Pace TF-350 Bedienungsanleitung

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PACE

Pace,

Inc.

TF-350

——

OPERATION

MANUAL

一

一

INTRODUCTION

Thank

you

for

your

purchasing

the

TF-350

SMD

rework

station.

As

you

are

aware,

the

technical

innovation

enabled

the

LSI

highly

densified

and

minimized

in

its

shape,

and

the

latest

technology

is

now

needed

for

the

handling

of

the

LSI.

Meanwhile,

the

surface

mount

works

also

are

required

to

keep

the

high

reliability

because

0.65mm

of

the

ar

pitch

is

further

minimized

to

0.5

mm,

and

recently

the

fine

pitch

of

0.3

mm

has

been

developed

in

the

industry.

The

TF-350

is

a

highly

reliable

SMD

rewok

system

with

hot

air

Style

that

is

applied

for

the

removal

and

the

soldering

of

many

shapes

of

QFP/SOP/PLCC/BGA/PGA

and

etc.

When

the

solder

face

of

the

SMD

is

melted

in

a

brief

time

by

the

hot

air

blowing

from

the

nozzle

that

circles

right

over

the

solder

face,

the

SMD

can

be

removed

quickly

by

the

vacuum

tweezers.

Also,

it

can

be

utilized

for

the

soldering

too.

When

it

is

overheated

due

to

the

stop

of

air

flow,

the

thermal

protector

will

be

activated

to

put

off

the

heater,

so

that

the

safety

guard

can

be

double

cheched

and

enhanced.

It

will

be

automatically

restored

when

the

ambient

temperature

is

lowered

to

60°C

MAIN

FUNCTION

1.

The

circle

range

of

the

nozzle

can

be

adjusted

to

any

dimension

up

to

50

mm

in

X

axis(right

&

left)

and

Y

axis(back

&

forth).So

it

can

be

utilized

for

any

size

of

SMD

up

to

50mm.

.

One(1)

mode

can

be

selected

from

the

four(4)

of

STANDARD,

LOW,

PGA/BGA,

SLOW

to

acconmodate

to

each

of

the

application.

The

heater

temperature

is

variable.

In

the

repeated

works,

it

is

convenient

that

the

timer

can

be

set

at

will

for

the

nozzle

to

come

up

automatically

at

the

pre-set

time.

.

The

operation

can

be

stopped

any

time

by

pushing

the

button

of

STOP.

The

nozzle

will

come

up

by

pushing

the

button

of

STOP

and

the

heater

will

be

automatically

put

off.

But

the

air

flow

will

continue

for

approx.

20

seconds

to

cool

down

the

nozzle

then

the

air

pump

will

stop.

The

vacuum

tweezers

is

equipped

to

quickly

remove

the

SMD

at

the

solder

melting.

The

PCB

can

be

handled

up

to

420

mm

in

length

and

no

limitation

in

width.

圖

COMPOSITION

№

pp

n

No

PCB

holder(targe)

PCB

holder(small)

Filter(It

is

housed

inside)

Composition

of

Main

body

and

Accessories

@Main

body

@Vacuum

Tweezers

@Suction

cup

for

Vacuum

tweezers(3

pcs.)

@Filter

for

Vacuum

tweezers(5

pcs.)

©Base

Plate

430

mm

X

300

mm

PCB

Holder

2

pcs.

of

small

size

2

pcs.

of

large

size

@Base

Plate

Stand

@PCB

Support

Pin

一

1

一

ㆍ

»

PLEASE

REMOVE

A

TRANSPORT

SCREW

PRIOR

TO

CONNECTING

THE

POWER

CORD.

A

butterfly

screw

is

fitted

to

protect

the

nozzie

against

vibration

in

the

transport.

Please

remove

it

prior

to

connecting

the

power

cord.

Be

sure

to

fit

it

in

again

at

re-packing

when

it

is

transported.

Set

X

and

Y

mode

to

O

and

tum

left

Knob

Z to

the

maximum,

then

push

the

Start

button

to

get

Nozzle

in

the

8

lowest

position

and

switch

off

the

power.

