Samsung NT-Q70 Series Bedienungsanleitung

If there are the Contents not included in this book, please refer to K-zone Service Manual

Q70

BEIJING

NT-Q70xxxx/xxx

SERVICEManual

FEATURES

SAMSUNG Q70

1. Simple & Essential Note PC

-. New Intel SantaRosa technology.

-. Internal 1.3M Camera

-. 12.1'' WXGA 200nit Glare LCD

-. Windows Vista Home/Premium Supportable.

2. High Performance

-. Intel Core™2 Duo processor

-. Powerful connectivity.

-. Convenient Multi-media.

-CONTENTS -

1. Precautions

1) General After-Sales Service Precautions..............................................................................................1-1

2) Safety Precautions..................................................................................................................................1-2

3) Ground.....................................................................................................................................................1-3

4) Static Electricity Precautions..................................................................................................................1-3

2. Introduction and Specification

1) Introduction.............................................................................................................................................2-1

2) Specification...........................................................................................................................................2-2

3) Key Feature...........................................................................................................................................2-7

4) Compare with competitor......................................................................................................................2-8

5) Option Partlist........................................................................................................................................2-9

6) Product Feature....................................................................................................................................2-11

7) Software List.........................................................................................................................................2-21

8) System Setup (BIOS Setup)...............................................................................................................2-22

9) Description of Main board...................................................................................................................2-30

3. Disassembly and Reassembling

1) Disassembly and Reassembly of Q70.................................................................................................3-1

4. Troubleshooting

1) General...................................................................................................................................................4-1

2) Debugging Flow Chart..........................................................................................................................4-2

3) System Diagnosis..................................................................................................................................4-4

4) Use of diagnostic program...................................................................................................................4-8

5) Hardware Troubleshooting....................................................................................................................4-13

6) Device Settings Related Software Diagnosis......................................................................................4-22

7) Battery Use Time..................................................................................................................................4-28

8) Etc..........................................................................................................................................................4-33

9) Adding a Memory module....................................................................................................................4-34

5. Exploded View & Partlist

1) Exploded view of Q70..........................................................................................................................5-1

2) ODD.................................................................................................................................... .................5-12

6. Material list

1) Material list..........................................................................................................................................6-1

If there are the Contents not included in this book, please refer to K-zone Service Manual

-CONTENTS -

7. System Wire Diagram

1) Top......................................................................................................................................................7-1

1) Bottom.................................................................................................................................................7-2

1) LCD.....................................................................................................................................................7-3

8. Schematic

1) Block diagram.......................................................................................................................................8-1

2) Schematic..............................................................................................................................................8-2

If there are the Contents not included in this book, please refer to K-zone Service Manual

2 - 1

1) Introduction

(1) High Performance PC

- Intel®Core™ 2 Duo Processor and DDR II Memory

- nVIDIA Geforce 8400 G PCI-Express Graphic

- Intel Santa Rosa Platform

- Wireless LAN (option), Bluetooth (option)

(2)Convenientfeature

- Integrated DMB for mobility TV receiving

(3) Portable and wide screen 13.3” Note PC

- Thin and light smart design

-Highperformance

- Enhanced multi media system

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

2 - 2

2) Specification

Processor and Motherboard Description

CPU Intel® Core 2 Duo T7100 (1.8GHz) ~ T7700 (2.4G) and All CPU at

Q4'07.35W (64bit)

Speed

T7100 : 1.8GHz

T7300 : 2.0GHz

T7500 : 2.2GHz

T7700 : 2.4GHz

Cache 4MB/2MB L2 Cache in Merom

Chipset Intel PM965+ ICH8M

BIOS 8 Mbit, Flash upgradable, SPI type

Thermal Design Performance MAX. 35W

Memory

Memory/Max.Memory 512MB ~ 4GB

Memory type PC2-4200(533MHz) / PC2-5300(667MHz) DDR2 SODIMM

Memory Modules 512MB, 1GB, 2GB SODIMM

Sockets 2-slot SODIMM's

Display and Graphics

LCD 13.3" WXGA (250nits, Glare only)

LCD Vendor

Samsung AMLCD WXGA (LTN133AT08-001)

