NXP Semiconductors LPC5410x Bedienungsanleitung

UM10850

LPC5410x User manual

Rev. 2.4 — 13 September 2016 User manual

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Keywords LPC5410x, ARM Cortex-M4, ARM Cortex-M0+, microcontroller, sensor

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Abstract LPC5410x User Manual

User manual Rev. 2.4 — 13 September 2016 2 of 464

NXP Semiconductors UM10850

LPC5410x User manual

Revision history

Rev Date Description

2.4 20160913 •Updated Table 62 “Flash configuration register (FLASHCFG, main syscon: address 0x4000 0124)

bit description”: Changed the system clock rates of the following:

–2 system clocks flash access time (for system clock rates up to 24 MHz).

–3 system clocks flash access time (for system clock rates up to 48 MHz).

–4 system clocks flash access time (for system clock rates up to 72 MHz).

–5 system clocks flash access time (for system clock rates up to 84 MHz).

–Added 0x5, 6 system clocks flash access time (for system clock rates up to 100 MHz).

2.3 20160906 •Added text and a remark to Section 30.1 “How to read this chapter”.

•Added a remark to Section 30.3 “General description”.

•Added text and a remark to Section 30.4 “API description”.

•Added Table 466 “Power API calls in LPCOpen power library”.

•Renamed section 30.4.1 to Section 30.4.1 “Chip_POWER_SetPLL”.

•Renamed section 30.4.2 to Section 30.4.2 “Chip_POWER_SetVoltage”.

•Deleted Param0: mode and Low power mode; was section 30.4.2.1.

•Added Section 30.4.3 “Chip_POWER_EnterPowerMode”.

•Updated Section 30.5 “Functional description”.

2.2 20160331 •Removed Section 4.5.51: Device ID1 register values and moved Table 89 “Device ID1 register

values”to section Section 4.5.50 “Device ID1 register”.

•Removed IrDA mode from Section 21.5 “General description”in Chapter 21 “LPC5410x USARTs

(USART0/1/2/3)”.

•Updated Table 307 “USART Configuration register (CFG, offset 0x00) bit description”. Removed

IOMODE from the table.

•Removed the section: IrDA communication in Chapter 21 “LPC5410x USARTs (USART0/1/2/3)”.

•Added the sentence to Section 22.5 “General description”: Set the RXIGNORE bit to only transmit

data and not read the incoming data. Otherwise, the transmit halts when the receiver buffer is full.

•Added the sentence to Table 328 “SPI Transmitter Data and Control register (TXDATCTL, offset

0x18) bit description”, bit 22, RXIGNORE: The SPI collects receive data, according to SPI clocking,

unless RXIGNORE is set; 0: The SPI transmit halts when the receive data FIFO is full.

•Added the sentence to Section 22.7.7 “Data stalls”: The transmitter will be stalled until data is read

from the receive FIFO. Use the RXIGNORE control bit setting, to avoid the need to read the

received data.

User manual Rev. 2.4 — 13 September 2016 3 of 464

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LPC5410x User manual

2.1 20151218 •Added Table 89 “Device ID1 register values”.

•Added text to Section 4.5.47.1 “CPU Control register”: The user can assign Cortex-M0+ to be the

master CPU via this register if needed after it is brought out of reset by Cortex-M4.

•Added text to Section 4.6.3 “Brown-out detection”: On the LPC5410x, the BOD is enabled by

default after power-up. At this time the BOD is set to the lowest value (1.5v) with no factory trimming

applied. In the BOD block the interrupt portion is turned off and only the reset portion is on. After

POR/BOD resets, the BootROM takes over and applies the factory BOD trim value so that the trip

points become accurate. See the LPC5410x data sheet for BOD interrupt/reset voltage levels in the

BOD static characteristics.

•Added section Section 12.5.7 “Channel chaining”.

•Updated Figure 53 “System FIFO conceptual block diagram”.

