Samsung SGH-E340 Bedienungsanleitung

GSMTELEPHONE

SGH-E340

GSMTELEPHONECONTENTS

1.Specification

2.Circuit Description

3. ExplodedViews and PartsList

4. ElectricalPartsList

5.BlockDiagrams

6.PCB Diagrams

7. FlowChartofTroubleshooting

Samsung ElectronicsCo.,Ltd.MAY.2005

Printedin Korea.

CodeNo.:GH68-07223A

BASIC.

hisServiceManual isa propertyofSamsung ElectronicsCo.,Ltd.

nyunauthorized use ofManualcan bepunished underapplicable

nternationaland/ordomesticlaw.

ⓒ

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1. Specification

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1-1

PCS1900

1850~1910

1930~1990

512~810

80MHz

270.833kbps

3.692us

576.9us

4.615ms

0.3GMSK

30dBm~0dBm

0pcl~15pcl

-100dBm

1-1.GSMGeneralSpecification

GSM900

Phase 1 EGSM900

Phase 2 DCS1800

Phase 1

Freq.Band[MHz]

Uplink/Downlink890~915

935~960 880~915

925~960 1710~1785

1805~1880

ARFCN range 1~124 0~124 &

975~1023 512~885

Tx/Rx spacing 45MHz45MHz95MHz

Mod.Bitrate

/BitPeriod 270.833kbps

3.692us270.833kbps

3.692us

TimeSlotPeriod

/FramePeriod 576.9us

4.615ms576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK

MS Power33dBm~5dBm33dBm~5dBm30dBm~0dBm

PowerClass 5pcl~19pcl5pcl~19pcl0pcl~15pcl

Sensitivity-102dBm-102dBm-100dBm

TDMAMux8 8 8

Cell Radius35Km35Km2Km

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Specification

1-2

TX Power

control levelPCS1900

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

1-2.GSMTXpowerclass

TX Power

control levelDCS1800

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control levelGSM900

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

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2. Circuit Description

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2-1

2-1.SGH-E340 RFCircuitDescription

2-1-1.RX PART

—FRONTEND MODULE(ANTENNA SWITCHMODULE +RXSAWFILTER) (MODULE1)

→Switching Tx,Rx pathforGSM900,DCS1800 and PCS1900 by logic controlling.

—FRONTEND MODULEControlLosic(MODULE1)→Truth Table

VC1VC2VC3

TxMode(GSM900)HL L

TxMode(DCS1800/1900)LH H(L)

RxMode(GSM900)L L L

RxMode(DCS1800)L L L

RxMode(PCS1900)L L H

—VC-TCXO(U102)

Thismodulegeneratesthe26MHzreference clockto drivethelogic and RF.

It isturnedonwhenthesupply voltage +VCC_SYN isapplied.

Afterbuffering areference clock of26MHzis suppliedtotheotherpartsofthesystem

through thetransceiverpinOUT.

—TRANSCEIVER(U100)

ThischipisfullyintegratedGSMGPRStri-band transceiverwithVCO,loop filtersand mostofthe

passive component init.

And alsofullyintegratedfractionalNRFsynthesizerwithAFCcontrolpossibility,RFVCO withintegratedsupply

regulator.Semi integratedreference oscillatorwithintegratedsupplyregulator.

RFReceiver front-end amplifiestheE-GSM900,DCS1800 and PCS1900 aerialsignal,convert the chosenchannel

downtoalowIFof100kHz.

InIFsection,furtheramplifiesthewantedchanneloutput level tothedesired value and rejectsDC.

2-1-2.TX PART

Thetransmitterisfully differentialusing adirectup conversion architecture.Itconsistsofasignalsideband

powerup mixer.Gainiscontrolled by 6 dBvia3-wireserialbusprograming.ThefullyintegratedVCOand power

mixerachieveLOsuppression,quadraturephase error,quadrature amplitudebalance and lownoisefloorspecification.

Outputmatching/balun componentsdrive a standard 50 ohms single endedload.

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CircuitDescription

2-2

2-2.Baseband Circuitdescription ofSGH-E340

2-2-1.PCF50603 (U403)

—Power Management

Eight low-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimal

systemperformance and long batterylife.Aprogrammableboostconverterprovides supportfor1.8V,3.0VSIMs,

whileaself-resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,

suchasRTCmodule and High VoltageChargepump,Clock generator,aidinreducing both boardarea and system

complexity.

I2C BUSserial interface providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor

full controlofthePCF50603 and enables systemdesignerstomaximize bothstandby and talktimes.

Supervisoryfunctions.including aresetgenerator,aninputvoltagemonitor,and atemperaturesensor,supportreliable

systemdesign.Thesefunctionsworktogethertoensurepropersystembehaviorduring start-up orinthe eventofa

fault condition(lowmicroprocessorvoltage,insufficientbatteryenergy,orexcessivedietemperature).