AUO WXGA (B133EW01 V3)

12.1" WXGA

LCD Viewable Area 286.08 x 178.8mm (H x V)

LCD Resolution 1280 x 800 x 262,144 color ( 18 bit )

Dot Pitch 0.2235 x 0.2235mm (H x V)

Viewing angle Hor. +45/-45, Ver. +25/-35

Contrast Ratio typ.400 (CR)

Brightness min.210, typ.250 (cd/m2)

Response time Rising typ.12ms / max.16ms, Falling typ.4ms / max.9ms

Graphics Controller NVIDIA GeForce 8400M G (Physical 128MB + TurboCache)

Video Memory Physical 128MB GDDR3

TurboCache

Max.Resolution for LFP LVDS 1680 x 1050 x 18Bits color (WSXGA+)

Max.Resolution for External

Monitor 2048 x 1536 @85HZ (CRT)

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- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

2 - 3

Audio

Sound High Definition Audio

Controller HD Audio Codec, ALC262

Conversion Built-in high performance 20-bit ADC & 24-bit DAC

Internal Interfaces Embedded 2 stereo speakers, Internal microphone

Speaker Power Rating 2 Speakers x 2 Watt with enclosure each

External Interfaces Microphone, Headphone, S/PDIF

Controls Keyboard volume control

Microphone Mono Microphone

Microphone Mono

Sensitivity -44dB

Output Impedance 2.2KΩ

Storage

Hard Disk Drive 9.5mmH 2.5" HDD, Removable

Supports SMART Ultra DMA 33/66/100, DMA Mode 2/4 ; SATA

Average Access Time 13m sec.

Speed 5400 / 7200 RPM , Hybrid HDD, TMR/PMR Type

Capacity

80GB / 100GB / 120GB / 160GB / 2000GB / 250GB : HGST, Hitachi,

Samsung

- 80 ~ 250 GB SATA 5400rpm

- 80 ~ 200 GB SATA 7200rpm

- 80 ~ 160GB SATA 5400rpm, Hybride + 256MB

- 120 ~ 250GB SATA 5400rpm, Hybride + 5126MB

Optical Disk Drive DVD / Combo / Super Multi DL & w/LightScribe (12.7mm/PATA)

Blueray / HD-DVD

Type Fixed type (Factory Option)

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Optical Driver Modules

Combo Drive 1 Factory Option

Module type Fixed 12.7mm Slim

Speed 8x DVD-ROM, 24x RW, 24x CD-R : TSST, TS-L332A

Average Access Time DVD 130ms Typ, CD 130ms Typ

Weight 176g or less

S/W Supplied Cyberlink DVD Solution

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

2 - 4

Security RPC-II Regional Encoding

Combo Drive 2 Factory Option

Module type Fixed 12.7mm Slim

Speed 8x DVD-ROM, 24x RW, 24x CD-R, 24x CD : TSST, TS-L462D

Average Access Time DVD 130ms Typ, CD 130ms Typ,.

Weight 176g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

SuperMultiDualLayer1 Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R 2.4x DVD+R DL, 4x DVD±RW, 24x CD-R,

16x CD-RW, 8x DVD, 24x CD : Panasonic UJ-850

Average Access Time DVD 130ms Typ., CD 130ms Typ.

Weight 190g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

SuperMultiDualLayer2 Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW,

24x CD-R/RW, 8x DVD, 24x CD : TSSTTS-L632D

Average Access Time DVD 130ms Typ., CD 130ms Typ.

Weight 180g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Super MultiDual Layer 3 Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW,

24x CD-R/RW, 8x DVD, 24x CD : TeacDV-W28EC

Average Access Time DVD 130ms Typ., CD 130ms Typ.

Weight 180g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Super MultiDual Layer

Lightscribe Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW,

24x CD-R/RW, 8x DVD, 24x CD : TSST TS-L632M

Average Access Time DVD 130ms Typ., CD 130ms Typ.

