NXP Semiconductors RD9Z1-638BJBEVM Bedienungsanleitung

UM11396

RD9Z1-638BJBEVM Reference Design

Rev. 1 — 15 April 2020 User manual

RD9Z1-638BJBEVM

Figure 1. RD9Z1-638BJBEVM

Important Notice

NXP provides the enclosed product(s) under the following conditions:

This reference design is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a

sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This reference design

may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via

off-the-shelf cables. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design

as well as attention to supply filtering, transient suppression, and I/O signal quality.

The goods provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations,

including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product,

it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks

associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize

inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services.

Should this reference design not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and

will be replaced by a new kit.

NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or

guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the

application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or

incidental damages. Typical parameters can and do vary in different applications and actual performance may vary over time. All operating

parameters, including Typical, must be validated for each customer application by customer’s technical experts.

NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed, intended, or authorized

for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or

for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur.

Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer shall indemnify and hold

NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and

reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or

unauthorized use, even if such claim alleges NXP was negligent regarding the design or manufacture of the part.

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RD9Z1-638BJBEVM Reference Design

User manual Rev. 1 — 15 April 2020

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1 Introduction

This user manual is intended for engineers who use the RD9Z1-638BJBEVM reference

design kit to analyze and test designs that are built around NXP's MM9Z1_638 intellegent

battery sensor device. The user manual provides all of the information required to use

the reference design kit, including connecting the hardware, installing the associated

software tools and configuring the evaluation environment.

2 Finding Kit Resources and Information on the NXP Web Site

NXP Semiconductors provides online resources for this evaluation board and its

supported devices on http://www.nxp.com.

The tool summary page for the RD9Z1-638BJBEVM reference design is at http://

www.nxp.com/RD9Z1-638BJBEVM. The tool summary page provides information related

to buying and using the reference design kit. The page contains the following tabs:

•Overview – A brief summary of the reference design kit and its capabilities

•Specifications – An overview of the technical and functional specifications for the kit

•Buy – Purchasing information and a review of the reference design kit contents

•Design Resources – All of the information and resources required by users who have

already purchased the RD9Z1-638BJBEVM reference design. This section includes:

–RD9Z1-638BJBEVM - Getting Started – Click on this link for information on setting up

the hardware, configuring the software and running an evaluation.

–Schematics – Click on this link to download a .pdf version of the RD9Z1-638BJBEVM

board schematics.

–Design Files/BOM – Click on this link to download the RD9Z1-638BJBEVM board Bill

of Materials, the Gerber files for the PCB assemblies and all of the design files for the

CodeWarrior projects provided as examples.

2.1 Collaborate in the NXP community

The NXP community is for sharing ideas and tips, asking and answering technical

questions and receiving input on various embedded design topics.

The NXP community is at http://community.nxp.com.

3 Getting Ready

Aside from the kit contents, working with the RD9Z1-638BJBEVM reference design

requires additional hardware and software installed on a Windows PC workstation.

3.1 Kit contents

The RD9Z1-638BJBEVM reference design kit contains the following items:

•Evaluation board in an antistatic bag

•10-pin high-voltage connector cable

•7-pin high-voltage connector cable

•5-pin high-voltage connector cable

•4-pin low-voltage connector cable

•Quick Start Guide

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User manual Rev. 1 — 15 April 2020

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3.2 Additional hardware

In addition to the kit contents, the following hardware components are required to support

an evaluation.

•USB-enabled PC Workstation with Windows 7 or above

•Low-voltage DC power supply, 5 V to 12 V output with current limit set initially to 1.5 A

•High-voltage DC power supply, 0 V to 1000 V output

•Current load, 0 A to 500 A

•CAN card and cable (optional)

•PEmicro's Multilink Universal Debug Probe

3.3 Windows PC workstation

This evaluation board must be connected to a PC workstation running 32-bit and 64-bit

versions of Windows 7 or above.