—BacklightBrightness Modulator

TheBacklightBrightness Modulator (BBM)containsaprogrammablePulse-widthmodulator (PWM)and FET to

modulatetheintensity ofaseriesofLED?sortocontrolaDC/DCconverterthatdrivesLCDbacklight.

Thisphone(SGH-E340)usePWMcontrol tocontrast thebacklightbrightness.

—ClockGenerator

TheClockGenerator (CG)generatesall clocksforinternaland externalusage.The32.768 kHz crystaloscillator

providesanaccuratelowclockfrequencyforthePCF50603 and othercircuitry.

2-2-2.LCD Connector

LCDisconsisted ofmainLCD(color6.5KTFT LCD).

ChipselectsignalsintheU304,LCD_CS,canenableLCD.BACKLIGHTsignalenableswhiteLEDofmainLCD.

Thesesignal isfromU403.

16-bit datalines(LD(0)~LD(15)) transfersdata and commandstoLCD.Data and commandsuse"RS"signal.If this

signal ishigh,InputstoLCDare commands.If it islow,InputstoLCDaredata.Thesignalwhichinformsthe

inputoroutputstatetoLCD,isrequired.But this systemisnotnecessarythis signal.So"L_WR"signal isusedto

writedataorcommandstoLCD.PowersignalsforLCDare"VDD_IO_HIGH".

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CircuitDescription

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2-3

2-2-3.Key

Thisisconsisted ofkeyinterface pinsKEY_ROW(0:4)and KEY_COL(0:4)inPCF5212EL1.Thesesignalscompose

thematrix.Result ofmatrixinformsthekeystatusto keyinterface inthePCF5212EL1.Poweron/off keyis

seperatedfromthematrix.So poweron/off signal isconnectedwithPCF50603 toenablePCF50603.KeyLEDis

consisted ofsixteen blueLEDs.

keyLEDusethe3.3VLDO(U604) forasupply voltage.KEY_LED_ON signalenables sixteen blueLED.

"FLIP"informsthestatusofslide(open orclosed)tothePCF5212EL1.Thisusesthehall effectIC,

SH248CSP(U602).AmagnetunderLCDenablesSH248CSP.

2-2-4.EMIESDFilter(U501)

This systemusestheEMIESDfilter,U501 to protectnoisefromIFCONNECTORpart.

2-2-5. IFconnetor(CN302)

It is18-pinconnector.Theyaredesignedto useVBAT,V_EXT_CHARGE,USB_D+,+VBUS,USB_D-,TXD1,

RXD1,AUX_ON,EXT1,EXT2and GND.Theyconnectedto powersupplyIC,microprocessorand signalprocessor

IC.

2-2-6.BatteryCharge Management IC(U505)

Acomplete constant-current/constant-voltagelinearcharger forsingle cell lithium-ion batteriesisused.

If TAconnectedto phone,"V_EXT_CHARGE"enable charger ICand supplycurrent to battery.

Whenfault condition caused,"CHG_ON"signal levelchangelowto high and charger ICstop charging process.

2-2-7.Audio

HFR_Pand HFR_NfromPCF5212EL1are connectedtothemainspeakervia analog switches.MIC_Pand MIC_N

are connectedtothemainMICaswell.EAR1isthesource ofExternalSpeaker.YMU762 isasynthesizerLSI for

mobilephones.ThisLSIhasabuilt-inspeakeramplifier foroutputting soundsthatareused by mobilephonesin

addition to gamesoundsand ringing melodiesthatarereplayed by asynthesizer.

Thesynthesizersection adopts“stereophonichybridsynthesizersystem”thataregivenadvantagesofbothFM

synthesizersand WaveTablesynthesizerstoallowsimultaneousgeneration ofup to32FMvoicesand 32 Wave

Tablevoices.

Itprovides simultaneousgeneration ofup to40tonesby stereophonichybridsynthesizer.

YMU762 hasbuilt aspeakeramplifierofwhichmaximumout is580 mWatSPVDD=3.6Vinthisdevice.

ThereisStereophonic analog outputforHeadphone.

2-2-8.Memory(U301)

This systemusesSamsung'smemory,KAP17SG00A.TheKAP17SG00AisaMulti ChipPackageMemorywhich

combines256Mbit SynchronousBurstMulti Bank NORFlashMemoryand two 512Mbit OneNAND Flashand

128Mbit SynchronousBurstUtRAM.

Ithas16 bit dataline,HD[1~16]whichisconnectedtoPCF5212EL1and MV3018SAQ,also has24 bit address

lines,

HA[1~24].There are3chipselectsignals,CS0n_FLASH,CS4n_NAND,and CS1n_RAM.

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CircuitDescription

2-4

IntheWrting process,WEnisfallentolowand it enableswriting process to operate.During reading process,

OEnisfallentolowand it enablesreading process to operate.EachchipselectsignalsinthePCF5212EL1choose

differentmemories.

