Samsung NP900X4D Bedienungsanleitung

Amor2-14CRVM

NP900X4D

SERVICEMANUAL

NP900X4DContents

1.Precaution

2.Introduction

3.DesassemblyandReassembly

4.Troubleshooting

5.SystemWireDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1

1.2.SafetyPrecautions...................................................................................................................1−2

1.3.Ground..................................................................................................................................1−3

1.4.StaticElectricityPrecautions......................................................................................................1−4

2.Introduction.....................................................................................................................................2−1

2.1.ProductFeatures......................................................................................................................2−1

2.2.Specication...........................................................................................................................2−2

2.3.Comparingproductspecications...............................................................................................2−7

2.4.FunctionofProduct..................................................................................................................2−8

2.5.NewTechnology/ability..........................................................................................................2−14

2.6.Hardware...............................................................................................................................2−21

2.7.Software................................................................................................................................2−27

2.8.BiosSetup..............................................................................................................................2−29

2.9.HW&OptionMaterials............................................................................................................2−34

3.DesassemblyandReassembly..............................................................................................................3−1

3.1.MainSystem...........................................................................................................................3−1

3.2.TOPA ’ssy..............................................................................................................................3−4

3.3.LCDA’ssy..............................................................................................................................3−6

4.Troubleshooting...............................................................................................................................4−1

4.1.Generalspec...........................................................................................................................4−1

4.2.DebuggingFlowChart..............................................................................................................4−2

4.3.Diagnosisapplication...............................................................................................................4−5

4.4.SystemDiagnosis....................................................................................................................4−7

4.5.HardwareTroubleshooting........................................................................................................4−8

4.5.1.LCD.........................................................................................................................4−8

4.5.2.ProblemsrelatedwithPower.........................................................................................4−9

4.5.3.Others.......................................................................................................................4−11

4.6.CPUFANControl....................................................................................................................4−14

4.7.Other.....................................................................................................................................4−16

4.8.H/WUpgrade..........................................................................................................................4−17

5.SystemWireDiagram........................................................................................................................5−1

5.1.SystemLayout........................................................................................................................5−1

5.2.SystemComponent..................................................................................................................5−3

1.Precaution

1.1.GeneralAfter-SalesServicePrecautions

1)Donotletcustomersrepairtheproductthemselves..

›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.

2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales

serviceofelectricparts).

›Thereisadangerofelectricshock.

3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.

›Thereisadangerofreduetooverheating.

4)Checkifthepowerplugorwalloutletaredamagedinanyway.

›Ifadefectisfound,repairorreplaceitimmediately.

(Thereisadangerofelectricshockorre)

5)Makesurethatitisproperlygrounded.

(Checkthegroundofthewalloutlet)

›Electricityleakagemaycauseelectricshock.

DEVICE

UNDER

TES T

(RE ADING S HOULD)

NOT BE ABOVE 0 .5mA

LEAKAGE

CUR RE NT

TES TE R

TES T ALL

EXP OS E D METAL

S URFACE S

2-WIRE C OR D

*ALSO TES T WITH

P LUG RE VER S ED

(US ING AC ADAPTE R

P LUG AS RE QUIRE D) EARTH

GR OUND

Figure1.1LeakageCurrentTestCircuit

6)Donotspraywaterontotheproducttocleanit.

›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..

7)Checktheassemblystatusoftheproductaftertheafter-salesservice..

›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.

8)Unplugthepowercordholdingthepowerplug(andnotthecord).

›Ifthecordisdisconnected,itmaycauseelectricshockorre.

9)Repairtheproductusingonlyauthorizedparts

10)Keeptheproductawayfromheatingdevicessuchasheaters.

›Exposuretoheatersmaycausedeformationoftheproductorre.

1.Precaution

1.2.SafetyPrecautions

1)EMI

ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.

2)CircuitT est(LogicTest)Precautions

TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since

thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.

Thereforereadandfollowtheinstructionsbelow.

a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In

addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.

b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.

c)Youmustuseasolderingironwithoutaleakagecurrent.

d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.

e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong

direction,itmightbecomedamaged.

f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto

keepthevoltagelevelofeachoftheterminalsthesame.

g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.

j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.

k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.

l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.

1.Precaution

1.3.Ground

Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea

multitapwithagroundterminalonly.

Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif

theyarenotgroundedeveniftheyhaveagroundterminal.

Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto

thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa

metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.

NevergroundtheproducttoaPVCwaterpipe,phoneline,TV ,radioantenna,aluminumwindoworgaspipe,becausethis

doesnotactuallygroundtheproductandmaybedangerous.

1.Precaution

1.4.StaticElectricityPrecautions

Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant

forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair

andlowerstheexpensesfordamagedparts.

Topreventstaticelectricity,followtheinstructionsbelow.

1)Performtherepairinalocationwithoutstaticelectricity.