•Updated description of 15:12,TIMEOUT VALUE; Specifies the maximum time value for timeout at

the timer position identified by TimeoutBase. Minimum time TimeoutValue - 1 (clocks of wdt_clk).

See Table 383 “Configuration register for USARTn (CFGUSART[0:3], address offset

[0x1000:0x1300]) bit description”.

•Updated the values in the sentence: TimeoutValue can be any value from 2 to 15. This gives a

maximum timeout range of 2 counts (too small to be useful) at the bottom end, up to 15 * 32,768

(491,520) counts at the upper end. See Section 24.5.7.1 “Receiver Timeout”

•Updated text in Table 468 “set_voltage routine”: Param1: desired frequency (in Hz); was: Param1:

desired frequency (in MHz).

•Removed text from Section 5.2 “General description”, list 3:

...or for monitoring analog inputs (comparators and internal voltage reference and temperature

sensor via one of the comparators).

•Removed comparator from Section 13.5 “General description”: This provides an extremely powerful

control tool - particularly when the SCT inputs and outputs are connected to other on-chip

resources (ADC triggers, other timers etc.) in addition to general-purpose I/O.

•Added AHBCLKDIV register should be set to 1 in: List item 2 “Select the IRC as the main clock and

set the AHBCLKDIV register to 1. See Table 45, Table 46, and Table 58.”, Section 5.3.4.2

“Programming Deep-sleep mode”.

•Added AHBCLKDIV register should be set to 1 in: List item 2 “Select the IRC as the main clock and

set the AHBCLKDIV register to 1. See Table 45, Table 46, and Table 58.”, Section 5.3.5.2

“Programming Power-down mode”.

•Added registers, DIRSET0, DIRCLR0, DIRNOT0. See Table 134 “Register overview: GPIO port

(base address 0x1C00 0000)” and Section 9.5.10 “GPIO port direction set registers”, Section 9.5.11

“GPIO port direction clear registers”, and Section 9.5.12 “GPIO port direction toggle registers”.

•Added note to Table 223 “SCT DMA 0 request register (DMAREQ0, address 0x5000 405C) bit

description” and Table 224 “SCT DMA 1 request register (DMAREQ1, address 0x5000 4060) bit

description”.

•Added remark to Section 4.5.37.5.1 “System PLL spread spectrum control register 0”: If the 32 kHz

RTC oscillator is used as the reference input to the PLL, then use fixed values SELI=1, SELP=6

and SELR=0, instead of applying the above rules. These values reduce the PLL loop bandwidth to

combat the effect of reference oscillator jitter on the PLL output signal.

•In Table 62 “Flash configuration register (FLASHCFG, main syscon: address 0x4000 0124) bit

description” replaced offset in table title to address 0x4000 0124.

Revision history …continued

Rev Date Description

User manual Rev. 2.4 — 13 September 2016 4 of 464

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LPC5410x User manual

2.1 •Added text to Section 17.2 “Features”: 24-bit interrupt timer clocked from CPU clock.

•Added address to Section 31.3.7.3 “RAM used by IAP command handler”’: Flash programming

commands use the top 32 bytes of on-chip SRAM0, 0x0200 FFE0 - 0x0200 FFFF (see Section

2.1.1 for details of the SRAM configuration). The maximum stack usage in the user allocated stack

space is 128 bytes and grows downwards.

•Removed Receiver Idle from Section 21.2 “Features” and replaced with Transmitter Idle.

•Added the text receiver to List item • “A receiver timeout feature (for USART and SPI) provides a

means to get data left for a time in a FIFO that has not reached its threshold to be transferred.” in

Section 24.3 “Features”.

•Added List item • “Timeouts: The watchdog oscillator must run for the UART and SPI timeout

counter to work. Enable the watchdog oscillator via the PDRUNCFG register (Table 72).” to the

Section 24.2 “Basic configuration”.

•Added text, The source of the timeout clock is the watchdog oscillator with a nominal frequency of

500 kHz to Section 24.5.7.1 “Receiver Timeout”, and Section 24.5.15.1 “Receiver Timeout”.