3.4 Software

Using the RD9Z1-638BJBEVM board requires that the software listed below be

installed on the PC workstation. The reference design projects are available on the

RD9Z1-638BJBEVM tool summary page at http://www.nxp.com/RD9Z1-638BJBEVM.

•Codewarrior 10.2 or above

•The RD9Z1-638BJBEVM reference design projects

4 Getting to Know the Hardware

The RD9Z1-638BJBEVM reference design kit provides a platform for evaluating designs

that implement NXP’s MM9Z1_638 Battery Monitoring System device. It connects

to a power distribution unit (PDU) and enables voltage sensing, current sensing,

temperature sensing and diagnostics of the contactor status. The kit supports evaluations

in conjunction with a CAN network and is ideal for prototyping High-Voltage Battery

Junction Box (HV-BJB) systems.

4.1 RD9Z1-638BJBEVM features

•Power supply input from 5 VDC to 12 VDC

•Up to seven voltage sensing channels for high-voltage measurements

•One current sensing channel to measure charge current and discharge current

•One temperature sensing channel to measure shunt resistor temperature for calibration

•Integrated insulation resistance measurement

•One channel isolated CAN communication to BMU/VCU

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User manual Rev. 1 — 15 April 2020

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4.2 Block diagram

aaa-037026

50 µΩ

NTC

Main_Neg

HV connector

VSENSE0

VSENSE1

VSENSE2

VSENSE3

OPTO-MOS

LDO REG

TJA1052I

VDDX

VSUP +5 V/+12 V from BMU

GND from BMU

CAN_H

CAN_L

LINK-

VCC

GND

VCCA

AGND

DGND

I+

PTB4

PTB5

I-

HV connector

HV_BAT_PACK

LV connector

MM9Z1_638

Pre-charge

Pre-charge R

Main_Pos

PDU_FUSE

Charger_Pos Relay

A B C

LINK+

FC+/SC+

HV Domain LV DomainPUD/BDU

SYSTEM

OUTLINE

Figure 2. RD9Z1-638BJBEVM block diagram

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User manual Rev. 1 — 15 April 2020

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4.3 Board components

Figure 3. RD9Z1-638BJBEVM board components

Table 1. RD9Z1-638BJBEVM board components

No. Label Device Description Features

1 U1 MM9Z1_638 Intelligent

Battery

Sensor

•Wide range of battery current measurements;

On-chip temperature measurement

•Four battery voltage measurements with

internal resistor dividers; Up to five direct

voltage measurements for use with an external

resistor divider

•Measurement synchronization between voltage

channels and current channels

•Five external temperature sensor inputs with

an internal supply for external sensors

•Low-power modes with low-current operation

•Multiple wake-up sources: LIN, timer, high-

voltage input, external CAN interface, and

current threshold and integration

•Precision internal oscillator and connections for

external crystal

•LIN 2.2/ 2.1/ 2.0 protocol and physical interface

•msCAN protocol controller and supply

capability for 8 and 14 pin CAN interfaces

•MM9Z1_638: S12Z microcontroller

2 J6 High-voltage

connector 2

1x7 power

plug

connector

See Table 5

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No. Label Device Description Features

3 J8 High-voltage

connector 1

1x5 power

plug

connector

See Table 4

4 JP1 High-voltage

connector 3

1x10

power plug

connector

See Table 6

5 U46

−U50

Panasonic

AQV258HAX

MOSFET

relay

6 T2 TI SN6501

QDBVRQ1

Push-

pull driver

for small

transformers

AEC-Q qualified

7 U5 TI 760390015 PMIC

transformer

driver

AEC-Q qualified

8 J7 Low-voltage

connector

1x4 power

plug

connector

See Table 3

9 L1 EPCOS/TDK

B82789C

0104N002

Power line

choke

AEC-Q qualified

10 U3 NXP

TJA1052IT/5Y

High-

speed CAN

transceiver

•Isolator and Transceiver integrated into a

single SO16 package, reducing board space

•ISO 11898-2:2003 compliant

•Flawless cooperation between the Isolator and

the Transceiver

–Fewer components improves reliability in

applications

–Guaranteed performance (eg. max loop

delay <220 ns)

