Panasonic RR-US570PP Bedienungsanleitung

Unauthorized copying and distribution is a violation of

law.

PSG0902009CE

IC Recorder

Model No. RR-US570PP

RR-US570E

RR-US590P

Product Color: (K)...Black Type

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

1.2. Protection Circuitry ---------------------------------------- 3

1.3. Safety Part Information (RR-US570, RR-

US590) ------------------------------------------------------- 3

2 Warning -------------------------------------------------------------- 4

2.1. Prevention of Electro Static Discharge (ESD)

to Electrostatically Sensitive (ES) Devices---------- 4

2.2. Service caution based on Legal restrictions -------- 5

3 Service Navigation ----------------------------------------------- 6

3.1. Service Information --------------------------------------- 6

3.2. Service Hint ------------------------------------------------- 6

4 Specifications ------------------------------------------------------7

5 Location of Controls and Components--------------------8

5.1. Components of IC Recorder ----------------------------8

5.2. Basic Operation --------------------------------------------9

6 Self-diagnostic/Doctor Mode-------------------------------- 10

6.1. Service Functions ---------------------------------------- 10

6.2. Firmware Update----------------------------------------- 13

7 Troubleshooting Guide --------------------------------------- 14

8 Disassembly and Assembly Instructions--------------- 17

8.1. Main Parts Location Diagram ------------------------- 18

8.2. Disassembly flow chart --------------------------------- 19

8.3. Disassembly of MIC Ornament and LED TIP----- 20

8.4. Disassembly of Rear Cabinet Assembly ----------- 21

8.5. Disassembly of Stand and Battery Cover ---------- 23

8.6. Replacement of Side Ornament, Mode Knob

and Hold Knob -------------------------------------------- 25

8.7. Replacement of Main P.C.B. -------------------------- 27

8.8. Disassembly of LCD P.C.B.---------------------------- 30

8.9. Disassembly of Rec Button---------------------------- 30

8.10. Disassembly of Up Down Button Unit and

Play Button------------------------------------------------- 31

8.11. Disassembly of Menu Button-------------------------- 32

8.12. Disassembly of Speaker Unit ------------------------- 33

8.13. Replacement of Front Ornament--------------------- 34

8.14. Disassembly of LCD Holder Unit --------------------- 35

9 Service Position ------------------------------------------------- 37

9.1. Checking and Repairing of Main P.C.B. and

LCD P.C.B.------------------------------------------------- 37

10 Voltage Measurement & Waveform Chart--------------- 39

10.1. MAIN P.C.B. (1/3) ---------------------------------------- 39

10.2. MAIN P.C.B. (2/3) ---------------------------------------- 40

10.3. MAIN P.C.B. (3/3) ---------------------------------------- 41

10.4. LCD P.C.B.------------------------------------------------- 42

10.5. Waveform Chart ------------------------------------------ 43

11 Illustration of IC’s, Transistors and Diodes ------------ 44

12 Block Diagram --------------------------------------------------- 45

13 Wiring Connection Diagram --------------------------------- 47

14 Schematic Diagram Notes ----------------------------------- 48

15 Schematic Diagram--------------------------------------------- 49

15.1. MAIN CIRCUIT (1/4) ------------------------------------ 49

15.2. MAIN CIRCUIT (2/4) ------------------------------------ 50

15.3. MAIN CIRCUIT (3/4) ------------------------------------ 51

15.4. MAIN CIRCUIT (4/4) ------------------------------------ 52

15.5. LCD CIRCUIT--------------------------------------------- 53

16 Printed Circuit Board ------------------------------------------ 54

16.1. MAIN P.C.B. ----------------------------------------------- 54

16.2. LCD P.C.B.------------------------------------------------- 55

17 Exploded View and Replacement Parts List ----------- 56

17.1. Exploded View and Mechanical Replacement

Parts List --------------------------------------------------- 56

17.2. Electrical Replacement Parts List-------------------- 60

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Protection Circuitry

The protection circuitry may have operated if either of the following conditions are noticed:

• No sound is heard when the power is turned on.

• Sound stops during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are

"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.

If this occurs, follow the procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once again after one minute.

Note:

When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

1.3. Safety Part Information (RR-US570, RR-US590)

Safety Parts List:

There are special components used in this equipment which are important for safety.

These parts are marked by in the Schematic Diagrams, Exploded View & Replacement Parts List. It is essential that these

critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the

original design without permission of manufacturer.

Table 1

Safety Ref. No. Part No. Part Name & Description Remarks

13 RKS0454A-K REAR CABINET US570PP

13 RKS0454B-K REAR CABINET US570E

13 RKS0454H-K REAR CABINET US590P

ICP501 D4FB1R100015 RESETTABLE FUSE

ICP502 D4FB1R100015 RESETTABLE FUSE

A3 RQT9358-Y O/I BOOK (En/Cf) US570PP

A3 RQT9361-B O/I BOOK (En) US570E

A3 RQT9362-E O/I BOOK (Ge/It/Fr/Du/Sp/Cn/Ar/Sw/Da/

Cz/Po/Pr/Ru/Ur)

US570E

A3 RQT9359-P O/I BOOK (En) US590P

2Warning

2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically Sensi-

tive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-

ium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution:

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-

ficient to damage an ES device).

2.2. Service caution based on Legal restrictions

2.2.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

Service caution for repair work using Lead Free Solder (PbF)

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.

• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

3 Service Navigation

3.1. Service Information

This service manual contains technical information which will allow service personnel’s to understand and service this model.