MINSTALLATION

COMMISSIONING

1.

Place

the

TF-350

on

a

level

surface

2.

Before

connecting

Power

cord,

please

confirm

that

Transport

Screw

is

removed.

Transport

Screw

with

butterfly

shape

is

fitted

to

fasten

the

arm

inside

the

front

panel.Nozzle

is

supported

by

the

arm.

3.

Connect

Power

cord

and

Vacuum

tweezers

Power

source

voltage:

AC

120

V

+10

%

or

AC

220

V

+10

%

Power

cord:

CEE

standard

UL

standard

Plug

S122

E35611

Connector

S477

E35797

Cord

S52

E35611

4.

confirm

each

of

the

basic

operation

as

stated

below.

1)

At

Power

Switch

"on",

Main

body

will

be

in

waiting

situation.

Set

Mode

Knob

in

STANDARD

and

push

Start

button

to

lower

Nozzle.

Then

confirm

whether

or

not

Nozzle

can

be

raised

and

lowered

by

Knob

Z.

Also

confirm

the

convertion

of

dimension

X(right

4

left)

and

Y(back

&

forth)

by

Knod

X

and

Knob

У.

Confirm

that

Heater

goes

on

when

Start

button

is

pushed

again.

Also

confirm

whether

or

not

the

brightness

of

Heater

can

be

changed

by

Temperature

Knob.

2)After

pushing

Stop

button,

set

Mode

Knob

in

LOW.

And

push

Start

button

twice.

Then

confirm

whether

or

not

the

air

flow

is

less

than

the

Mode

of

STANDARD.

3)After

pushing

Stop

button,

set

Mode

Knob

in

PGA/BGA.

And

push

Start

button

twice.

The

function

of

Knob

X

and

Knob

Y

in

Mode

PGA/BGA

will

be

different

from

the

Mode

of

STANDARD/LOW/SLOW.

Confirm

the

convertion

of

dimension

X(inside

circuitjand

Y(outside

circuit)by

Knob

X

and

Knob

Y

as

illustrated

below.

4)After

pushing

Stop

button,

set

Mode

Knob

in

SLOW.

And

push

Start

button

twice.

Confirm

that

the

air

flow

in

the

Mode

of

SLOW

is

less

than

the

Mode

of

STANDARD.

also

confirm

that

the

Nozzle

moving

speed

is

much

slower

(approx

1//10)

than

the

mode

of

STANDARD.

5)Heater

is

fitted

for

use

of

the

original

voltage.

When

it

is

used

in

different

voltage,

the

original

Heater

shall

be

replaced

to

meet

the

right

voltage.

LENGTH

OF

INSIDE

CIRCUIT

Adjustable

by

Knob

X

LENGTH

OF

OUTSIDE

CIRCUIT

Adjustable

by

Knob

Y

MCONTROL

PANEL

START

BUTTON

a

MODE

KNOB

|

|

[AO

BGA

STOP

BUTTON

ù

^

MODE

START/HEATon

|

一

ЕМРЕВАТОВЕ

КМОВ

一

KNOB-Z

AXIS]

Y

SES

TIMER

KNOB

一

一

in

x

Ap

KNOB-X

AXIS

t

WIDTH

O

INSIDE

QFP/PLCC

mm

PGA/BGA

|}

QI

[NOZZLE

一

一

一

一

00000

MPRESTART

1.

Turn

on

the

power

switch

2.

Tum

right(clockwise)

Knob

Z

to

the

maximum

to

raise

the

nozzle

to

the

highest

position.

3.

Set

Timer

Knob

at

max.

of

5

min.

4.

Set

Temperature

Knob

in

"high"

position

5.

Set

Mode

Knob

in

STANDARD

6.

Place

a

PCB

on

the

PCB

holders

and

adjust

Base

Plate

so

that

the

removing

QFP

can

be

positioned

right

under

Nozzle.

MTEST-RUN

(POSITION

SETTING)

7.

Push

START

button

one

time

to

lower

Nozzle

8.

