Osram SYNIOS P2720 Series Montage- und Bedienungsanleitung

September, 2014 Page 1 of 8

SYNIOS P2720 –General Information

Application Note

Abstract

This application note provides insight into

the LED product family of the SYNIOS

P2720 (KxDMLy31).

A basic overview of the construction,

handling and processing of the SYNIOS

P2720 is presented.

Content

1. Construction

2. Handling

3. Storage

4. Cleaning

5. Processing

Construction of the SYNIOS P2720

The product family SYNIOS P2720 is

especially developed for use as small size

light source with a wide range of operating

currents, with its slim design suitable for a

big variety of applications –from mid- to

high-power.

The common package of the product family

consists of an Au-plated lead frame and a

white epoxy mold compound in which a

highly efficient semiconductor chip is

mounted and electrically connected (Fig1.).

Fig. 1: Design of the SYNIOS P2720

Depending on the brightness requirements

the SYNIOS P2720 is available in three

different chip sizes (500µm, 750µm &

1000µm).

The product group comprises the colors

white, converted yellow, yellow, red and

super red, whereas the red color group

covers an extended wavelength range

starting at λdom = 612nm to 628nm.

The color coordinates of the white version

(KWDMLy31.SG) is within the white field of

UNECE/FMVSS.

The final encapsulation of the LED is

silicone depending on the type either clear

or converter filled.

Figure 2 shows an overview about the

available variants of the SYNIOS P2720 and

their specific designation.

Fig 2: Overview of SYNIOS P2720 family

Within the product family there are also

differences in the ESD stability of the

Application Note Number: AN038

September, 2014 Page 2 of 8

devices. In the versions white and converted

yellow the LED features an ESD protection

diode, which provides ESD stability of up to

8kV according to JESD22-A114-F (HBM).

All other of the product group provides ESD

robustness of 2kV.

Nevertheless as a matter of principle the

common ESD safety precautions have to be

observed during handling, assembly and

production of electronic devices.

The common QFN-like design with identical

solder pad layout and equal small

dimensions (2.7mm x 2.0mm x 0.6mm)

involves an additional benefit concerning

design flexibility due to the exchangeability.

With one circuit board layout, for example,

several applications with different brightness

requirements can be implemented. With the

same layout either the brightness by

different chip sizes can be adapted at the

end of the development phase or later after

some years.

Also with the same board layout different

requirements in brightness like for UNECE

and FMVSS regulation can be fulfilled by the

wide brightness range of the family for each

color.

As a small LED without lens the SYNIOS

P2720 is also perfectly suited for light guide

applications.

As with all LEDs from OSRAM Opto

Semiconductors, the SYNIOS P2720

product group also fulfills the current RoHS

guidelines (European Union & China).

Handling

Accessorily to general guidelines for the

handling of LEDs, additional care should be

taken that mechanical stresses (e.g.

sheering forces) to the elastic silicone

encapsulation must be eliminated or

reduced to the greatest extent possible (see

also application note "Handling of Silicone

Resin LEDs").

In general, all types of sharp objects (e.g.

forceps, fingernails, etc.) should be avoided

in order to prevent stress to or penetration of

the encapsulation, since this can lead to

impairment of the component.

Fig. 3: Manual Handling of the SYNIOS

P2720

For manual assembly and placement –in

the production of prototypes, for example –

the use of so-called vacuum tweezers is

recommended (Figure 4). The effective

mechanical stress on the LED is minimized

by individually exchangeable soft rubber

suction tips.

Fig. 4: Examples of vacuum styluses

If there is no alternative to the exceptional

use of a tweezers (anti-static), the LED must

be picked and handled only at the epoxy

housing (Figure 3).

Please note even after being soldered on

the PCB board touching of the silicon must

be avoided in order to avoid damages of the

bond wire or of the LED housing.

As it can be seen in Figure 5, the SYNIOS

P2720 is packaged in tape and reel.

When processing by means of automated

placement machines, care should be taken

Application Note Number: AN038

September, 2014 Page 3 of 8

to use an appropriate pick and place tool

and to ensure that the process parameters

are conform to the package's characteristics.

