Philips Showline MCP9360I Bedienungsanleitung

MediaCenter PC Model
MCP9360i
Service Manual
Contents Page
1. About this Manual 2 Contents Page
2. Safety Instructions, Warnings and Notes 3
3. System Overview 5
4. Technical Reference 6
5. Required Equipment List 11
6. Diagnosis and Repair Flowchart 12
7. Installation and Initial Checks 13
8. Troubleshooting - Start-up Failure 16
9. Software Update and Repair 17
10. PC Doctor Diagnostic Tool 21
11. Hardware Tests 23
12. Hardware Repair 39
13. Software Re-installation 62
14. End Test 63
15. Parts Information 64
©
Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without prior permission of Philips.
Published by Consumer Electronics Printed in the Netherlands
Subject to modification EN 0000 000 00000

EN 2 1. MCP9360i About this Manual
1. About this Manual
1.1. Content of this Manual
Note: The MCP9360i will be serviced on a modular level only. Faulty modules will be identified and replaced. Detailed circuit
diagrams and technical information on a component level are therefore not provided in this document.
1.1.1. What is included in this Manual
• Safety Information
• System Overview
• Basic System Block Diagrams
• Parts / Module Identification
• Module Functional Descriptions
• Basic Module Technical Descriptions
• Basic Measuring Point Information
• Basic Fault Finding Strategy
• Module Removal & Replacement Procedures
• Functionality Testing Procedures
• End Test Sequence / Checklist
• Parts List / 12NC Numbers
1.2. Additional Documentation
The following documentation is supplied by Philips and must be kept with this Service Manual.
• MCP9360i Quick Install Guide
• MCP9360i Use Cases
• RC4370 Remote Control User Manual

Safety Instructions, Warnings and Notes MCP9360i 2. EN 3
2. Safety Instructions, Warnings and Notes
2.1. Safety Instructions
2.1.1. Safety components
Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component
substitution (other than original type) may increase risk of fire or electrical shock hazard.
2.1.2. After repair
• Safety regulations require that after a repair, the set must be returned in its original condition.
• Before returning the MCP9360i to the customer always do a safety check. Pay attention to the built-in protective devices, leakage
current and insulation resistance.
2.2. Warnings
2.2.1. General
Never replace modules or other components while the unit is switched “on”.
2.2.2. ESD Protection
All ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during
repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the
mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential.
2.3. Notes
2.3.1. Schematic notes
• All resistor values are in ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates
2.2 kohm).
• Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).
• All capacitor values are given in micro-farads (µ = x10-6), nano-farads (n = x10-9), or pico-farads (p = x10-12).
• Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).
• An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.
• The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.

EN 4 2. MCP9360i Safety Instructions, Warnings and Notes
2.3.2. Led-free solder
Philips CE is producing lead-free sets (PBF) from 1.1.2005 onwards.
Identification: The bottom line of a type plate gives a 14-digit serial number. Digits 5 and 6 refer to the production year, digits 7 and 8
refer to production week (in example below it is 1991 week 18).
Figure 2.1-1
Regardless of the special lead-free logo (which is not always indicated), one must treat all sets from this date onwards according to the
rules as described below.
Figure 2.1-2
Due to lead-free technology some rules have to be respected by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please
contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able:
- To reach a solder-tip temperature of at least 400 °C.
- To stabilize the adjusted temperature at the solder-tip.
- To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around 360 °C – 380 °C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400 °C, otherwise wear-out of tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or reduce heat.
• Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed
regimes. If this cannot be avoided, carefully clean the solder-joint from old tin and re-solder with new tin.
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard material (commodities) has to be purchased at external companies.
• Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against
moisture. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the IC gets "wet" inside
and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging
was opened before usage, the IC has to be heated up for some hours (around 90 °C) for drying (think of ESD-protection!).
Do not re-use BGAs at all!
• For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the
end of the service period. For the repair of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method:
- Always use the highest temperature to solder, when using SAC305 (see also instructions below).
- De-solder thoroughly (clean solder joints to avoid mix of two alloys).
Caution: For BGA-ICs, you must use the correct temperature profile, which is coupled to the 12NC. For an overview of these profiles,
visit the website www.atyourservice.ce.philips.com (needs subscription, but is not available for all regions)
You will find this and more technical information within the "Magazine", chapter "Repair downloads".
For additional questions please contact your local repair help desk.