Turn

left(counterclockwise)

Knob

Z

to

lower

Nozzle

so

that

Nozzle

point

can

be

1

mm

above

the

surface

of

QFP.

9.

Decide

the

width

X

and

length

Y

by

Knob

X

and

Knob

Y

so

that

Nozzle

can

circle

right

over

the

solder

face

of

QEP.

10.

Check

6,

8

and

9

above

again

if

needed

to

get

the

right

position

setting.

MSTART-REMOVAL

WORKS

11.

Push

START

button

once more

to

switch

on the

heater.

And

the

air

flow

will

start

melting

the

solder

face.

12.

The

vacuum

tweezers

will

be

usable

while

the

air

blow

is

on.

13.

You

can see

the

solder

glitter

and

start

melting.

14.

At

the

solder

melted,

place

a

finger

on the

hole

of

the

tweezers

and

let

the

tweezers

suck

the

surface

of

QFP.

15.Be

sure

to

push

STOP

button.

Nozzle

will

be

raised

up

and

Heater

will

be

off.

In

20

seconds,

the

air

pump

will

be

automatically

stopped

with

Nozzle

cooled

down.

16.When

you

want

to

heat

Nozzle

again,

push

START

button

agein.

ー3

ーー

MREMOVAL

METHOD

IN

“STANDARD”

MODE

MODE

:

CHOICE

SLOW-LOW-STANDARD-PGA/BGA

|

INDEX

OF

SETTING

POSITION

OF

NOZZLE

POINT

(X-Y-Z)

Adjust

a

distance

by

a

“re

Nozzie

will

be

raised

in

highest

position

when

Knob

Z

is

turned

right

to

the

maximum

Imm

(7

Ú

JAF

(QFP)

|

X's

width

Y's

length

YA

.

mae

73

Figure1

(PLCC)

X

EA

STEP

4

When

the

setting

time

of

Timer

is

due,

Nozzle

will

be

automatically

raised

up.

When

Timer

is

not

in

use,

Nozzle

will

be

raised

up by

pushing

button

of

2!

STEP

3

TEST

RUN

(POSITON SETTING)

In

order

to

circle

over

the

circumference

of

QFP,

Nozzle

point

can

be

set

by

placing

a

PCB

with

slight

movement

of

Base

Plate

2

and

by

deciding

X's

width

(right

&

left)

and

SMD

ol

Ys

length

(back

&

forth)that

is

shown

in

Figure1

(QFP)

中

START]

+

When

the

button

of

[lis

pushed

once

more,

the

hot

air

will

start

blowing.

STEP1

STEP

2

_

This

removal

method

is

When

the

button

of

ilustrated

in

"STANDARD"

E

(green

color)

is

Mode

pushed

one

time,

Turn

right

Timer

Knob

Nozzle

will

be

to

the

maximum

when

lowered.

Adjust

up

Φ

Timer

is

not

in

use.

&

down

by

Knob

Z.

STEP

5

When

the

solder

starts

melting,

please

suck

and

remove

QFP

by the

<

tweezers

after

placing

a

finger

on

the

hole.

STEP

6

In

approx.

20

seconds,

the

pump

will

be

automatically

stopped

with

Nozzle cooled

down.

Tweezers

MMODE

SELECTION

8

APPLICATION

MODE

|

AIRFLOW

|

NOZZLE

MOVE

APPLICATION

INDEX

OF

HEATER

SETTING

FAST

REMOVAL

FOR

QFP/PLCC/SOP/

STANDARD)

12

L/MIN.

|

A

SOP

3

7

2 8

FAST

REMOVAL

FOR

FOER

QFP/PLCC/SOP

TEMP

LOW

6

L/MIN.

+

RECOMMENDABLE

FOR

DENSE

PCB

WITH

THE

SMALL

COMPONENTS.

#

AT

THE

POSITION

OF

‘HIGH’,

MOST

PROPER

TEMPERATURE

FAST

REMOVAL

8

IS

AVAILABLE

FOR

REMOVAL.

