Samsung NP900X4D Bedienungsanleitung

Amor2-14CRVM

NP900X4D

SERVICEMANUAL

NP900X4DContents

1.Precaution

2.Introduction

3.DesassemblyandReassembly

4.Troubleshooting

5.SystemWireDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1

1.2.SafetyPrecautions...................................................................................................................1−2

1.3.Ground..................................................................................................................................1−3

1.4.StaticElectricityPrecautions......................................................................................................1−4

2.Introduction.....................................................................................................................................2−1

2.1.ProductFeatures......................................................................................................................2−1

2.2.Specication...........................................................................................................................2−2

2.3.Comparingproductspecications...............................................................................................2−7

2.4.FunctionofProduct..................................................................................................................2−8

2.5.NewTechnology/ability..........................................................................................................2−14

2.6.Hardware...............................................................................................................................2−21

2.7.Software................................................................................................................................2−27

2.8.BiosSetup..............................................................................................................................2−29

2.9.HW&OptionMaterials............................................................................................................2−34

3.DesassemblyandReassembly..............................................................................................................3−1

3.1.MainSystem...........................................................................................................................3−1

3.2.TOPA ’ssy..............................................................................................................................3−4

3.3.LCDA’ssy..............................................................................................................................3−6

4.Troubleshooting...............................................................................................................................4−1

4.1.Generalspec...........................................................................................................................4−1

4.2.DebuggingFlowChart..............................................................................................................4−2

4.3.Diagnosisapplication...............................................................................................................4−5

4.4.SystemDiagnosis....................................................................................................................4−7

4.5.HardwareTroubleshooting........................................................................................................4−8

4.5.1.LCD.........................................................................................................................4−8

4.5.2.ProblemsrelatedwithPower.........................................................................................4−9

4.5.3.Others.......................................................................................................................4−11

4.6.CPUFANControl....................................................................................................................4−14

4.7.Other.....................................................................................................................................4−16

4.8.H/WUpgrade..........................................................................................................................4−17

5.SystemWireDiagram........................................................................................................................5−1

5.1.SystemLayout........................................................................................................................5−1

5.2.SystemComponent..................................................................................................................5−3

1.Precaution

1.1.GeneralAfter-SalesServicePrecautions

1)Donotletcustomersrepairtheproductthemselves..

›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.

2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales

serviceofelectricparts).

›Thereisadangerofelectricshock.

3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.

›Thereisadangerofreduetooverheating.

4)Checkifthepowerplugorwalloutletaredamagedinanyway.

›Ifadefectisfound,repairorreplaceitimmediately.

(Thereisadangerofelectricshockorre)

5)Makesurethatitisproperlygrounded.

(Checkthegroundofthewalloutlet)

›Electricityleakagemaycauseelectricshock.

DEVICE

UNDER

TES T

(RE ADING S HOULD)

NOT BE ABOVE 0 .5mA

LEAKAGE

CUR RE NT

TES TE R

TES T ALL

EXP OS E D METAL

S URFACE S

2-WIRE C OR D

*ALSO TES T WITH

P LUG RE VER S ED

(US ING AC ADAPTE R

P LUG AS RE QUIRE D) EARTH

GR OUND

Figure1.1LeakageCurrentTestCircuit

6)Donotspraywaterontotheproducttocleanit.

›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..

7)Checktheassemblystatusoftheproductaftertheafter-salesservice..

›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.

8)Unplugthepowercordholdingthepowerplug(andnotthecord).

›Ifthecordisdisconnected,itmaycauseelectricshockorre.

9)Repairtheproductusingonlyauthorizedparts

10)Keeptheproductawayfromheatingdevicessuchasheaters.

›Exposuretoheatersmaycausedeformationoftheproductorre.

1.Precaution

1.2.SafetyPrecautions

1)EMI

ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.

2)CircuitT est(LogicTest)Precautions

TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since

thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.

Thereforereadandfollowtheinstructionsbelow.

a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In

addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.

b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.

c)Youmustuseasolderingironwithoutaleakagecurrent.

d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.

e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong

direction,itmightbecomedamaged.

f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto

keepthevoltagelevelofeachoftheterminalsthesame.

g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.

j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.

k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.

l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.

1.Precaution

1.3.Ground

Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea

multitapwithagroundterminalonly.

Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif

theyarenotgroundedeveniftheyhaveagroundterminal.

Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto

thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa

metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.

NevergroundtheproducttoaPVCwaterpipe,phoneline,TV ,radioantenna,aluminumwindoworgaspipe,becausethis

doesnotactuallygroundtheproductandmaybedangerous.

1.Precaution

1.4.StaticElectricityPrecautions

Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant

forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair

andlowerstheexpensesfordamagedparts.

Topreventstaticelectricity,followtheinstructionsbelow.

1)Performtherepairinalocationwithoutstaticelectricity.

2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic

Electricityfromyourbodybeforehandlingtheparts.

3)Touchonlytheedgesoftheboard,ifpossible.

4)Donottouchanypartsunlessabsolutelynecessary

5)Disassemblethepartsontheanti-static-electricitypad.

6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.

2.Introduction

2.1.ProductFeatures

2.Introduction

2.2.Specication

ProcessorandMotherboard

CPUIntelIvyBridge_BGAType-Non

UpgradableMaxspec

Intel®Core™i7Processor3517U

(1.9GHz,4MB)

Intel®Core™i5Processor3317U

(1.70Hz,3MBL3Cache)

CacheL3:3~6MB

ChipsetIntelHM75

BIOS64MbitSPIash

ThermalDesignPerformanceAll17W

Memory

Memory/Max.MemoryPC3-1066S(1333MHz),PC3-12800S(1600MHz),2-slotSODIMMMin.4GB~Max.