•Electrical transient immunity of 45 kV/μs (typ)

•AEC-Q100 qualified

•Suitable for use in 12 V and 24 V systems;

compatible with 3 V to 5 V microcontrollers

•Bus common mode voltage (Vcm) = ±25 V

•Low Electro Magnetic Emission (EME) and

high Electro Magnetic Immunity (EMI)

•Dark green product (halogen free and

Restriction of Hazardous Substances (RoHS)

compliant)

11 TP89,

TP90,

TP91

NA Test points See Table 7

12 J1 Connector BDM

connector

Connector for PEMicro's Multilink Debug Probe

(See Table 2)

13 NA NA Shunt Current measurement shunt

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4.4 Connectors

The RD9Z1-638BJBEVM board has five user-accessible connectors. Table 2 – Table 6

describe the pin functions for each connector.

Table 2. BDM Connector (J1)

Pin Signal name Description

J1_1 BKGD Connects to MM9Z1_638 BKGD pin to support background debug

communication

J1_2 Ground Low-voltage ground

J1_3 NC Not connected

J1_4 RESET Connects to MM9Z1_638 RESET pin

J1_5 NC Not connceted

J1_6 VDDX Connects to MM9Z1_638 VDDX pin for 5.0 V and External CAN

Supply

Table 3. Low-voltage connector (J7)

Pin Signal name Description

J7_1 CAN-H Connects to CAN communication cable

J7_2 CAN-L Connects to CAN communication cable

J7_3 +12V_LV Low-voltage power supply (5 V to 12 V)

J7_4 GND_LV Low-voltage ground

Table 4. High-voltage connector 1 (J8)

Pin Signal name Description

J8_1 Ground High-voltage ground

J8_2 NC Not connected

J8_3 NC Not connected

J8_4 NC Not connected

J8_5 Main Neg- Main negative contactor

Table 5. High-voltage connector 2 (J6)

Pin Signal name Description

J6_1 VSENSE2_HV High-voltage connection to MM9Z1_638 VSENSE2 precision battery

input pin

J6_2 NC Not connected

J6_3 NC Not connected

J6_4 VSENSE1_HV High-voltage connection to MM9Z1_638 VSENSE1 precision battery

input pin

J6_5 NC Not connected

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Pin Signal name Description

J6_6 NC Not connected

J6_7 VSENSE0_HV High-voltage connection to MM9Z1_638 VSENSE0 precision battery

input pin

Table 6. High-voltage connector 3 (JP1)

Pin Signal name Description

JP1_1 HV+ High-voltage pack+

JP1_2 NC Not connected

JP1_3 NC Not connected

JP1_4 PTB1_HV High-voltage connection to MM9Z1_638 PTB1 analog input and

general purpose I/O pin

JP1_5 NC Not connected

JP1_6 NC Not connected

JP1_7 PTB2_HV High-voltage connection to MM9Z1_638 PTB2 analog input and

general purpose I/O pin

JP1_8 NC Not connected

JP1_9 NC Not connected

JP1_10 PTB3_HV High-voltage connection to MM9Z1_638 PTB3 analog input and

general purpose I/O pin

4.5 Test points

The RD9Z1-638BJBEVM board has three test points. Table 7 describes the function of

each test point.

Table 7. Test points

Label Signal name Description

TP89 VSUP Test point for power supply connection. In conjunction with TP90,

serves as test point for power supply connected to MM9Z1_638

TP90 Ground Test point for ground connection. In conjunction with TP89, serves

as test point for ground connected to MM9Z1_638

TP91 PA3 Test point for connection to MM9Z1_638 PA3 general purpose port

4.6 Configuring the hardware for setup using the RD9Z1-638BJBEVM

board

This section describes how to configure the hardware required to use the

RD9Z1-638BJBEVM board in an evaluation environment.