PGA

SOLDERING

FOR

HOWEVER,

YOU

CAN

LOWER

PGA/BGA

THE

TEMPERATURE

AT

WILL

BGA

12

L/MIN.

Г]

/8G

IF

NECESSARY.

ー

*

AT

SOLDERING,

IT

IS

ADVISABLE

TO

ACTIVATE

AT

CALIBRATION

OF

3705

SLOW SOLDERING

*1/10

OF

FAST

SLOW

6

L/MIN.

ση

|

A

Lol

MREMOVAL

OF

BGA/PGA

BGA/PGA

Outside

circuit

One(1)

cycle

composes

of

five(5)

circuits

with

starting

at

©

and

ending

at

©.

The

cycle

will

be

repeated.

BGA/PGA

REMOVAL

METHOD

OF

PGA

IN

"PGA/BGA"

MODE

STEP

1

—

Set

Mode

Knob

in

“PGA/BGA”.

Nozzle

This

illustration

shows

that

Nozzle

is

circled

over

the

pins

of

PGA

by

5

Metal

frame

(Option)

CJ

(Option)

STEP

2

-

Seeing

the

solder

melting,

push

down

the

reverse

side

of

PCB

evenly

by the

metal

tweezers

or

others

so that

the

pins

points

are

on the

level

of

the

reverse

face

of

PCB.

STEP

3

—

When

the

pins

points

were

down

to

the

level

of

the

reverse

face

of

PCB,

please

pull

it

down

evenly

by the

jig.

STEP

4

-

The

PGA

will

be

removed.

Metal

frame

and

Jig

are

optional

parts.

REMOVAL

OF

SMPGA

(WITH

HEAT

SINK)

IN

“STANDARD”

MODE

SMPGA

FLOW

OF

HOT

AIR

'

‘

|

METAL

FRAME(OPTION)

SMPGA

|

REMOVAL

OF

SMPGA

WITH

A

ROUND

SHAPED

HEAT

SINK

|

1.

Set

Mode

Knob

in

"STANDARD"

2.

Place

a

square

Metal

frame

with

the

side

dimension

of

50

mm

around

SMPGA.

3.

The

tip

of

Nozzle

is

to

be

below

the

top

of

Heat

sink

as

illustrated

above.

Push

Start

button

and

tentatively

set

the

tip

end

of

Nozzle

in

a

position

so that the

rotation

of

“X”

and

“Y”

can

be

larger

than

the

diameter

of

Heat

sink.

And

place

PCB

on

the

PCB

holders

not

to

hit

the

tip

end

of

Nozzle.

4.

Adjust

the

width

of

"X”

and

“Y”

so that the

tip

end

of

Nozzle

can

rotate

between

the

circumference

of

SMPGA

and

Metal

frame

as

illustrated

above.

5.

After

the

position

setting,

push

Start

button

again.

6.

With

the

hot

air

flowing

into

the

pins

from

the

clearance

of

the

bottom

face

of

SMPGA

and

PCB,

the

solder

will

start

melting.

REFLOW

METHOD

OF

QFP

IN

“SLOW”

MODE

STEP

1

Remove

a

SMD

in

“STANDARD”

or

“SLOW”

mode

STEP

4

Put

a

new SMD

on

the

pattern

and

position

it

accurately.

“SLOW”

7

|

STEP

6

Solder

it

in

mode

of

“SLOW”.

U0000000109000

CHE

00000000000000

HER

STEP

2

STEP

3

Completely

remove

the

solder

Place

cream

by

a

dispenser

or

remained

on

the

face

of

pattern

others.

by

SC-7000

to

clean

the

face.

STEP

5

Fix

the

two

points

tentatively

by

a

solder

iron

as

illustrated

above.

(Use

a

finger

to

push

the

SMD

lightly

so

that

it

can

not

float)

REMARKS

2

circuits

in

mode

of

At

Step

2,

if

the

solder

remained

on

the

pattern

is

com-

paratively

new

and

usable,

it

is

advisable

to

re-use

the

remained

solder

and

to

flatten

it

by

a

solder

iron.

