Onlogic HX500 Bedienungsanleitung
HX500 / HX600 Product Manual
Revision History
Revision History
Date
First release of HX500/HX600 manual
7/10/2020
Table of Contents
1 - System Overview 4
1.1 System Introduction 4
1.2 In-box Accessories 4
1.3 Product Specifications 5
1.4 Exterior Features and Dimensions 7
1.4.1 - Front I/O 7
1.4.2 - Back I/O 7
1.4.3 - Helix 500 Dimensions (HX500) 8
1.4.4 - Helix 600 Dimensions with PCIe Expansion (HX600) 8
1.5 - System Block Diagram 9
2 - I/O Definitions 10
2.1 - Front I/O definition 10
2.2 Rear I/O definition 12
2.3 - Motherboard Connectors 15
3 - Mounting Instructions 23
3.1 - Wall Mount & DIN Rail Mounting 23
3.1 - VESA Mounting 25
4 - Power Management 26
4.1 - Wake-Up Events 26
4.2 - Protection Circuitry 26
5 - Test Reports 27
5.1 - EN 60601-1-2 Summary 27
5.1.1 - ESD Immunity Data 27
5.1.2 - Radiated Immunity Data 27
5.1.3 - Magnetic Immunity Data 27
5.1.4 - Electrical Fast Transient Immunity Data 27
5.1.5 Dips/Interrupts Immunity Data 28
6. Appendices 28
6.1 - Appendix A: Power consumption 28
6.2 - Appendix B: Isolated DIO guide 30
6.3 - Appendix C: BIOS manual 30
6.4 - Appendix D: System thermal results 30
6.5 - Appendix E: Expansion port pinout 30
6.5.1 - M.2 B-Key 30
6.5.2 - M.2 E-Key 32
6.5.3 - M.2 M-Key 33
6.5.4 - mPCIe 34
6.6 Appendix F: Safety Information 35
6.6.1 Safe use and installation instructions 35
6.6.2 Précautions et guide d’installation 36
1 - System Overview
1.1 System Introduction
The OnLogic Helix series puts Intel® 10th generation Comet Lake processing anywhere you
need it. Helix gives you installation flexibility, reliable solid state performance, and unique
expandability to help make your next innovation possible.
Helix leverages desktop processing in a form factor that would previously have been limited
to lower wattage, mobile CPUs. Our unique Hardshell™ Fanless Technology lets you reap
the benefits of the improved performance and thermal management of Intel 10th gen
processing while offering triple independent display support, an extended operating
temperature range and a wide input power range.
1.2- In-box Accessories
●4x Rubber Feet
If you purchased additional items such as mounting brackets, power supplies or terminal
block connectors, they will be located in the system box or within the outer shipping carton.
All drivers and product guides can be found on the corresponding product page. For more
information on accessories and additional features, visit the Helix series page.
Helix Series Page: https://www.onlogic.com/computers/industrial/fanless/helix/
Helix 500 Product Page: https://www.onlogic.com/hx500/
Helix 600 Product Page: https://www.onlogic.com/hx600/
1.3 - Product Specifications
Model
Helix 500
Helix 600
System Dimensions
8.26" x 2" x 6.06"
210 x 50.8 x 154 mm
8.26" x 2.55" x 11.9"
210 x 64.8 x 303mm
Board Dimensions
8" x 5.5"
8" x 5.5"
CPU (on solder side
of board)
Socket LGA 1200 - Comet Lake S
Socket LGA 1200 - Comet Lake S
PCH
Q470
Q470
Memory
2 x SO-DIMM (2 x 32GB max Dual Channel)
64 GB Total
2 x SO-DIMM (2 x 32GB max Dual Channel)
64 GB Total
LAN Controller
1x Intel 219 -with AMT
1x Intel 210
1x Intel 219 -with AMT
1x Intel 210
Expansion
1x M.2 2280/60/3042 B-Key (PCIe x2, USB
3.2 5Gb/s, SATA)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0 /
CNVi)
1x M.2 2280 M-key (PCIe x 4, SATA III)
1x mPCIe (PCIe x 1, USB 2.0)
1x M.2 2260/3042 B-Key (PCIe x 2, USB 3.2
5Gb/s, SATA)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0 /
CNVi)
1x M.2 2280 M-key (PCIe x 4, SATA III)
1x 16x PCIe Gen 3
1x mPCIe (PCIe x 1, USB 2.0)
Back I/O
3x Full size DisplayPort 1.2 with CEC
support by optional add-on module
2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
2x USB 3.2 5 Gb/s
4pin Mini DIN with 12~24 V input
3x Full size DisplayPort 1.2 with CEC
support by optional add-on module
2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
2x USB 3.2 5 Gb/s
4pin Mini DIN with 12~24 V input
Expansion bay I/O (GPU, hot swap drive, Etc)
Front I/O
1x Power LED button
1x 3.5 mm Audio headset (mic-in, line-out) -
CTIA
3FF-Sim slot (Mapped to the B-Key and
