Samsung SGH-X700 Bedienungsanleitung

GSM TELEPHONE

SGH-X700

GSM TELEPHONE CONTENTS

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams

7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. December. 2005

Printed in Korea.

Code No.: GH68-08969A

BASIC.

This Service Manual is a property of Samsung Electronics Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable

International and/or domestic law.

ⓒ

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1. Specification

This Document can not be used without Samsung's authorization

1-1

PCS1900

1850~1910

1930~1990

512~810

80MHz

270.833kbps

3.692us

576.9us

4.615ms

0.3GMSK

30dBm~0dBm

0pcl ~ 15pcl

-100dBm

GSM900

Phase 1

EGSM 900

Phase 2

DCS1800

Phase 1

Freq. Band[MHz]

Uplink/Downlink

890~915

935~960

880~915

925~960

1710~1785

1805~1880

ARFCN range 1~124 0~124 &

975~1023 512~885

Tx/Rx spacing 45MHz 45MHz 95MHz

Mod. Bit rate

/BitPeriod

270.833kbps

3.692us

270.833kbps

3.692us

270.833kbps

3.692us

Time Slot Period

/ Frame Period

576.9us

4.615ms

576.9us

4.615ms

576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm

Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl

Sensitivity -102dBm -102dBm -100dBm

TDMA Mux 8 8 8

Cell Radius 35Km 35Km 2Km

1-1. GSM General Specification

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Specification

1-2

TX Power

control level

PCS1900

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level

DCS1800

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level

GSM900

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

1-2. GSM TX power class

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2. Circuit Description

2-1

This Document can not be used without Samsung's authorization

2-1. SGH-X700 RF Circuit Description

2-1-1. RX PART

- FRONT END MODULE(ANTENNA SWITCH MODULE + RX SAW FILTER) (U100)

It performs to switch Tx & Rx paths for GSM900, DCS1800 and PCS1900 with logic controls below.

- FEM Control Logic Table

FESW1 FESW2

Tx Mode (GSM900) H L

Tx Mode (DCS1800/1900) L H

Rx Mode (GSM900) L L

Rx Mode (DCS1800) L L

Rx Mode (PCS1900) L L

- VC-TCXO (TCX100)

This module generates the 26MHz reference clock to drive the logic and RF systems.

It is turned on when the supply voltage (+VCC_SYN_2V8) is applied.

After buffering, the 26MHz reference clock is supplied to the other parts of the system through the transceiver pin

CLKOUT.

- Transceiver (U102)

This chip is fully integrated GSM & GPRS tri-band transceiver with RF VCO, loop filters and most of the

passive components required in it.

It also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply

regulator. Semi integrated reference oscillator with integrated supply regulator.

RF Receiver front-end amplifies the E-GSM900, DCS1800 and PCS1900 aerial signal, convert the chosen channel

down to a low IF of 100kHz.

In IF section, further amplifies the wanted channel, performs gain control to tune the output level to the desired value and

rejects DC.

2-1-2. TX PART

The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band

power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power

mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.

Output matching/balun components drive a standard 50 ohms single ended load.

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Circuit Description

2-2

This Document can not be used without Samsung's authorization

2-2. Baseband Circuit description of SGH-X700

2-2-1. PCF50603 (U400)

- Power Management

Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal

system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,

while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,

such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system

complexity.

I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor

full control of the PCF50603 and enables system designers to maximize both standby and talk times.

Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable

system design. These functions work together to ensure proper system behavior during start-up or in the event of a

fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

- Pulse-Width Modulator

The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) to modulate the

intensity of a series of LED's or to control a DC/DC converter that drives LCD backlight.

This phone is using PWM control to modulate the LCD backlight brightness.

- Clock Generator

The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator

provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD

X700 has just one 1.9" TFT LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. There are

couple of control signals such as RS, CS, RD, WR, etc. RS stands for "Register Select pin." When RS = 0, data can be

written to the index register or status can be read, and when RS = 1, an instruction can be issued or data can be written

to or read from RAM. Read or write operation is selected according to RD/WR signals. The data is received when the

R/W bit is 0, and is transmitted when the R/W bit is 1. At the falling edge of CS input, serial data transfer is

initiated. On the other hand, at the rising edge of CS input, the data transfer is ceased.

2-2-3. Key

Key recognition part is consisted of 8 ports from PCF5213EL1. KEY_ROW(0:4) & KEY_COL(0:4)

These signals performs with the matrix. Any input from the matrix informs the key status to key interface in the

PCF5213EL1. Power on/off key is independent of the matrix. Therefore, 'power on/off' signal is directly connected with

PCF50603 to turn PCF50603 on.