In

this

case,

place

a

little

of

flux

on

the

pattern,

then

accurately

position

a

new

SMD

on

the

pattern

while

the

flux

is

wet

(before

the

flux

is

dried).

The

flux

will

be

hardened

when

it

is

dried.

When

re-using

the

remained

solder,

please

do

Step

5&

6

after

Step

2.

|

KEY

ADVICE

ON

OPERATION

|

-

.

When

Nozzle

happens

to

contact

the

SMD,

it

is

likely

to

come

up

and

to

be

in

the

waiting

situation.

In

this

case,

please push

Start

button

again

for

Nozzle

to

come

|

down.

N

When

removing

the

small

BGA

&

OFP

less

than

15mm,

it

is

advisable

to

set

the

nozzle

to

the

maximum

height.

©

.

The

vacuum

tweezers

is

designed

to

be

used

like

a

pen.

Please

hold

it

like

a

pen

for

more

easier

usage.

A

When

the

solder

is

oxidized,

more

attention

should

be

paid

because

the

solder

melting

is

hard

to

identify.

a

.

There

will

be

quite

a

difference

in

the

time

required

for

removal

in

the

first

operation

(The

heater

is

cool

at

start)

and

in

the

second

after

(The

heater

is

already

warm).

Please

pay

attention

to

that.

の

When

PCB

is

bent

or

warped

due

to

the

large

size,

please

put the

PCB

support

pin

underneath

the

SMD.

When

it

is

bent

upward,

please

adjust

the

height

of

Nozzle

by

Knob

Z

not

to

hit

the

bent

PCB.

Remove

the

SMD

by

the

metal

twizzers

when

it

is

bonded.

oN

When

the

small

components

like

1005

are

mounted

around

the

removing

SMD,

please

use

Mode

“LOW”.

However,

if

you

find

that

the

heating

volume

of

Mode

“LOW”

is

in

shortage,

please

use

Mode

“STANDARD”

after

seperating

the

nearby

parts

by

putting

the

metal

frame

or

the

masking

tape.

©

When

the

PCB

holders

are

unusable

because

of

connectors

on

PCB,

please

use

the

PCB

support

pin.

10.Since

the

ceramic

board

is

weak

for

heating

impact,

it

is

better

to

put the

board

on

an

Aluminum

plate

of

1mm

thick.

11.In

the

reworking

of

PBGA

(Plastic

BGA),

it

is

advisable

to

activate

the

Temperature

Knob

at

calibration

of

3

to

4.

12.For

the

removal

of

the

large

sized

SMD

more

than

30mm,

an

option

of

the

metal

frame

will

be

more

useful.

13.For

the

removal

of

PGA

&

DIP,

more

efficient

works

will

be

done

when

the

molded

side

is

preheated

at

120°C.

14

if

the

connecter

is

made

with

heat-plasticity,

it

is

not

easy

to

remove

it

without

melting

or

damaging

it.

However

TF-350

can

do

it

well

while

it

is

impossible

with

other

equipment.

15.In

handling

the

flexible

PCB

or

the

film

board,

please

put

it

on

another

board

where

there

is

no

mounted

parts.

Then,

proceed

the

works

on

it.

16.Do

not

rely

on

the

timer

so

much.

It

sometimes

will

cause

failure

in

continuous

works.

17.The

removal

time

varies

according

to

the

conditions.

i.e.:

continuous

or

intermittent

works,

the

size

of

SMD

and

the

sorts

of

board.

Please

pay

attention

to

the

timer

setting.

18.The

small

PCB

is

apt

to

move

itself.

It

will

be

easy

to

do

the

works

when

you

put

a

weight

on

the

small

PCB.

19.Do

not

turn

Mode

Knob

in

the

operation.

If

the

Mode

is

changed

in

the

operation,

it

is

possible

that

Nozzle

makes

a

false

movement

because

the

last

Mode

program

is

memorized

in

the

computer.

When

you

wish

to

change

Mode,

be

sure

to

push

Stop

button

to

return

to

the

starting

position

then

select

a

Mode

you

want.