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Figure 4. Hardware configuration

4.6.1 Connecting to the battery junction box

Batteries are connected to the board by means of the metal current shunt mounted on

the board.

1. Connect the negative pole of the HV Battery Junction Box to one side of the board's

metal shunt.

2. Connect the positive pole of the HV Battery Junction Box to the other side of the

board's metal shunt.

4.6.2 Configuring the high-voltage domain

Configuring the kit's high-voltage components consists of the following steps.

1. Open high-voltage connector 1 (J8) on the RD9Z1-638BJBEVM board and attach the

5-pin connector cable as follows:

•Connect J8_1 to the HV ground.

•Connect J8_5 to the sensing position E.

2. Open high-voltage connector 2 (J6) on the RD9Z1-638BJBEVM board and attach the

7-pin connector cable as follows:

•Connect J6_1 to high-voltage sensing position F.

•Connect J6_4 to high-voltage sensing position G.

•Connect J6_7 to high-voltage sensing position H.

3. Open high-voltage connector 3 (JP1) ) on the RD9Z1-638BJBEVM board and attach

the 10-pin connector cable as follows:

•Connect JP1_1 to high-voltage sensing position A.

•Connect JP1_4 to high-voltage sensing position B.

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•Connect JP1_7 to high-voltage sensing position C.

•Connect JP1_7 to high-voltage sensing position D.

4.6.3 Configuring the low-voltage domain

The low-voltage domain consists of a low-voltage power supply connected to the

RD9Z1-638BJBEVM board's low-voltage connector (J7). Note that two of the pins in the

low-voltage connector are reserved for the CAN connection.

1. Open low-voltage connector (J7) on the RD9Z1-638BJBEVM board and attach the 4-

pin connector cable as follows:

•The first two terminals of the 4-pin cable are reserved for connecting to a CAN

network. See Section 6 "Setting up a CAN GUI (Optional)" below.

•Using the third terminal on the cable, connect J7_3 to the low-voltage power supply.

•Using the fourth terminal on the cable, connect J7_4 to the low-voltage ground.

4.6.4 Connecting to the PC

Configuring the appropriate connections to link the evaluation environment to the PC

workstation consists of the following steps:

1. Connecting the PEmicro Multilink Universal Debug Probe

•Open the probe cover and attach PEmicro's six-pin ribbon cable to the probe’s six-

pin header (Port C).

•Plug the other end of the 6-pin cable into the RD9Z1-638BJBEVM board’s BDM

connector (J1).

•Plug the PEmicro's USB cable into the PEmicro Universal Debug Probe’s USB port

and connect the other end of the cable to a USB port on the PC workstation.

2. Connecting the CAN card (Optional)

•Using the 4-pin cable, connect the cable’s first terminal to pin J7_1 on the

RD9Z1-638BJBEVM board’s low-voltage connector (J7). Connect the other end of

this line to the CANH connection on the CAN card.

•Connect the 4-pin cable’s second terminal to pin J7_2 on the evaluation board’s

low-voltage connector. Connect the other end of this line to the CANL connection on

the CAN card.

•Connect the CAN card to the PC workstation.

5 Installing the Software

The following section describes how to install and configure the Codewarrior Integrated

Development Envionment (IDE) software required to run the demonstration examples

and to exercise the RD9Z1-638BJBEVM in an evaluation environment.

5.1 Installing CodeWarrior

NXP's CodeWarrior provides an integrated environment that brings together all of the

software resources and capabilites requried to use the RD9Z1-638BJBEVM reference

design kit. If a previous version of CodeWarrior exists on the PC attached to the

RD9Z1-638BJBEVM board, check to assure that the version is at least 10.2 or later. If

CodeWarrior has not been installed, the following steps describe the installation process.

1. Go to http://www.nxp.com and navigate to the CodeWarrior Development Tools site.

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