Panasonic ITD0810094CE Bedienungsanleitung

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ORDER NO. ITD0810094CE

Plasma Television

Model No. TH-50PY800HA

TH-50PY800MA

TH-50PY800MRA

TH-50PY800MSA

TH-50PY800MTA

Model No.

GPF11DA Chassis

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:

For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);

For d. c.: U1= 1.0 V,

Note:

The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.

The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. Important Notice

3.1.1. Model Name Identification

1. Model number is indicated the previous model number and space with A in rear cover as shown in figure.

2. TH-50PY800H/M/MR/MS/MT will be discontinued and TH-50PY800HA/MA/MRA/MSA/MTA will be introduced from Sep/2008.

3.2. Different P.C.B.

Parts No. Parts name & Description Remarks

TH-50PY800H/M/MR/MS/MT TH-50PY800HA/MA/MRA/MSA/MTA

TXN/A1RLTM TXN/A1BKUM CIRCUIT BOARD A HA/MA/MRA/MTA

TXN/A1RLTQ TXN/A1BKUQ CIRCUIT BOARD A MSA

TXNPB1RJTH CIRCUIT BOARD PB

ETX2MM704NGA CIRCUIT BOARD P(AC) HA/MTA

ETX2MM704MGB CIRCUIT BOARD P(AC) MA/MRA/MS

ETX2MM704NGL CIRCUIT BOARD P(MAIN) HA/MTA

ETX2MM704MGU CIRCUIT BOARD P(MAIN) MA/MRA/MS

TNPA4440 CIRCUIT BOARD C1

TNPA4441 CIRCUIT BOARD C2

TNPA4442 CIRCUIT BOARD C3

TZTNP01RJTM TZTNP01BFUM CIRCUIT BOARD D

TNPA4410 TNPA4657 CIRCUIT BOARD SC

TNPA4407 CIRCUIT BOARD SD

TNPA4411 TNPA4658 CIRCUIT BOARD SS

TNPA4405 CIRCUIT BOARD SS2

TNPA4406 CIRCUIT BOARD SU

TNPA4535AB CIRCUIT BOARD S

TNPA4515AC CIRCUIT BOARD G

TNPA4505AF CIRCUIT BOARD GH

TNPA4139AE CIRCUIT BOARD GS

TNPA4564AB CIRCUIT BOARD K

3.3. Service Hint

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Right)

A DC-DC Converter

Speaker out, Sound Processor

AV Terminal, AV Switch

Digital Signal Processor, MPU, HDMI Interface

Peaks Lite 2p

C2 Data Driver (Lower Center)

C3 Data Driver (Lower Left)

SC Scan Drive

SU Scan out (Upper)

SD Scan out (Lower)

D Format Converter, Plasma AI, Sub-Field Processor SS Sustain Drive

K Remote receiver, Power LED SS2 Sustain connector

S Power Switch GH HDMI3 in

GS SD Card Slot G Front Terminal, Key Switch

PB Fan control

3.4. Applicable signals

4 Specifications

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

Power Source AC 220 - 240 V, 50/60 Hz (HA/MA/MRA/MTA) AC 110-240V, 50/60Hz (MSA)

Power Consumption

Average use 555 W

Standby condition 0.4 W

Plasma Display panel

Aspect Ratio 16:9

Visible screen size 127 cm (diagonal)

1,106 mm (W) ×622 mm (H)

Number of pixels 2,073,600 (1,920 (W) ×1,080 (H))

Sound

Speaker Full range

Audio Output 20 W (10 W + 10 W), 10% THD

Headphones M3 (3.5 mm) stereo mini Jack ×1

PC signals VGA, SVGA, XGA, SXGA

Horizontal scanning frequency 31 - 69 kHz

Vertical scanning frequency 59 - 86 Hz

Receiving Systems / Band name

Receiving Channels

(Regular TV)

VHF BAND

2-12 (PAL/SECAM B, K1)

0-12 (PAL B AUST.)

1-9 (PAL B N.Z.)

1-12 (PAL/SECAM D)

1-12 (NTSC M Japan)

2-13 (NTSC M USA)

UHF BAND

21-69 (PAL G, H, I/SECAM G, K, K1)

28-69 (PAL B AUST.)

13-57 (PAL D, K)

13-62 (NTSC M Japan)

14-69 (NTSC M USA)

CATV

S1-S20 (OSCAR)

1-125 (USA CATV)

C13-C49 (JAPAN)

S21-S41 (HYPER)

Z1-Z37 (CHINA)

5A, 9A (AUST.)

Aerial - Rear VHF/UHF

Operating Conditions

Temperature: 0 °C - 40 °C

Humidity: 20 % - 80 % RH (non-condensing)

Connection Terminals

AV1

Input

AUDIO L - R

VIDEO

COMPONENT

RCA PIN Type ×2

RCA PIN Type ×1

PB/CB, PR/CR

0.5 V [rms]

1.0 V [p-p] (75 Ω)

1.0 V [p-p] (including synchronization)

± 0.35 V [p-p]

AV2

Input

AUDIO L - R

VIDEO

COMPONENT

RCA PIN Type ×2

RCA PIN Type ×1

PB/CB, PR/CR

0.5 V [rms]

1.0 V [p-p] (75 Ω)

1.0 V [p-p] (including synchronization)

± 0.35 V [p-p]

AV3

Input

AUDIO L - R

VIDEO

S-VIDEO

RCA PIN Type ×2

RCA PIN Type ×1

Mini DIN 4-pin

0.5 V [rms]

1.0 V [p-p] (75 Ω)

Y:1.0 V [p-p] (75 Ω) C:0.286 V [p-p] (75 Ω)

AV4

Input

AUDIO L - R

VIDEO

S-VIDEO

RCA PIN Type ×2

RCA PIN Type ×1

Mini DIN 4-pin

0.5 V [rms]

1.0 V [p-p] (75 Ω)

Y:1.0 V [p-p] (75 Ω) C:0.286 V [p-p] (75 Ω)

Monitor

Output

AUDIO L - R

VIDEO

RCA PIN Type ×2

RCA PIN Type ×1

0.5 V [rms] (high impedance)

1.0 V [p-p] (75 Ω)

Others HDMI1 / 2 / 3 Input TYPE A Connectors This TV supports “HDAVI Control 3” function.

PC Input HIGH-DENSITY D-SUB 15PIN R, G, B/0.7 V [p-p] (75 Ω)

HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)

Card slot SD Card slot ×1

Dimensions (W ×H ×D) 1,254 mm ×832 mm ×387 mm (With Pedestal)

1,254 mm ×778.9 mm ×85 mm (TV only)

Mass 42.0 kg Net (With Pedestal)

37.0 kg Net (TV only)

5 Service Mode

5.1. How to enter into Service Mode

While pressing [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.

5.1.1. Key command

[1] button...Main items Selection in forward direction

[2] button...Main items Selection in reverse direction

[3] button...Sub items Selection in forward direction

[4] button...Sub items Selection in reverse direction

[RED] button...All Sub items Selection in forward direction

[GREEN] button...All Sub items Selection in reverse direction

[VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

5.1.2. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

5.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

Dieses Handbuch passt für folgende Modelle

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