2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic

Electricityfromyourbodybeforehandlingtheparts.

3)Touchonlytheedgesoftheboard,ifpossible.

4)Donottouchanypartsunlessabsolutelynecessary

5)Disassemblethepartsontheanti-static-electricitypad.

6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.

2.Introduction

2.1.ProductFeatures

2.Introduction

2.2.Specication

ProcessorandMotherboard

CPUIntelIvyBridge_BGAType-Non

UpgradableMaxspec

Intel®Core™i7Processor3517U

(1.9GHz,4MB)

Intel®Core™i5Processor3317U

(1.70Hz,3MBL3Cache)

CacheL3:3~6MB

ChipsetIntelHM75

BIOS64MbitSPIash

ThermalDesignPerformanceAll17W

Memory

Memory/Max.MemoryPC3-1066S(1333MHz),PC3-12800S(1600MHz),2-slotSODIMMMin.4GB~Max.

8GB

Memorytype1333MHz/1600MHzDDR32-SlotSODIMM

MemoryModules2GBSODIMM,4GBSODIMM(1-Slot)

Sockets2-slotSODIMM's

※K4B8G3346B-MCH9(1333MHz)conrmedthecompetibilitytest

DisplayandGraphics

LCD15.0"SuperBright400nitHD+LEDDisplay(1600x900),Anti-Reective

TypeLEDLCDwithAntiGlare(=NonGlare)

PanelTNMode

LCDViewableArea332.4(H)x186.975(V)

LCDResolutionHD+(1600x900)

Win7Support:(1600X900,1366X768,1280X720,

1024X768,800X600)

XPSupport:(1600X900,1366X768,1280X720,

1024X768,800X600)

DotPitch0.20775(H)x0.20775(V)Mm

Viewingangle45/45/15/30(L/R/U/D)

Openingangle135

ReectionRateHaze25

ContrastRatioTyp.500

Brightnesstyp.400(cd/m2)

ResponsetimeAM:Rising+Fallingtyp.16ms

GraphicsControllerIntelHDGraphics4000

VideoMemorySharedmemory(Int)GraphicssetintheBIOSsetting:64MBWindowsboot:1696MB

GPUTDPMax.17W(CPUIntegrated)

2.Introduction

Max.ResolutionforLVDSduallinkresolutionof2560x2048perlink/amaximumtheoreticalpixel

rateof224MP/sMAX2560x2048(640x480,800x600,1024x768,1152x864,

1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,

1680x1050,1920x1200,2560x2048)[Ext.monitorresolutionssupportedbyEDID

information]

Max.resolutionforVGAMaxresolutionof2560x1600at85Hzrefreshrate(ext.)Supported

resolutionMAX2560x1600(640x480,800x600,1024x768,1152x864,

1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,

1680x1050,1920x1200,1920x1440,2560x1600)[Ext.monitorresolutionssupported

byEDIDinformation]

Max.resolutionforHDMISupportv1.4acompliant/aresolutionof1920x1200pixelswith32-bitcolorat60Hz

[Ext.monitorresolutionssupportedbyEDIDinformation]

ControlsKeyboardBrightnessControl

AudioandVideo

SoundRealtekHighDenitionAudio

ControllerHDAudioCodec,ALC269Q-VC-GR

ConversionBuilt-inhighperformance24-bitADC&24-bitDAC

InternalInterfacesEmbeddedstereospeakers,InternalArrayMIC

SpeakerPowerRating2Speakersx2.0Wattwithenclosureeach

ExternalInterfacesMicrophone,Headphone,ComboJackSupport(4PoleCombo:MIC/GND/SPK/SPK

=Apple'sapproach),SPDIFNOTSUPPORT

ControlsKeyboardvolumecontrol,SideV olumebutton

SoundeffectSoundAlive

Microphone3poleMic/HPcombo

TypeArrayMic:DIGITALSMDtypedualarraymic(Mainboard/Camera)

Sensitivity-26dBFS[0dB=1V/Pa,at1KHz]

S/NRatio56(min)Db

Camera

ModelnameSC-13HDL11624N(IMX119P+SPCA2088)

Imagesensor1.3MegaCMOScolorimagesensor

StillImageCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240,176*144,

160*120

VideoCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240,176*144,

160*120

FrameRateMax30fps@1.3M

OutputVideoFormatYUY2,MJPEG

InterfaceUSB2.0

UVCSupportCompliantwithUSBVideoClass

Storage

TypemSATA(miniPCIetype)

SolideStaeDiskSATA23.0Gbps/SATA36.0Gbps

SupportsuptoA TA/A TAPI-7standard

2.Introduction

CapacityMAX.256GB,128GB

Size30*51*3.8mm,W*L*H

NANDMLC

OpticalDriverModules(Share)