3.3V LDO(U700) enables Key LED on. Key LED consists of 12 LEDs. It is controlled by "Key_led_on" signal.

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Circuit Description

2-3

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2-2-4. EMI ESD Filter (U500)

This system uses the EMI ESD filter (U500) to protect the device from noises from IF CONNECTOR part.

2-2-5. IF connetor (IFC500)

It has 18-pin. They are designed to allocate VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,

AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.

2-2-6. Battery Charge Management

X700 has a complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries inside.

If Travel Adapter is connected, "V_EXT_CHARGE" begins to provide the charger IC (to battery) with power (current).

When the charging operation is done, "End_of_charge" informs it to PCF5213EL1 to stop the operation. "CHG_ON"

signal enables the charger IC to operate in adequate circumstances.

2-2-7. Audio - Part

X700 has several audio-outputs such as stere speaker, receiver, earphone, etc. RCV_P/N signals from CPU are connected

to the receiver via analog switche (U602). MIC_P/N are connected to the main MIC as well.

YMU762 is a synthesizer LSI for mobile phones. This LSI has a built-in speaker amplifier for outputting sounds that are

used by mobile phones in addition to game sounds and ringing melodies that are replayed by a synthesizer.

YMU762 has built a speaker amplifier of which maximum out is 580 mW at SPVDD=3.6V in this device. There is

Stereophonic analog output for Headphone.

2-2-8. Memory (UME300)

X700 has KAP17SG00A-D4U4 as a memory module.

The KAP17SG00A-D4U4 is a Multi Chip Package Memory which combines 256Mbit Synchronous Burst Multi Bank NOR

Flash Memory and 512Mbit OneNAND Flash and 128Mbit Synchronous Burst U tRAM.

It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,

HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS1n_RAM, and CS4n_NAND.

Inthewrtingprocess,WEnisfallentolowanditenableswriting process to operate. During reading process,

OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose

different types of memory.

2-2-9. PCF5213EL1 (UCP200)

The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn

DSP core with embedded RAM and ROM, and a set of peripherals. It has 24k×16 bits PRAM, 104k×16 bits,

32k×16 XYRAM and 63k×16 XYROM in the DSP.

The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,

tightly-coupled ITCM (Instruction Tightly Coupled Memory) and DTCM (Data Tightly Coupled Memory) memories, a

memory protection unit, and an AMBA (Advanced Microcontroller Bus Architecture) AHB (Advanced

High-performance Bus) bus interface with a write buffer.

HD(0:15), data lines and HA(0:23), address lines are connected to KAP17SG00A (memory), MV3018B (image dsp)

and YMU762 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap

loader in the ARM core.

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Circuit Description

2-4

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HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU762 to communicate.

MV3018B(Camera DSP Chip) controls the communication between ARM core and DSP core.

OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.

It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM

and DSP core.

ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU762 to communicate.

MV3315DOQ(Camera DSP Chip) controls the communication between ARM core and DSP core.

OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.

It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM

and DSP core.

ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. VC-TCXO-214C6 (TCX100, 26MHz)

This system has the 26MHz TCXO, TCO-5871U from Toyocom. AFC controlling signal form PCF5213EL1 controls

frequency from 26MHz X-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU762 and

UAA3587.

2-2-11. Camera DSP (U303, MV3315DOQ)

MV3315DOQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor

as well as hardware based real-time JPEG compression and decompression. MV3315DOQ directly transmits and

previews the RGB data to the LCD graphic memory by processing the sensor output data according to the

handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the

host processor to download with scalable sized compressed data.

It utilizes 16 bit data bus for communication with the main processor, including bus interface types.