If the circuit is changed or modified, this information will be followed by supplement service manual to be filled with original service

manual.

3.2. Service Hint

3.2.1. Flash NAND ROM IC

Flash NAND ROM IC, IC701 is supplied as service part.

RR-US570 (1GB) - RFKWNUS570-S

RR-US590 (2GB) - RFKWNUS590-K

3.2.2. USB Serial Number

Serial Number is required to obtain the Firmware Updates.

3.2.3. Firmware Version

To obtain updated Firmware version and procedures for updating, please refer to item 6.2.

4 Specifications

Power

Batteries DC 3.0 V (2 AAA LR03 batteries)

Audio

Sampling Frequency

(Stereo/Monaural)

XP: 44.1 kHz/44.1 kHz

LP: 22.05 kHz/16 kHz

SLP: 8 kHz/8 kHz

Recording Format MP3

Playable Bit Rate (MUSIC

folder)

8 kbps to 320 kbps

Playable Sampling

Frequency (MUSIC folder)

8 kHz to 48 kHz

Frequency Response

(-10 dB, Rec-Play,

Monaural)

XP: 180 Hz to 15,100 Hz

LP: 180 Hz to 6,700 Hz

SLP: 180 Hz to 2,900 Hz

Built-in Microphone S/N

Ratio

40.5 dB (XP) Filter (JIS A)

USB USB2.0 (Hi-Speed)

Audio Output Earphone ø 3.5 mm (1.8”), 16 Ω, Max: 3 mW

Speaker

output

ø 20 mm (25/32”), 8 Ω, Max: 330 mW

Audio Input External

Microphone

ø 3.5 mm (1/8”),

0.80 mV plug in power

Built-in Memory 1 GB*1 (RR-US570)

2 GB*1 (RR-US590)

Operating Temperature 0°C to 40°C (32°F to 104°F)

Operating Humidity 20% to 80% (non-condensing)

*1 GB means one billion bytes. Usable capacity will be less.

Battery life (may be less depending on the operating conditions.)

Battery (AAA

LR03)

Recording mode Rec*3Play*4

Alkaline

battery*2

Stereo XP approx. 23 h. approx. 35 h.

LP approx. 29 h. approx. 35 h.

SLP approx. 32 h. approx. 35 h.

Monaural XP approx. 32 h. approx. 35 h.

LP approx. 42 h. approx. 35 h.

SLP approx. 45 h. approx. 35 h.

*2 Using Panasonic Alkaline battery.

*3 When zoom microphone is off.

*4 When audio is output from speaker (Volume: 13, EQ: off, playback

speed control: x 1).

Standard recordable time (RR-US570)

Recording mode Time Bit rate

Stereo XP 17 h, 50 min. 128 kbps

LP 35 h, 50 min. 64 kbps

SLP 143 h, 40 min. 16 kbps

Monaural XP 35 h, 50 min. 64 kbps

LP 71 h, 50 min. 32 kbps

SLP 287 h, 30 min. 8 kbps

Standard recordable time (RR-US590)

Recording mode Time Bit rate

Stereo XP 36 h, 00 min. 128 kbps

LP 72 h, 00 min. 64 kbps

SLP 288 h, 00 min. 16 kbps

Monaural XP 72 h, 00 min. 64 kbps

LP 144 h, 00 min. 32 kbps

SLP 576 h, 10 min. 8 kbps

Max. Dimensions (WxHxD) 40.4 mm x 110.6 mm x 16.8 mm

(1-19/32” x 4-11/32” x 21/32”)

Cabinet Dimensions

(WxHxD)

39 mm x 110.6 mm x 15.1 mm

(1-17/32” x 4-11/32” x 19/32”)

Mass (Weight) Approx. 65 g (2.30 oz.) with battery

Approx. 43 g (1.52 oz.) without battery

Specifications are subject to change without notice.

5 Location of Controls and Components

5.1. Components of IC Recorder

5.2. Basic Operation

6 Self-diagnostic/Doctor Mode

6.1. Service Functions

6.1.1. Test Mode

Purpose: To enter into Test Mode for checking and inspection of unit.

Procedures:

1. Set the recording position switch to “MANUAL” at the power off.

(Setting to “MANUAL” after turning on the power is OK.)

2. Slide [OPR/HOLD] switch to “OPR” side to turn on the power.

3. Set to “HOLD” mode by pushing [OPR/HOLD] button.

4. Input the below keys while displaying the “HOLD”.

[MENU] --> [ERASE] --> [ ] --> [VOL-]

Note : Input of these keys are done within two seconds while displaying “HOLD”.

5. All segments of LCD will Light up & the unit will enter into the Operation Check Mode. During the Operation Check Mode, the

Recording LED will be blinking.

6. To cancel Test Mode, power off the unit by removing batteries.

6.1.2. USB Serial Number (ID) Confirmation Function

Purpose: To check USB Serial Number (ID) which is written in the NAND flash memory at the final process is confirmed in this

mode.

Procedures:

1. Enter into Test Mode, check all segments of LCD light up.

2. Press and hold [ ] for 10 seconds and the USB serial number which is written in NAND flash memory is displayed.

6.1.3. Reset Function

Purpose:

• To reset to factory default setting.

• Only USB Serial Number (ID) is not initialized, and NAND flash memory is not formatted logically in this mode.

Procedures:

1. Enter into Test Mode, check all segments of LCD light up.

2. Set the Recording position switch to “WIDE”.

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