•Added text to Section 21.5 “General description”: The USART receiver timeout feature can also be

used to identify the USART receiver idle state. Set the bit TIMEOUTCONTONEMPTY in the

respective CFGUSART register to 1 to allow the timeout to flag idle state of the USART peripheral.

•Fixed the reset value of MSTTIME (Master timing configuration); was 0x77, now 0x56. See

Table 340 “Register overview: I2C0/1/2 (register base addresses 0x4009 4000 (I2C0), 0x4009 8000

(I2C1), 0x4009 C000 (I2C2))”.

•Added the Flash Management Registers FMSSTART and FMSSTOPUpdated to Chapter 28

“LPC5410x Flash signature generator”.

•Typographic errors have been corrected and minor pieces of information added or clarified

throughout the document.

2.0 20150410 •Registers supporting use of dual processors on LPC54102 devices has been added to the Syscon

chapter.

•A Power Management chapter has been added.

•Some pins in the Pin description chapter have the type changed to Z for open drain pins.

•A section has been added to the ADC chapter describing how to configure sample times for

different conversion configurations.

•The ADC operating speed is increased to 5 Ms/s.

•Updated Section 4.5.33 “Flash configuration register” text and Table 62.

•Typographic errors have been corrected and minor pieces of information added or clarified

throughout the document.

1.1 20141121 •In the NVIC chapter, the bit numbers for the priority register fields have been corrected.

•In the Syscon chapter, a functional description section has been added following the register

descriptions to provide additional information about some functions.

•The SCTimer/PWM chapter has been revised to better explain the function.

•Description of the ISP-AP interface and commands is added to the Debug chapter.

•References to Timer 0, 1, 2, 3, and 4 have been updated to use the terminology of the Standard

counter/timers chapter (CT32B0, 1, 2, 3, 4).

•Typographic errors have been corrected and minor pieces of information added or clarified

throughout the document.

Revision history …continued

Rev Date Description

User manual Rev. 2.4 — 13 September 2016 5 of 464

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

NXP Semiconductors UM10850

LPC5410x User manual

1.0 20141104 Initial release of the LPC5410x User Manual

Revision history …continued

Rev Date Description

User manual Rev. 2.4 — 13 September 2016 6 of 464

1.1 Introduction

The LPC5410x are ARM Cortex-M4 based microcontrollers for embedded applications.

these devices include an optional ARM Cortex-M0+ coprocessor, 104 KB of on-chip

SRAM, 512 KB on-chip flash, five general-purpose timers, one State-Configurable Timer

with PWM capabilities (SCTimer/PWM), one RTC/alarm timer, one 24-bit Multi-Rate Timer

(MRT), a Windowed Watchdog Timer (WWDT), four USARTs, two SPIs, three Fast-mode

plus I2C-bus interfaces with high-speed slave mode, and one 12-bit 5 Msamples/sec

ADC.

The ARM Cortex-M4 is a 32-bit core that offers system enhancements such as low power

consumption, enhanced debug features, and a high level of support block integration. The

ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with

separate local instruction and data buses as well as a third bus for peripherals, and

includes an internal prefetch unit that supports speculative branching. The ARM

Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. The

Cortex-M4 is the Cortex-M4 with the inclusion of the 32-bit Floating Point Unit.

The ARM Cortex-M0+ coprocessor available on some devices is an energy-efficient and

easy-to-use 32-bit core which is code- and tool-compatible with the Cortex-M4 core. The

Cortex-M0+ coprocessor offers up to 100 MHz performance with a simple instruction set

and reduced code size.

Refer to LPC5410x data sheets for complete details on specific products and

configurations.

1.2 Features

•Dual processor core: ARM Cortex-M4 and ARM Cortex-M0+ included for LPC54102

devices. Cortex-M4 only is present on LPC54101 devices.

•ARM Cortex-M4 CPU:

–ARM Cortex-M4 processor, running at a frequency of up to 100 MHz.

–Floating Point Unit (FPU) and Memory Protection Unit (MPU).