2-2-9.PCF5212EL1(U200)

ThePCF5212EL1ismainlycomposed ofembededDSP and ARMcore.TheDSP subsystemincludestheSaturn

DSP corewithembeddedRAMand ROM,and asetofperipherals.Ithas24kx16 bitsPRAM,104k*16 bits,

32k*16 XYRAMand 63k*16 XYROMintheDSP.

TheARM946E-SconsistsofanARM9E-Sprocessorcore,8 kbyteinstruction cache and 8 kbytedata cache,

tghtly-coupledITCM(Instruction TightlyCoupledMemory)and DTCM(DataTightlyCoupledMemory)memories,a

memory protection unit,and anAMBA(AdvancedMicrocontrollerBusArchitecture)AHB(Advanced

High-performance Bus)businterface withawritebuffer.

HD(0:15),datalinesand HA(0:23),address linesare connectedtoKAP17SG00A(memory),MV3018B(imagedsp)

and YMU762 (melody IC).Ithas64 kbyteSC RAM(0.5Mbit)and 32 kbyteSCprogramROMforbootstrap

loaderintheARMcore.

HD(0:15),datalinesand HA(0:23),address linesare connectedtomemoryand YMU762 tocommunicate.

MV3018B(CameraDSP Chip)controlsthe communication betweenARMcore and DSP core.

OEn,WEncontrol the access ofmemory.KROW,and KCOLrecognize thekeystring inputstatus.

Ithas J-TAG controlpins(TDI/TDO/TCK) forARMand DSP core.J-SEL signalcontrolsdifferentaccess toARM

and DSP core.

ADC(Analog toDigitalConvertor) receivesthe condition oftemperature,batterytype and battery voltage.

2-2-10.TCO-5871U(26MHz)(U102)

This systemusesthe26MHzTCXO,TCO-5871U,Toyocom.AFCcontrolsignalformPCF5212EL1controls

frequencyfrom26MHzx-tal.Itgeneratesthe clockfrequency.ThisclockisconnectedtoPCF5212EL1,YMU762

and HD155166.

2-2-11.CameraDSP(MV3018SAQ)(U304)

MV3018SAQ providesrich videofunctionsup to 30-framedisplaywithminimizedtasksinthehandsetmain

processor

aswell ashardwarebasedreal-timeJPEGcompression and decompression.MV3018SAQ directlytransmitsand

previewstheRGBdatatotheLCDgraphicmemory by processing thesensoroutputdata according tothe

handset'scommand.ItcansavetherawRGBdataup toVGA resoultion intoitsimagebufferand allowsthe

hostprocessorto downloadwithscalablesizedcompressed data.

Itutilizes16 bit databusforcommunication withthemain processor,including businterface types.

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3. ExplodedViewand Parts List

3-1

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3-1.Exploded View

QFR01

QMO01

QSP01

QKP01

QRE01

QMP01

QVK01

QAN02

QME01

QIF01

QMI01

QCR06

QMW02

QFU01

QLC01

QCA01

QCR05

QFR02

QFL01

QSC01

QCR04

QMW01

QRF01

QVO01

QSC14

QRF03

QBA01

QMI03

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Explodedviewand PartList

3-2

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3-2.PartsList

LocationNO.DescriptionSEC CODE

QRF03 COVEREARJACKGH72-19702A

QFR01 FRONTGH75-06795A

QMI03 MICHOLDERGH73-04563A

QVO01 VOLUMEKEYGH72-19705A

QSC14 TAPEFRONTHOLEGH74-14197A

QKP01 MEC-KEYPADGH75-06860A

QME01 UNITMETALDOMEGH59-02045A

QMI01 MICROPHONEASSYGH30-00199A

QMP01 PBAMAINGH92-02049A

QVK01 UNITVOLUMEKEYGH59-02067A

QAN02 INTENNAGH42-00557A

QRE01 MEC-REARCOVERGH75-06861A

QIF01 COVERIFCONNECTORGH72-19704A

QCR06 SCREW-MACHINE6001-001155

QRF01 RFCOVERGH74-14863A

QBA01 BATTERYGH43-01677A

QMW02 WINDOWSUBGH72-19678A

QFU01 UPPERFOLDERGH75-06800A

QLC01 LCDGH07-00680A

QMO01 MOTORDCGH31-00154D

QSP01 SPEAKER3001-001759

QCA01 UNITCAMERAGH59-02098A

QCR05 SCREW-MACHINE6001-001478

QFR02 OILDAMPERGH75-06799A

QFL01 FOLDERLOWERGH75-06794A

QCR04 SCREW-MACHINE6001-001479

QSC01 SCREWCAPGH73-04750A

QMW01 MEC-WINDOWMAINGH75-06801A

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