MSPECIFICATIONS

STYLE

HOT

AIR

STYLE.

BLOWING

NOZZLE

:

350W

¢

4mm

AIRFLOW

RATE

(LOW

+»

SLOW)

6

LITER/MIN.

(STD.

PGA/BGA)

12

LITER/MIN.

AIR

PUMP

+

VACUUM

PUMP

|

BUILT-IN

NOZZLE

TRACE

RANGE

|

(X

+

Y)

0—50mm

(Z)

26mm

TEMPERATURE

CONTROL

|

ADJUSTABLE

BY

KNOB

ON

PANEL

TIMER

CONTROL

ADJUSTABLE

BY

KNOB

ON

PANEL

:

MAX.

5

MIN.

SIZE

OF

BOARD

TO

PROCESS

|

(LENGTH

Y)

420mm

(WIDTH

X)

NO

LIMIT

MODE

(4

MODES)

STD

*

LOW

«

SLOW

*

PGA/BGA

POWER,/ELECTRICITY

|

АС

100,120,220V

//360W

DIMENSIONS

W

300mm

H

310mm

D

450mm

WEIGHT

9

KGS

MREPLACEMENT

PARTS

FOR

MAINTENANCE

TF

350

spare

parts

PART

NUMBER

6010-0118-P1

1360-0272-P1

1338-0101-P1

1338-0102-P1

4008-0034-P1

6020-0139-P1

1309-0055-P1

1334-0029-P1

1334-0030-P1

1285-0039-P1

1121-0827

DESCRIPTION

TF

350

Heater

Assy

120V

TF

350

Metal

Frame,

11

pcs.

Air

Pump

for

100-120V

Suction

Pump

for

100-120V

Power

Supply

PCB

for

100-120V

PCB

Main

for

100-120V

Filter

(10

pcs/set)

Air

Motor

for

Blowing

100-240V

Air

Motor

for

Suction

100-240V

PCB

Control

for

100-120V

Micro

Vacuum-Nozzle

MIBLOCK

DIAGRAM

HEATER

SWITCHING

POWER

SUPPLY

ὃν

Ум

108-1207

Sa

220-240

da

MAINTENANCE

The

TF-350

is

basically

designed

for

the

maintenance

free.

However,

the

replacement

of

major

parts

will

be

needed

when

the

emergency

accident

or

trouble

happened.

And

the

consumable

parts

will

have

to

be

changed

from

time

to

time

when

required.

Please

follow

the

instructon

stated

below

when

the

parts

replacement

is

needed.

A:INSTRUCTION

TO

REPLACE

MAJOR

PARTS

(DREMOVAL

OF

COVER

PLATE

1.

Switch

off

the

power.

2.Pull

out

the

small

cover

for

Knob

Z.

3.Come

off

the

vis

in

the

knob.

4.Come

off

all

of

14

pcs

of

screw

for

fitting

the

cover

plate.

5.When

removing

the

top

cover

of

front

panel,

slightly

open

outward

the

under

side

then

pull

it

upward.

@REPLACEMENT

OF

HEATER(NOZZLE)

Disconnect

the

AC

cord

Remove

the top

cover

of

the

front

panel

Pull

the

connector

out

of

heater

lead

wire

Loosen

the

bolt

which

fastens

the

tube

and

the

heater.

Take

the

heater

out

of

the

tube.

Insert

the

new

heater

in

the

tube.

fasten

the

bolt

fixing

the

tube

and

the

heater

so

that

the

clearance

between

Nozzle

tip

and

the

PCB

surface

can

be

2-3

mm

as

illustrated

below.

REMARKS

The

new

thermal

protector

will

be

supplied

with

the

new

heater.

NO

AG

o

o

2—3mm

PCB

@REPLACEMENT

OF

AIR

MOTOR(PUMP)

Disconnect

the

AC

cord.

Remove

Cover

plate

to

access

Air

motors(Pumps)

A) Air

motor(M1)

for

pressure

side

1.

Pull

2

pcs

of

Motor

lead

wire

(red

color)

out

of

Connectors

on

PCB(PCB/#

SD-2000M)

of

pressure

side

2.