mPCIe, BIOS selected)
4x USB 3.2 10Gb/s
1x Power LED button
1x 3.5 mm Audio headset (mic-in, line-out) -
CTIA
3FF-Sim slot (Mapped to the B-Key and
mPCIe, BIOS selected)
4x USB 3.2 10Gb/s
Onboard Headers &
Connectors
1x Battery on a cable
2x Serial Header
2x USB 2.0 (2x5 header 2.54mm)
1x 4-Pin power for devices, 12V and 5V
1x 4-Pin power for Terminal Block
Power/GPU power
Auto Power On (AT/ATX Mode Select)
1x PCIe x16 mating connector
2x SATA III connector
1x 4-Pin Fan Header
1x CEC Header
1x Battery on a cable
2x Serial Header
2x USB 2.0 (2x5 header 2.54mm)
1x 4-Pin power for devices, 12V and 5V
1x 4-Pin power for Terminal Block
Power/GPU power
Auto Power On (AT/ATX Mode Select)
1x PCIe x16 mating connector
2x SATA III connector
1x 4-Pin Fan Header
1x CEC Header
Voltage Input
8~24V via DC jack or Aux power header
12~24V via DC jack or Aux power header
(without GPU)
19~24V via DC jack or Aux power header
(with GPU present)
Power Input
4 Pin Din with optional 4-pin Terminal Block
(support remote switch, 4 Pin Din covered
when not in use.)
4 Pin Din with optional 4-pin Terminal Block
(support remote switch, 4 Pin Din covered
when not in use.)
BIOS
Insyde H2O BIOS
Insyde H2O BIOS
Operating Systems
Windows 10, Ubuntu 18.04, Ubuntu 20.04
LTS, Yocto, Win10 IOT Core, ThinManager
Windows 10, Ubuntu 18.04, Ubuntu 20.04
LTS, Yocto, Win10 IOT Core, ThinManager
Special Features
Watchdog timer
RTC
PTT in BIOS,
TPM header - support TPM01
Support for Vision Processing Units
Support for 4G LTE and GPS expansion
cards
Hardware Auto Power On
Rapid Branding
Watchdog timer
RTC
PTT in BIOS,
TPM header - support TPM01
Support for Vision Processing Units
Support for 4G LTE and GPS expansion
cards
Hardware Auto Power On
Rapid Branding
Thermal Standards
(Subject to change
through RFI and
RFQ steps)
Board Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90%
(non-condensing)
Board Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90%
(non-condensing)
Extra Chassis
Features
6 Antenna holes
Wall Mount
DIN Rail Mount
VESA Mount
6 Antenna holes
2.5" Hard drive hot swap bracket (later
release, Q3 2020)
GPU Fan array
Regulatory
SAFETY IEC/UL/EN 62368-1
EMC CISPR 32/35 Class A
FCC Part 15 Class A
IEC/EN 60601-1-2:2014 EMC Ready
Radio Equipment Directive (2014/53/EU) -
Only applicable for configurations with
wireless transmitters
RoHS 3 Directive (2015/863/EU)
WEEE Directive (2012/19/EU)
SAFETY IEC/UL/EN 62368-1
EMC CISPR 32/35 Class A
FCC Part 15 Class A
IEC/EN 60601-1-2:2014 EMC Ready
Radio Equipment Directive (2014/53/EU) -
Only applicable for configurations with
wireless transmitters
RoHS 3 Directive (2015/863/EU)
WEEE Directive (2012/19/EU)
1.4 - Exterior Features and Dimensions
1.4.1 - Front I/O
Note: the HX500 is pictured, the HX600 has the same I/O configuration.
1.4.2 - Back I/O
Note: the HX500 is pictured, the HX600 has the same I/O configuration.
1.4.3 - Helix 500 Dimensions (HX500)
1.4.4 - Helix 600 Dimensions with PCIe Expansion (HX600)
1.5 - System Block Diagram
2 - I/O Definitions
2.1 - Front I/O definition
Note: the HX500 is pictured, the HX600 has the same I/O configuration. The location of the DIO
option is different for the HX600.
Power button / Power LED
The front power button can be used to turn on and off the Helix system. The power button is a
momentary contact button with a blue LED backlight used to display the status of the system. A
single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing
and holding the button for 4 seconds while the system is running will cause a hard reset of the
system. The system can be woken by a single press of the power button from any state.
The LED backlight will indicate the system status. A solid blue light indicates that the system is
powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off
in S5 and deep sleep states.
SIM card
A 3FF Subscriber Identity Module (SIM) card slot is present on the front panel of the Helix platform
allowing native support for OnLogic Extrovert 4G LTE modules. The SIM signals can be connected to
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