Panasonic PT56DLX75 - 56" DLP TV Bedienungsanleitung

ORDERNO. MKE0508855C1

Multi MediaDisplay

PT-56DLX75 / PT-61DLX75

SPECIFICATIONS

2005 PanasonicShikoku Electronics Co., Ltd. All rights

reserved. Unauthorized copying and distribution isaviolation of

law.

1. SAFETY PRECAUTIONS

1.1. GENERALGUIDELINES

1. For continued safety, no modification of anycircuitshouldbe

attempted.

2. Disconnect AC Plug before disassembling thisunit.

3. Itisadvisableto use an isolation transformer inthe AC supply

before servicing.

4. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

5. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers, shield, and isolation R-C

combinations etc. are properlyinstalled.

6. After servicing, be sure to restore the wires, leads, insulation

barriers, shields, etc.

7. After servicing, make the leakage current checks to prevent the

customer from being exposed to shock hazards.

Caution:

Use aseparate Isolation Transformer for thisunitwhen servicing.

1.2. LEAKAGECURRENTCOLDCHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. For physicallyoperated power switches, turn power on. Otherwise

skipstep 2.

3. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

receiver, such as screwheads, connectors, etc. When the exposed

metallicpart has areturn path to the chassis, the reading should

be between 1M and 12 M . When the exposed metal does not

have areturn path to the chassis, the reading must be infinity.

1.3. LEAKAGECURRENTHOTCHECK

1. Plug the AC cord directlyinto the AC outlet.

Donot use an isolation transformer for thischeck.

2. Connect "A"to exposed metallicpart on the set. And connect "B"

to agood earth ground, as showninFigure 1.

3. Use an AC voltmeter, with 1k /Vor more sensitivity, to measure

the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.25 VRMS.

Aleakage current tester (Simpson Model 228 equivalent) maybe

used to make the hot checks. Leakage current must not exceed 1/

2mA. Incase ameasurement isoutside of the limits specified,

there isapossibilityof shock hazard, and the receiver shouldbe

repaired and rechecked before itisreturned to the customer.

Figure 1

1.4. UV-PRECAUTION

1. Besure to disconnect the AC Plug when replacing the lamp.

2. Since the lamp reaches averyhigh temperature during its

operation, waituntil ithas completelycooled off when replacing

the Lamp Unit.

3. The lamp emits small amounts of UV-Radiation.

Avoiddirect-eyecontact bycovering the Lamp and wearing the

UVprotective glasses.

4. The high pressure lamp involves arisk of explosion.

Figure 2

1.5. TEMPERATUREDETECTIONFORTHELAMP UNIT

This projectorhas bimetal (Thermostat) contacting the lampunit toprotect the lamp. If the

temperature of the lampexceeds 120 °C, the bimetal will operate toturnoff the power.

The installedposition of the bimetal is showninthe illustration.

To recoverthe bimetal fromits off state, press the protrusion of the bimetal unit until hearclick.

Figure 3

2. PREVENTION OF ELECTROSTATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsandsemiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist

strap,whichshouldbe removed for potential shock reasons prior

to applying power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminum

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan antistaticsolder removal device. Some solder

removal devices not classified as "antistatic(ESDprotected)" can

generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminum foil or

comparableconductivematerial).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

CAUTION :

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficientto

damage an ES device).

3. ABOUT LEAD FREE SOLDER (PbF)

4. SERVICE NOTES

5. DISASSEMBLY/ASSEMBLY PROCEDURES

5.1. CABINET SECTION

5.2. OPTICALBLOCK SECTION

6. ADJUSTMENT PROCEDURES 1

7. ADJUSTMENT PROCEDURES 2

8. TROUBLESHOOTING HINTS

8.1. TROUBLESHOOTING HINTS FORBLOCK LEVEL REPAIR

9. BLOCK DIAGRAMS

10. SCHEMATIC DIAGRAMS

10.1. SCHEMATICDIAGRAMAND CIRCUITBOARD LAYOUTNOTES

10.2. INTERCONNECTIONSCHEMATICDIAGRAM

10.3. FRONTJACK (CIRCUITBOARD FJ) SCHEMATICDIAGRAM

10.4. OPERATIONSCHEMATICDIAGRAMS

10.5. VOLTAGECHART

11. CIRCUIT BOARD LAYOUT

11.1. FRONTJACK (CIRCUITBOARD FJ) C.B.A.

11.2. OPERATIONC.B.A.

12. EXPLODED VIEWS

12.1. MAINPARTS SECTION

12.2. FRONTAND BASE SECTION

12.3. DISPLAYSECTION

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