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

2 - 5

Weight 180g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Network Tools

Fax/Modem 56Kbps / V.92 Azalia Modem, DELPHI (D40) (Factory Option)

Chipset CSP1040 AGR A3 & A3 5V1

Features RJ11 Output

LAN 10/100 Ethernet

Chipset Marvell 88E8039

Features RJ45 Output

802.11g Wireless LAN Intel PRO/Wireless 3945BG:Intel 802.11b/g

Type Mini card (Factory Option)

Chipset Golan

Antenna Integrated 2 Antenna

802.11a/g Wireless LAN Intel PRO/Wireless 3945ABG:Intel 802.11a/b/g

Type Mini card (Factory Option)

Chipset Golan

Antenna Integrated 2 Antenna

802.11a/g/n Wireless LAN Intel PRO/Wireless 4965ABGN:Intel 802.11a/b/g/n

Type Mini card (Factory Option)

Chipset Kedron

Antenna Integrated 3 Antenna

Bluetooth BCM92045NMD : Factory Option

Type USB daughter card with integrated PIFA antenna

Chipset Broadcom BCM2045

Standard version 2.0

I/O Interface

PC CardBus Slots 1 PCMCIA Type II slot

Controller RICOH R5C843

Support 32bit CardBus cards

I/O Ports

USB Port 2(USB2.0)

Video (CRT) Port 1

Audio Jacks Headphone + S/PDIF, MIC-in

Modem / LAN RJ11, RJ45

Power 1(5pie)

TV Antenna Jack External DMB Antenna socket (Factory Option)

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

2 - 6

Security Kensington Lock

Input Devices

Key board 88KEY(KR/US), 89KEY(UK/FR/GM/SP)

Travel length 2.6mm/ Key Pitch 19.05mm

Touchpad Synaptics Touchpad (Plat type with Scroll area)

Easy Button Vista : Hot start, XP : AVS

Multi Memory Card Slot

Controller R5C843

Type Memory stick / Memory stick pro / SD / xD / MMC

Power and Power

Management

Battery SSB-Q30LS6 (6cells, Smart Li-Ion Battery)

Dimension 204 x 52.2 x 21mm

Weight 320g (max)

Recharge Time 2 hours to 100% with Windows on & off

Battery Life over 4hours ( Battery mark 4.01)

Details of Cell 6cells (2Parallel 3Serial)

Voltage 11.1Vdc

Battery Capacity 2400mAh/cell

Battery Rating 11.1V / 4800mAh (53.28Wh)

AC Adapter AD-6019S

Output Power 60Watts

Dimension 160 X 70 X 29mm

Weight (AC Adapter) 300g ± 50g

Worldwide Compatibility Auto-sensing 100 - 240VAC

Line Frequency 50 / 60Hz

Adapter Rating - Input 100V - 240V, 1.8A

Adapter Rating - Output 19.0VDC / 3.16A

Power Management Features ACPI 3.0 support, Standby(S3), Hibernate(S4)

System Dimensions

Dimensions (W X D X H) 312 x 220.7 x 32.2~39.2mm

Weight (Full system w/ 6cell

Battery) 2.03kg

Status : No options, 6cell battery, 13.3" LCD

Materials LCD back / Front : PC/ABS

Bottom / Top : PC/ABS

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

2 - 7

3) Key Feature

Q45 Q70

CPU FSB800MHz Intel Core 2 Duo Processor

(Merom)

FSB800MHz Intel Core 2 Duo Processor

(Merom)

Chipset 965GM/PM (Crestline) 965PM(Crestline)

Memory DDR2 533 / 667MHz DDR2 533 / 667MHz

Graphic Intel GMA X3000 Solution

nVIDIA Geforce 8400M G nVIDIA Geforce 8400M G

LCD 12.1" WXGA Glare 13.3” WXGA Glare

HDD SATA SATA

ODD 12.7mm 12.7mm

Port 2USB, VGA, Headphone, MIC, S/PDIF

1394(4pin), RJ45, RJ11, PC-Card, 5-in-1,

AC-IN, DMB Antenna, Kensington Lock

2USB, VGA, Headphone, MIC, S/PDIF

1394(4pin), RJ45, RJ11, PC-Card, 5-in-1,

AC-IN, DMB Antenna, Kensington Lock

Camera 1.3M Pixels N/A

Battery 6cell 6cell

Design 2nd Proto type 2nd Proto type

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

2. Introduction and Specification

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