Pull

2

pcs

of

Air

tube

out

of

Motor

3.

Disconnect

Earth

wire

out

of

Motor

by

loosenning

the

vis.

4.

Come

off

4

pes

of

Screw

of

Pump

base

5.

Pull

off

Insulator.

6.

Replace

the

old

motor

with

a

new

one.

B)

Air

motor

(M2)for

suction

side

1.

Pull

2

pcs

of

Motor

lead wire

(red

color)

out

of

Connectors

on

PCB(PCB/#

SD-2000M)

of

suction

side

2.

Pull

1

pc

of

Air

tube

out

of

Motor

3.

to

6.

Same

as

A)

@REPLACEMENT

OF

MAIN

PCB(PCB/#

SD-2000A

MAIN)

Disconnect

the

AC

cord

Remove

Cover

plate

to

access

Main

PCB

1.

Pull

off

all

of

Connectors

2.

Pull

off

the

fitting

materials(white

color)

of

Main

PCB

3.

Pull

out

Main

PCB

to

replace

with

a

new

one.

一

13

一

B:INSTRUCTION

TO

REPLACE

CONSUMABLES

(DCHANGE

OF

FILTER

Suction

filter

is

housed

inside

Base

frame.

After

coming

off

Hose

joint

by

Wrench,

take

the

old

filter

outside

to

replace

with

the

new

one.

@CHANGE

OF

LAMP

Lamp

is

a

push-off

type.

To

take

it

off,

push

it

upward

and

tum

it

clockwise.

(CHANGE

OF

PAD

FOR

VACUUM

TWEEZERS

It

is

a

rubber-make,

When

injured

or

collapsed,

it

should

be

replaced

with

a

new

one.

MITROUBLE

SHOOTING

The

trouble

shooting

illustrated

below

is

an

index

so

that

you can quickly

identify

the

cause

of

trouble

and

restore

the

equipment

to

normal

operation.

If

the

trouble

would

not

be

settled,

please

contact

Service

Div.

of

DEN-ON

or

the

service

agent

for

further

technical

information

on

the

repairs.

|

START

|

|

Check

if

initialized

Check

PULSE

MOTOR

X(CN5),

Y(CN4)

SENSOR(CN4)

OR

MICRO

SW(CN2)

|

Check

if

PUMP

MOTOR(M1

&

M2)

is

worked

by

START

SWITCH

(SW1)

Check

if

Nozzle

is

YES

repeated

up

and

down

Check

if

Nozzle

remains

up

after

pushing

START

button

È

Check

of

PCB

Check

SW

BOARD(CN1),

1C3,

SW1,

SW2

|

|

Malfunction

of

UP LIMIT

SW.

|

Malfunction

of

DOWN

LIMIT

SW.

|

|

一

14

一

The

TF-350

is

manufacturerd

and

sold

for

the

purpose

of

use

in

factory,

laboratory

and

industrial

business.

It

is

designed

for

the

solder

to

melt

efficiently

with

hot

air.

Since

the

nozzle

gets high

in

temperature,

you

must

not

touch

it

before

its

cooling

down.

And

since

the

removed

SMD

is

still

high

in

temperature,

you

must

not

touch

it

for

certain

time

after

the

removal.

The

TF-350

will

not

stop

for

approx.

20

seconds

while

the

nozzle

is

cooled

down

by

the

air

pump

even

if

the

stop

button

is

pushed.

In

the

meantime

you

must

not

turn

off

the

power

switch.

Otherwise,

it

will

cause

accident

due

to

overheating.

®

9893

Brewers

Cout

Sherboume

House,

Laurel,

MD

20723

Sherboume

Drive

S.A.

Tilbrook,

Milton

Keynes,

U

Pacs,

inc,

Tel:

(301490

9860

MK7

8HX

www.paceusa.com

1

888 535

PACE

(7223)

United

Kingdom

Fax:

(301)498

3252

Tel:

(44)

1908

277666

Fax:

(44)

1908

277777

Vi