Figure 6 shows the recommended design of

the placement tool for damage-free process-

ing of the SYNIOS P2720.

Fig. 5: Position of the LED in the tape –method of taping

Fig. 6: Design proposals of the pick and place tool for the SYNIOS P2720 (dimensions in

mm)

If possible, the tool should pick up the LED

across the entire surface or along the package rim (Figure 7). The same applies

when depositing or placing the LED. Forces

Application Note Number: AN038

September, 2014 Page 4 of 8

should be applied over the entire surface or

along the rim.

Fig. 7: Recommended pick-up area for

SYNIOS P2720

Since the SYNIOS P2720 is generally

supplied in tape with dry pack, it should be

factory-sealed when stored.

The hermetic pack should only be opened

for immediate mounting and processing,

after which the remaining LEDs should be

repacked according to the moisture level in

the datasheet (q.v. JEDEC J-STD-033B.1 -

Moisture Sensitivity Levels).

Storage

PCBs or assemblies containing LEDs should

not be stacked such that force is applied to

the LED, or should not be handled directly at

the LED.

Fig. 8: Incorrect storage of LEDs

Generally, all LED assemblies should be

allowed to return to room temperature after

soldering, before subsequent handling, or

the next process step.

Fig. 9: Correct storage of assemblies with

LEDs

Cleaning

From today's perspective any direct

mechanical or chemical cleaning of the

SYNIOS P2720 is forbidden.

Isopropyl alcohol (IPA) can be used if

cleaning is mandatory. Other substances or

especially ultrasonic cleaning of SYNIOS

P2720 are generally not recommended.

For dusty LEDs, a simple cleaning by means

of purified compressed air (e.g. central

supply or spray can) is recommended here.

In any case, all materials and methods

should be tested beforehand, particularly as

to whether or not damage is associated with

the component.

Notes concerning cleaning can be also

found in the corresponding data sheets.

Processing

Generally, the SYNIOS P2720 product

family is compatible with existing industrial

SMT processing methods, so that current

populating techniques can be used for the

mounting process.

The individual soldering conditions for each

LED type according to JEDEC can be found

in the respective data sheet.

A standard reflow soldering process with

forced convection under standard N2

atmosphere is recommended for mounting

the component, in which a typical lead-free

Application Note Number: AN038

September, 2014 Page 5 of 8

SnAgCu metal alloy is used as solder.

Figure 10 shows the temperature profile for

lead-free soldering with the recommended

peak temperature of 245°C.

In this context, it is recommended to check

the profile on all new PCB materials and

designs. As a good starting point, the

recommended temperature profile provided

by the solder paste manufacturer can be

used. The maximum temperature for the

profile as specified in the data sheet should

not be exceeded, however.

When developing the circuitry, special

attention should be given to the position and

orientation of the LED on the circuit board.

Depending on the position and orientation of

the LED, the mechanical stress on the LED

can vary.

In general, it is recommended that all

twisting, warping, bending and other forms

of stress to the circuit board should be

avoided after soldering in order to prevent

breakage of the LED housing or solder

joints.

Therefore, separation of the circuit boards

should not be done by hand, but should

exclusively be carried out with a specially

designed tool.

For further information such as regarding

PCB type, solder pad, solder stencil, voids,

post reflow inspection and verification of the

design please see also application notes

“Processing of SMD LEDs”.

The SYNIOS P2720 features a good self

alignment during soldering additionally

supported by the four wetting indicators (Fig.

11).

Fig. 10: Temperature profile for lead-free reflow soldering according to JEDEC JSTD-020

Application Note Number: AN038

September, 2014 Page 6 of 8

Fig. 11: bottom only-terminated contacts

with wetting indicators

Fig 12 shows the LED before and after the

IR soldering process.

Fig. 12: Self alignment of the SYNIOS

P2720 during soldering

If a narrow LED clustering is requested in

the application, please note a direct side by

side contact between the housings has to be

avoided due to the risk of short circuits.

Summary

The SYNIOS P2720 LED family is designed

as small size high-flux light source. The

design of the package enables the use of

various chip sizes to satisfy different

brightness levels and a wide range of

operating currents as well.