OpticalDiskDriver(Option)Ext.ODD:AA-ES3P95M

SpecTS-U633J/SCEFZ,8X,170MS,USB,1.5MB,7.5W,5V ,Blueblack

TypeHalf-FinishedType5902,

Speed5xDVD-RAM,8xDVD±R,6xDVD±RDL,8xDVD+RW,6xDVD-RW,24x

CD-R/RW,8xDVD,24xCD

Weight130gorless

NetworkT ools(Share)

LAN10/100/1000GigabitEthernetLAN

RTL8111E,RJ45output

CombomoduleIntelCentrino@Advanced-N6235

JacksonPeak2(BA59-03294A)

Spec6235AN.HMWG,-,2x2,HalfMiniCardSTD,IEEE802.11a/g/n,26.8*30.0

Type2X2WLAN/BTcombomodule,802.11abg/Bluetooth4.0(WIDIsupport)

Max.LinkSpeed300Mbps(LinkSpeedisonlystandardvalue,Actuallyvaluewilldecidedbyeach

environmant)

ChipsetJacksonPeak2

Antenna2AntennaSupport:WLAN(2TX,2RX),BT(1TX/RX)

I/OInterface(Share)

MultiCardSlot4-in-1(SD,SDHC,SDXC,MMC)

vendorJingshi

Max.supportcapacity64GB(comrmofthecompetibilitytest)

I/OPorts

USBPort1xUSB2.0port(Chargeable,supportiphone),2xUSB3.0ports

VGAPort1xVGAdongleport

[VGAdongleisoptionsale.]

AudioJacks1x3.5mmCombo(HeadPhone-out,MIC-in)

LAN1xLANdongleport

TV1xCombo(4pole,HeadPhone-out,MIC-in)

[MicroHDMItoVGAdongleisnotsupported.]

DockNone

SecurityNone

Power1xDC-injack(3Pie)forACadapter

Inhaltsverzeichnis

Andere Samsung Laptop Handbücher

Samsung

Samsung TORINO II Nt-Q45 series Bedienungsanleitung

Samsung

Samsung SM-W767VZAAVZW Bedienungsanleitung

Samsung

Samsung Q71 Bedienungsanleitung

Samsung

Samsung SENS R60 Plus Bedienungsanleitung

Samsung

Samsung X460 Bedienungsanleitung

Samsung

Samsung NP540U3C Kurzanleitung

Samsung

Samsung NP-RV508I Bedienungsanleitung

Samsung

Samsung NP-X11C Bedienungsanleitung

Samsung

Samsung NP700Z3AH Kurzanleitung

Samsung

Samsung SENS Q30 Bedienungsanleitung

Samsung

Samsung NP-R518 (FreeDos) Bedienungsanleitung

Samsung

Samsung Laptop Bedienungsanleitung

Samsung

Samsung NP900X3C Bedienungsanleitung

Samsung

Samsung NP-P560-AA03US Bedienungsanleitung

Samsung

Samsung NM30 Bedienungsanleitung

Samsung

Samsung R701 Bedienungsanleitung

Samsung

Samsung R65 Bedienungsanleitung

Samsung

Samsung NP754XFG-KB2US Bedienungsanleitung

Samsung

Samsung X65 Bedienungsanleitung

Samsung

Samsung Scala RV410 Bedienungsanleitung

Samsung

Samsung NP300E5ZH Bedienungsanleitung

Samsung

Samsung N640 Bedienungsanleitung

Samsung

Samsung NP500R5M-X0AHK Bedienungsanleitung

Samsung

Samsung NP-Q1 User Manual (Vista) Betriebsanleitung

Beliebte Laptop Handbücher anderer Marken

HP ze2401xt - Pavilion Notebook PC Bedienungsanleitung

Velocity

Velocity NoteMagix M10 Bedienungsanleitung

Dell

Dell Alienware 17 R2 Bedienungsanleitung

Toshiba

Toshiba A105-S2236 Bedienungsanleitung

HP ENVY 17 Handbuch

Winbook

Winbook LM Bedienungsanleitung

Dell

Dell Inspiron 1464 Bedienungsanleitung

Dell

Dell Inspiron 15R 5537 Bedienungsanleitung

HP PROBOOK 4520S Handbuch

Dell

Dell Latitude ATG D620 Bedienungsanleitung

Sony

Sony VAIO PCG-FX270 Bedienungsanleitung

Dell

Dell Latitude 7310 Bedienungsanleitung

Dell

Dell Precision GU806 Bedienungsanleitung

Sony

Sony VAIO PCG-R505JLK Bedienungsanleitung

Lenovo

Lenovo THINKPAD X32 Bedienungsanleitung

HP Compaq tc4200 Kurzanleitung

Toshiba

Toshiba mini NB300 Bedienungsanleitung

Lenovo

Lenovo ThinkPad X201 Tablet Handbuch