8GB

Memorytype1333MHz/1600MHzDDR32-SlotSODIMM

MemoryModules2GBSODIMM,4GBSODIMM(1-Slot)

Sockets2-slotSODIMM's

※K4B8G3346B-MCH9(1333MHz)conrmedthecompetibilitytest

DisplayandGraphics

LCD15.0"SuperBright400nitHD+LEDDisplay(1600x900),Anti-Reective

TypeLEDLCDwithAntiGlare(=NonGlare)

PanelTNMode

LCDViewableArea332.4(H)x186.975(V)

LCDResolutionHD+(1600x900)

Win7Support:(1600X900,1366X768,1280X720,

1024X768,800X600)

XPSupport:(1600X900,1366X768,1280X720,

1024X768,800X600)

DotPitch0.20775(H)x0.20775(V)Mm

Viewingangle45/45/15/30(L/R/U/D)

Openingangle135

ReectionRateHaze25

ContrastRatioTyp.500

Brightnesstyp.400(cd/m2)

ResponsetimeAM:Rising+Fallingtyp.16ms

GraphicsControllerIntelHDGraphics4000

VideoMemorySharedmemory(Int)GraphicssetintheBIOSsetting:64MBWindowsboot:1696MB

GPUTDPMax.17W(CPUIntegrated)

2.Introduction

Max.ResolutionforLVDSduallinkresolutionof2560x2048perlink/amaximumtheoreticalpixel

rateof224MP/sMAX2560x2048(640x480,800x600,1024x768,1152x864,

1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,

1680x1050,1920x1200,2560x2048)[Ext.monitorresolutionssupportedbyEDID

information]

Max.resolutionforVGAMaxresolutionof2560x1600at85Hzrefreshrate(ext.)Supported

resolutionMAX2560x1600(640x480,800x600,1024x768,1152x864,

1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,

1680x1050,1920x1200,1920x1440,2560x1600)[Ext.monitorresolutionssupported

byEDIDinformation]

Max.resolutionforHDMISupportv1.4acompliant/aresolutionof1920x1200pixelswith32-bitcolorat60Hz

[Ext.monitorresolutionssupportedbyEDIDinformation]

ControlsKeyboardBrightnessControl

AudioandVideo

SoundRealtekHighDenitionAudio

ControllerHDAudioCodec,ALC269Q-VC-GR

ConversionBuilt-inhighperformance24-bitADC&24-bitDAC

InternalInterfacesEmbeddedstereospeakers,InternalArrayMIC

SpeakerPowerRating2Speakersx2.0Wattwithenclosureeach

ExternalInterfacesMicrophone,Headphone,ComboJackSupport(4PoleCombo:MIC/GND/SPK/SPK

=Apple'sapproach),SPDIFNOTSUPPORT

ControlsKeyboardvolumecontrol,SideV olumebutton

SoundeffectSoundAlive

Microphone3poleMic/HPcombo

TypeArrayMic:DIGITALSMDtypedualarraymic(Mainboard/Camera)

Sensitivity-26dBFS[0dB=1V/Pa,at1KHz]

S/NRatio56(min)Db

Camera

ModelnameSC-13HDL11624N(IMX119P+SPCA2088)

Imagesensor1.3MegaCMOScolorimagesensor

StillImageCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240,176*144,

160*120

VideoCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240,176*144,

160*120

FrameRateMax30fps@1.3M

OutputVideoFormatYUY2,MJPEG

InterfaceUSB2.0

UVCSupportCompliantwithUSBVideoClass

Storage

TypemSATA(miniPCIetype)

SolideStaeDiskSATA23.0Gbps/SATA36.0Gbps

SupportsuptoA TA/A TAPI-7standard

2.Introduction

CapacityMAX.256GB,128GB

Size30*51*3.8mm,W*L*H

NANDMLC

OpticalDriverModules(Share)

OpticalDiskDriver(Option)Ext.ODD:AA-ES3P95M

SpecTS-U633J/SCEFZ,8X,170MS,USB,1.5MB,7.5W,5V ,Blueblack

TypeHalf-FinishedType5902,

Speed5xDVD-RAM,8xDVD±R,6xDVD±RDL,8xDVD+RW,6xDVD-RW,24x

CD-R/RW,8xDVD,24xCD

Weight130gorless

NetworkT ools(Share)

LAN10/100/1000GigabitEthernetLAN

RTL8111E,RJ45output

CombomoduleIntelCentrino@Advanced-N6235

JacksonPeak2(BA59-03294A)

Spec6235AN.HMWG,-,2x2,HalfMiniCardSTD,IEEE802.11a/g/n,26.8*30.0

Type2X2WLAN/BTcombomodule,802.11abg/Bluetooth4.0(WIDIsupport)

Max.LinkSpeed300Mbps(LinkSpeedisonlystandardvalue,Actuallyvaluewilldecidedbyeach

environmant)

ChipsetJacksonPeak2

Antenna2AntennaSupport:WLAN(2TX,2RX),BT(1TX/RX)

I/OInterface(Share)

MultiCardSlot4-in-1(SD,SDHC,SDXC,MMC)

vendorJingshi

Max.supportcapacity64GB(comrmofthecompetibilitytest)

I/OPorts

USBPort1xUSB2.0port(Chargeable,supportiphone),2xUSB3.0ports

VGAPort1xVGAdongleport

[VGAdongleisoptionsale.]

AudioJacks1x3.5mmCombo(HeadPhone-out,MIC-in)

LAN1xLANdongleport

TV1xCombo(4pole,HeadPhone-out,MIC-in)

[MicroHDMItoVGAdongleisnotsupported.]

DockNone

SecurityNone

Power1xDC-injack(3Pie)forACadapter

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