–The CPU can operate at frequencies of up to 100 MHz.

–ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC).

–Non-maskable Interrupt (NMI) with a selection of sources.

–Serial Wire Debug (SWD) with 8 breakpoints and 4 watchpoints. Includes Serial

Wire Output for enhanced debug capabilities.

–System tick timer.

•ARM Cortex-M0+ CPU (present on LPC54102 devices):

–ARM Cortex-M0+ processor, running at a frequency of up to 100 MHz (using the

same clock as the Cortex-M4).

–The CPU can operate at frequencies of up to 100 MHz.

–ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC).

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Chapter 1: LPC5410x Introductory information

Rev. 2.4 — 13 September 2016 User manual

User manual Rev. 2.4 — 13 September 2016 7 of 464

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Chapter 1: LPC5410x Introductory information

–Non-maskable Interrupt (NMI) with a selection of sources.

–Serial Wire Debug (SWD) with 4 breakpoints and 2 watchpoints.

–System tick timer.

•On-Chip memory:

–Up to 512 KB on-chip flash programming memory with flash accelerator and 256

Byte page write and erase.

–Up to 104 KB total SRAM composed of:

–Up to 96 KB contiguous main SRAM.

–An additional 8 KB SRAM.

•ROM API support:

–Flash In-Application Programming (IAP) and In-System Programming (ISP).

–Power Control API.

•Serial interfaces:

–Four USART interfaces with synchronous mode and 32 kHz mode for wake-up

from Deep-sleep and Power-down modes. The USARTs include a FIFO buffer, and

share a fractional baud-rate generator.

–Two SPI interfaces, each with 4 slave selects and flexible data configuration. The

SPIs include a FIFO buffer. Able to wake up the device from Deep-sleep and

Power-down modes when used in slave mode.

–Three I2C-bus interfaces supporting fast mode and Fast-mode Plus with data rates

of up to 1Mbit/s and with multiple address recognition and monitor mode. Each

I2C-bus interface also supports High Speed Mode as a slave. The slave function is

able to wake up the device from Deep-sleep and Power-down modes.

•Digital peripherals:

–DMA controller with 22 channels and 20 programmable triggers, able to access all

memories and DMA-capable peripherals.

–Up to 50 General-Purpose I/O (GPIO) pins. Most GPIOs have configurable

pull-up/pull-down resistors, open-drain mode, and input inverter.

–GPIO registers are located on AHB for fast access.

–Up to eight GPIOs can be selected as pin interrupts (PINT), triggered by rising,

falling or both input edges.

–Two GPIO grouped interrupts (GINT) enable an interrupt based on a logical

(AND/OR) combination of input states.

–CRC engine.

•Timers

–Five 32-bit standard general purpose timers/counters, four of which support up to 4

capture inputs and 4 compare outputs, PWM mode, and external count input.

Specific timer events can be selected to generate DMA requests. The fifth timer

does not have external pin connections and may be used for internal timing

operations.

–One State Configurable Timer/PWM (SCTimer/PWM) 6 input and 8 output

functions (including capture and match). Inputs and outputs can be routed to/from

external pins and internally to/from selected peripherals. Internally, the SCT

supports 13 captures/matches, 13 events and 13 states.

User manual Rev. 2.4 — 13 September 2016 8 of 464

NXP Semiconductors UM10850

Chapter 1: LPC5410x Introductory information

–32-bit Real-time clock (RTC) with 1 s resolution running in the always-on power

domain. A timer in the RTC can be used for wake-up from all low power modes

including Deep power-down, with 1 ms resolution.

–Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation at

up to four programmable, fixed rates.

–Windowed Watchdog timer (WWDT).

–Ultra-low power Micro-tick Timer, running from the Watchdog oscillator, that can be

used to wake up the device from low power modes.

–Repetitive interrupt timer for general purpose use and use with debug

time-stamping.

•Analog peripheral: 12-bit ADC with 12 input channels and with multiple internal and

external trigger inputs and sample rates of up to 5 MS/s. The ADC supports two

independent conversion sequences.