With primary focus on automotive

applications the LED is qualified based on

the guidelines of IEC 60810, “Lamps for

road vehicles - Performance requirements”.

In addition the SYNIOS P2720 group

features an improved corrosive robustness

according to the following test conditions:

40°C / 90% rh / 15ppm H2S / 336h;

= Stricter than IEC 60068-2-43 (H2S) [25°C /

75% rh / 10ppm H2S / 21 days]

= Regarding relevant gas (H2S) stricter than

EN 60068-2-60 (method 4) [25°C / 75% rh /

200ppb SO2, 200ppb NO2, 10ppb Cl2/ 21

days]).

The relevant information can also be found

in the datasheet of the LED product.

Currently the product group comprises the

automotive preferred colors white, yellow,

red and super red.

Generally supplied in tape and reel, the

SYNIOS P2720 is compatible with existing

industrial SMT processing methods, so that

all customary populating techniques can be

used for assembly.

It should also be kept in mind that the LED is

not suitable for any direct mechanical or

chemical cleaning.

During handling and processing mechanical

stress to the silicone encapsulation must be

reduced or eliminated to the greatest extent

possible. Penetration of the silicone should

be avoided. Either can lead to impairment of

the component.

OSRAM Opto Semiconductors supports its

customers during their development and

design process in finding the best solution

for a specific application.

Application Note Number: AN038

September, 2014 Page 7 of 8

Appendix

Don't forget: LED Light for you is your place to be whenever you are looking

for information or worldwide partners for your LED Lighting project.

www.ledlightforyou.com

Revision History

Date

Revision History

Sept. 2014

Release application note

Authors: Andreas Stich, Norbert Häfner, Kurt-Jürgen Lang

ABOUT OSRAM OPTO SEMICONDUCTORS

OSRAM, Munich, Germany is one of the two leading light manufacturers in the world. Its

subsidiary, OSRAM Opto Semiconductors GmbH in Regensburg (Germany), offers its customers

solutions based on semiconductor technology for lighting, sensor and visualization applications.

Osram Opto Semiconductors has production sites in Regensburg (Germany), Penang (Malaysia)

and Wuxi (China). Its headquarters for North America is in Sunnyvale (USA), and for Asia in Hong

Kong. Osram Opto Semiconductors also has sales offices throughout the world.

For more information go to www.osram-os.com.

Application Note Number: AN038

September, 2014 Page 8 of 8

DISCLAIMER

PLEASE CAREFULLY READ THE BELOW TERMS AND CONDITIONS BEFORE USING THE

INFORMATION SHOWN HEREIN. IF YOU DO NOT AGREE WITH ANY OF THESE TERMS AND

CONDITIONS, DO NOT USE THE INFORMATION.

The information shown in this document is provided by OSRAM Opto Semiconductors GmbH on an “as is

basis” and without OSRAM Opto Semiconductors GmbH assuming, express or implied, any warranty or

liability whatsoever, including, but not limited to the warranties of correctness, completeness,

merchantability, fitness for a particular purpose, title or non-infringement of rights. In no event shall

OSRAM Opto Semiconductors GmbH be liable - regardless of the legal theory - for any direct, indirect,

special, incidental, exemplary, consequential, or punitive damages related to the use of the information.

This limitation shall apply even if OSRAM Opto Semiconductors GmbH has been advised of possible

damages. As some jurisdictions do not allow the exclusion of certain warranties or limitations of liability,

the above limitations or exclusions might not apply. The liability of OSRAM Opto Semiconductors GmbH

would in such case be limited to the greatest extent permitted by law.

OSRAM Opto Semiconductors GmbH may change the information shown herein at anytime without notice

to users and is not obligated to provide any maintenance (including updates or notifications upon

changes) or support related to the information.

Any rights not expressly granted herein are reserved. Except for the right to use the information shown

herein, no other rights are granted nor shall any obligation be implied requiring the grant of further rights.

Any and all rights or licenses for or regarding patents or patent applications are expressly excluded.

Application Note Number: AN038

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