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4. Electrical Parts List

4-1

This Document can not be used without Samsung's authorization

Design LOC Description SEC CODE STATUS

AN300 ANTENNA-CHIP 4202-001060 SA

BAT400 BATTERY-LI(2ND) 4302-001119 SA

BTC500 HEADER-BATTERY 3711-006026 SA

C100 C-CER,CHIP 2203-001385 SA

C103 C-CER,CHIP 2203-000812 SA

C104 C-CER,CHIP 2203-000233 SA

C105 C-CER,CHIP 2203-000995 SA

C106 C-CER,CHIP 2203-000995 SA

C109 C-CER,CHIP 2203-001201 SA

C110 C-CER,CHIP 2203-005057 SA

C112 C-CER,CHIP 2203-000812 SA

C113 C-CER,CHIP 2203-000233 SA

C114 C-CER,CHIP 2203-000233 SA

C115 INDUCTOR-SMD 2703-001748 SA

C116 C-CER,CHIP 2203-005393 SA

C118 C-CER,CHIP 2203-000812 SA

C121 C-CER,CHIP 2203-000425 SA

C122 C-CER,CHIP 2203-000425 SA

C123 C-CER,CHIP 2203-006190 SA

C124 C-CER,CHIP 2203-000233 SA

C126 C-CER,CHIP 2203-005234 SA

C127 C-CER,CHIP 2203-000585 SA

C128 C-CER,CHIP 2203-000330 SA

C133 C-CER,CHIP 2203-000254 SA

C134 C-CER,CHIP 2203-005393 SA

C135 C-CER,CHIP 2203-000254 SA

C136 C-CER,CHIP 2203-000812 SA

C137 C-TA,CHIP 2404-001406 SA

C139 C-CER,CHIP 2203-005234 SA

C140 C-CER,CHIP 2203-000654 SA

C141 C-CER,CHIP 2203-001383 SA

C147 C-CER,CHIP 2203-002677 SA

C148 C-CER,CHIP 2203-005053 SA

C149 C-CER,CHIP 2203-002668 SA

C150 C-CER,CHIP 2203-000696 SA

C201 C-CER,CHIP 2203-000254 SA

C202 C-CER,CHIP 2203-005482 SA

C203 C-CER,CHIP 2203-005482 SA

C204 C-CER,CHIP 2203-000812 SA

C205 C-CER,CHIP 2203-005482 SA

C206 C-CER,CHIP 2203-005482 SA

C207 C-CER,CHIP 2203-005482 SA

C208 C-CER,CHIP 2203-005482 SA

C209 C-CER,CHIP 2203-005482 SA

C210 C-CER,CHIP 2203-000812 SA

C211 C-CER,CHIP 2203-005482 SA

C212 C-CER,CHIP 2203-005482 SA

C213 C-CER,CHIP 2203-005482 SA

C216 C-CER,CHIP 2203-005482 SA

C217 C-CER,CHIP 2203-005482 SA

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Electrical Parts List

4-2

This Document can not be used without Samsung's authorization

Design LOC Description SEC CODE STATUS

C218 C-CER,CHIP 2203-005482 SA

C219 C-CER,CHIP 2203-005482 SA

C300 C-CER,CHIP 2203-005480 SA

C301 C-CER,CHIP 2203-000254 SA

C302 C-CER,CHIP 2203-000233 SA

C303 C-CER,CHIP 2203-000254 SA

C304 C-CER,CHIP 2203-005482 SA

C306 C-CER,CHIP 2203-005480 SA

C307 C-CER,CHIP 2203-005480 SA

C308 C-CER,CHIP 2203-000995 SA

C309 C-CER,CHIP 2203-000679 SA

C310 C-TA,CHIP 2404-001394 SA

C311 C-CER,CHIP 2203-005482 SA

C312 C-CER,CHIP 2203-006562 SA

C313 C-CER,CHIP 2203-006137 SA

C314 C-CER,CHIP 2203-005482 SA

C315 C-CER,CHIP 2203-006137 SA

C316 C-CER,CHIP 2203-006137 SA

C317 C-CER,CHIP 2203-006137 SA

C318 C-CER,CHIP 2203-005480 SA

C319 C-CER,CHIP 2203-005482 SA

C320 C-CER,CHIP 2203-000233 SA

C321 C-CER,CHIP 2203-005482 SA

C322 C-CER,CHIP 2203-005482 SA

C323 C-CER,CHIP 2203-005482 SA

C324 C-CER,CHIP 2203-005482 SA

C325 C-CER,CHIP 2203-005482 SA

C326 C-CER,CHIP 2203-000679 SA

C327 C-CER,CHIP 2203-005482 SA

C328 C-CER,CHIP 2203-005482 SA

C329 C-CER,CHIP 2203-006208 SA

C330 C-CER,CHIP 2203-000725 SA

C331 C-CER,CHIP 2203-000438 SA

C332 C-CER,CHIP 2203-005482 SA

C336 C-CER,CHIP 2203-005482 SA

C337 C-CER,CHIP 2203-006399 SA

C338 C-CER,CHIP 2203-006399 SA

C339 C-CER,CHIP 2203-005482 SA

C340 C-TA,CHIP 2404-001394 SA

C350 C-CER,CHIP 2203-000233 SA

C400 C-CER,CHIP 2203-006053 SA

C401 C-CER,CHIP 2203-006053 SA

C402 C-TA,CHIP 2404-001394 SA

C403 C-TA,CHIP 2404-001375 SA

C404 C-CER,CHIP 2203-006364 SA

C405 C-CER,CHIP 2203-006708 SA

C406 C-CER,CHIP 2203-006708 SA

C407 C-CER,CHIP 2203-005482 SA

C408 C-CER,CHIP 2203-006257 SA

C409 C-CER,CHIP 2203-000330 SA

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