•Clock generation:

–12 MHz internal RC oscillator, factory trimmed for accuracy, that can optionally be

used as a system clock.

–External clock input for up 24 MHz.

–Internal, low-power, watchdog oscillator (WDOSC) with a nominal frequency of 500

kHz.

–32 kHz low-power RTC oscillator.

–System PLL allows CPU operation up to the maximum CPU rate without the need

for a high-frequency external clock. May be run from the internal RC oscillator, the

external clock input CLKIN, or the RTC oscillator.

–Clock output function with divider that can reflect many internal clocks.

–Frequency measurement unit for measuring the frequency of any on-chip or

off-chip clock signal.

•Power control:

–Integrated PMU (Power Management Unit) to minimize power consumption.

–Reduced power modes: Sleep mode, Deep-sleep mode, Power-down mode, and

Deep power-down mode.

–Wake-up from Deep-sleep and Power-down modes on activity on USART, SPI,

and I2C peripherals.

–Wake-up from Sleep, Deep-sleep, Power-down, and Deep power-down modes

from the RTC alarm.

–Power-On Reset (POR).

–Brownout detect.

•JTAG boundary scan supported.

•Unique device serial number (128-bit) for identification.

•Single power supply 1.62 V to 3.6 V.

•Operating temperature range of -40°C to +105°C.

•Available in a 3.288 x 3.288 mm WLCSP49 package and LQFP64 package.

User manual Rev. 2.4 — 13 September 2016 9 of 464

NXP Semiconductors UM10850

Chapter 1: LPC5410x Introductory information

1.3 Block diagram

Grey-shaded blocks show peripherals provide DMA request lines or that can provide hardware triggers for DMA transfers.

Fig 1. Block diagram

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User manual Rev. 2.4 — 13 September 2016 10 of 464

NXP Semiconductors UM10850

Chapter 1: LPC5410x Introductory information

1.4 Architectural overview

The ARM Cortex-M4 includes three AHB-Lite buses, one system bus and the I-code and

D-code buses. One bus is dedicated for instruction fetch (I-code), and one bus is

dedicated for data access (D-code). The use of two core buses allows for simultaneous

operations if concurrent operations target different devices.

A multi-layer AHB matrix connects the CPU buses and other bus masters to peripherals in

a flexible manner that optimizes performance by allowing peripherals on different slaves

ports of the matrix to be accessed simultaneously by different bus masters. More

information on the multilayer matrix can be found in Section 2.1.3. Connections in the

multilayer matrix are shown in Figure 1.

APB peripherals are connected to the AHB matrix via two APB buses using separate

slave ports from the multilayer AHB matrix. This allows for better performance by reducing

collisions between the CPU and the DMA controller, and also for peripherals on the

asynchronous bridge to have a fixed clock that does not track the system clock.

1.5 ARM Cortex-M4 processor

The Cortex-M4 is a general purpose 32-bit microprocessor, which offers high performance

and very low power consumption. The Cortex-M4 offers a Thumb-2 instruction set, low

interrupt latency, interruptible/continuable multiple load and store instructions, automatic

state save and restore for interrupts, tightly integrated interrupt controller, and multiple

core buses capable of simultaneous accesses.

A 3-stage pipeline is employed so that all parts of the processing and memory systems

can operate continuously. Typically, while one instruction is being executed, its successor

is being decoded, and a third instruction is being fetched from memory.

Information about Cortex-M4 configuration options can be found in Chapter 32.

1.6 ARM Cortex-M0+ processor (present on LPC54102 devices)

The Cortex-M0+ is a general purpose 32-bit microprocessor with extremely low power

consumption. The Cortex-M0+ includes the bulk of the Thumb instruction set and a small

subset of Thumb-2 Instructions. The Cortex-M0+ has a 2-stage pipeline in order to

decrease power consumption, and includes a 32-cycle multiplier.

Information about Cortex-M0+ configuration options can be found in Chapter 32.

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