 Description of Pin Functions............................................................................................... 59

2.4 I/O Circuit Types, I/O Buffer Power Supply and Connection of Unused Pins ................ 69

2.5 I/O Circuit of Pins.................................................................................................................. 71

CHAPTER 3 CPU FUNCTIONS ....................................................................................................... 73

3.1 Features................................................................................................................................. 73

3.2 CPU Register Set .................................................................................................................. 74

3.2.1 Program register set ................................................................................................................75

3.2.2 System register set ..................................................................................................................76

3.3 Operation Modes .................................................................................................................. 78

3.4 Address Space ...................................................................................................................... 79

3.4.1 CPU address space .................................................................................................................79

3.4.2 Image .......................................................................................................................................80

3.4.3 Wrap-around of CPU address space .......................................................................................81

3.4.4 Memory map ............................................................................................................................82

3.4.5 Area .........................................................................................................................................83

3.4.6 External expansion mode.........................................................................................................90

3.4.7 Recommended use of address space .....................................................................................93

3.4.8 Peripheral I/O registers ............................................................................................................95

3.4.9 Specific registers....................................................................................................................103

CHAPTER 4 BUS CONTROL FUNCTION.................................................................................... 106

4.1 Features............................................................................................................................... 106

4.2 Bus Control Pins and Control Register............................................................................ 106

4.2.1 Bus control pins .....................................................................................................................106

Dieses Handbuch passt für folgende Modelle

Inhaltsverzeichnis

Andere NEC Mikrocontroller Handbücher

NEC

NEC EZ-0009 Bedienungsanleitung

NEC

NEC 78K0/Fx2 Bedienungsanleitung

NEC

NEC mPD784225 Series Bedienungsanleitung

NEC

NEC V850/SA1 mPD703015 Bedienungsanleitung

NEC

NEC mPD780024AS Series Bedienungsanleitung

NEC

NEC MuPD78F0132H Bedienungsanleitung

NEC

NEC mPD789026 Subseries Bedienungsanleitung

NEC

NEC V850E/MA1 Bedienungsanleitung

NEC

NEC UPD789026 Series Bedienungsanleitung

NEC

NEC V850E/MA1 Montage- und Bedienungsanleitung

NEC

NEC mPD78F0730 Bedienungsanleitung

NEC

NEC mPD780973 Series Bedienungsanleitung

NEC

NEC mPD780852 Series Bedienungsanleitung

NEC

NEC V850E/MS1 UPD703100 Bedienungsanleitung

NEC

NEC mPD780208 Subseries Bedienungsanleitung

NEC

NEC 78K/0S Series Bedienungsanleitung

NEC

NEC V850E/RS1 Bedienungsanleitung

NEC

NEC PD789860 Bedienungsanleitung

NEC

NEC mPD780065 Series Bedienungsanleitung

NEC

NEC V850ES/DJ2 Bedienungsanleitung

NEC

NEC 78K0R/KE3 Bedienungsanleitung

NEC

NEC 78K0S/KA1+ Bedienungsanleitung

NEC

NEC mPD789426 Series Bedienungsanleitung

NEC

NEC V850E/PH2 Bedienungsanleitung

Beliebte Mikrocontroller Handbücher anderer Marken

AMS

AMS AS7261 Demo Kit Bedienungsanleitung

Novatek

Novatek NT6861 Bedienungsanleitung

Espressif Systems

Espressif Systems ESP8266 SDK Einrichtungshandbuch

Nuvoton

Nuvoton ISD61S00 ChipCorder Leitfaden

STMicrolectronics

STMicrolectronics ST7 Assembler Linker Bedienungsanleitung

Texas Instruments

Texas Instruments Chipcon CC2420DK Bedienungsanleitung

Lantronix

Lantronix Intrinsyc Open-Q 865XR SOM Bedienungsanleitung

Mikroe

Mikroe SEMITECH N-PLC Click Montage- und Bedienungsanleitung

Intel

Intel Agilex Bedienungsanleitung

Cypress

Cypress CY4607 HX2VL Bedienungsanleitung

DIGITAL-LOGIC

DIGITAL-LOGIC MICROSPACE Bedienungsanleitung

Texas Instruments

Texas Instruments TMS320F2837 D Series Bedienungsanleitung

CYPRES

CYPRES CY14NVSRAMKIT-001 Bedienungsanleitung

Texas Instruments

Texas Instruments INA-DUAL-2AMP-EVM Bedienungsanleitung

Espressif Systems

Espressif Systems ESP8266EX Betriebsanleitung

Abov

Abov AC33M8128L Bedienungsanleitung

Laird

Laird BL654PA Bedienungsanleitung

Silicon Laboratories

Silicon Laboratories C8051F800 Bedienungsanleitung