System Overview MCP9360i 3. EN 5
3. System Overview
3.1. Technical Specification
System - General Connection rear
CPU: Intel Pentium D 945 Dual core, 3.4 GHz Video outputs: DVI-D single link
Memory: 1024 MB VGA
HDD: 250 GB SATA S-video (Y/C)
SCART (CVBS + RGB)
Optical disc recording:
DVD: +RW, +R, -R, -RW, +R DL Video Inputs: S-video (Y/C)
CD: -R, -RW CVBS
Wireless LAN: IEEE802.11 b/g Audio outputs: 2 x stereo Cinch L/R
Optical digital out
Software installed: Coax digital out
Windows® XP Media Center Edition
LikeMusic Audio inputs: 2 x stereo Cinch L/R
Norton Internet Suite Ethernet: 1 x (100 Mb)
Cyberlink: Make DVD, CaptureDV, PowerDVD USB: 2 x USB 2.0
Picture improvement: Trimension MCE IEEE1394: 2 x 6 pins
Philips Media Manager IR blaster: 2 x to support up to 3 IR blaster
eyes
Others: TV in
Picture Improvement algorithms: FM radio in
Digital Natural Motion
Motion adaptive de-interlacing Film mode detector
Tuner card: AVerMedia
TV system: PAL/SECAM Accessories
DVB-T DVI to DVI cable
DVI to HDMI cable
Connection front SCART cable
Card reader: MS/MS pro (Memory Stick) Digital audio coax cable
CF I/II Microdrive (Compact Flash) Power cable
Smart Media FM antenna cable
MMC/SD (Multi Media Card/Secure Digital) S-video (Y/C)
USB 2 x USB 2.0 Stereo audio cable
IEEE1394 1x 4 pins (i.LINK) Ethernet cable
Microphone 6.3 mm jack 2 x IR blaster with 1 IR transmitter
Headphone 6.3 mm jack TV antenna splitter
Antenna cable 10 cm
Antenna cable 1 m
SCART adapter (SCART to CVBS/S-video (Y/C))
Audio L/R Cinch
Universal remote control with batteries
Wireless keyboard with batteries

EN 6 4. MCP9360i Technical Reference
4. Technical Reference
4.1. System Block Diagram
Figure 4.1-1

Technical Reference MCP9360i 4. EN 7
4.2. System Cable Definition
4.2.1. System Cable Schematic
J8H1
FP_AUDIO
J5A2 J8A2
JAUDIO1
FP_1394
FP_USB
Cable 1
Cable 2
Cable 3
FP I/O Board
PCI Riser TV Tuner Card
PCI Bus
PCI Bus
JFP1 JJFP2
VFD Board
JUSB1 J2
J9H1 J6A1 J9C2 J7A2 SATA EIDE
PCI-E Riser ADD2 Board
PCI-E Bus
PCI-E Bus
SCART Daughter Card
-
-
Cable 10
SW Board
Card Reader
JRF1
Cable 4
Cable 5
JFP1
-
JRF2
Cable 6
RF Board
Cable 7
HDD
SATA
ODD
EIDE
Cable 8
Cable 9
MOTHERBOARD
Front panel
Front panel
Front panel
Rear panel
Rear panelRear panel
Figure 4.2-1

EN 8 4. MCP9360i Technical Reference
4.2.2. System Cable Definition Table
Cable
Number
Cable Name Start End(s)
1 FP_AUDIO_CABLE MB J8H1 FP BOARD JAUDIO1
2 FP_1394_CABLE MB J5A2 FP BOARD JFP1
3 FP_USB_CABLE MB J8A2 FP BOARD JFP2
4 VFD_USB_CABLE MB J6A1 VFD Board JUSB1
5 IR_BLASTER_INTERNAL_CABLE MB J9C2 VFD BOARD J2
6 SW_RF_CABLE VFD Board JRF1 SW BOARD JRF2
7 V-TYPE_CABLE MB J7A2 (1) SW BOARD JFP1
(2) CARD READER
8 SATA_HDD_CABLE MB J7F1 HDD
9 ATA33_ODD_CABLE MB EIDE ODD
10 ADD2_SCART_CABLE MB J9H1 (1) ADD2 SCART DAUGHTER CARD
(2) GRAPHICS CARD (ADD2 BOARD)

Technical Reference MCP9360i 4. EN 9
4.3. PSU Cables and Connectors Definition
4.3.1. PSU Cable Schematic
HDD
ODD
2x12-
p
in Main 2x2-
p
in
~
100-240 VAC
50/60 Hz
4-pinSATA
MOTHERBOARD
PSU
Figure 4.3-1

EN 10 4. MCP9360i Technical Reference
4.3.2. PSU Connector Pin Definition
Main Power Connector, 2x12-pin
Figure 4.3-2
+12V Power Connector, 2x2-pin
Figure 4.3-3
Peripheral Power Connector, 4-pin
Figure 4.3-4
Serial ATA (SATA) Power Connector
Figure 4.3-5
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