Shuttle HOT-641/P Bedienungsanleitung
HOT-641/P
Pentium™IIprocessor
Based AGPMAINBOARD
User's Manual
FCC Notice:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy. If not installed and used properly, in strict accor-
dance with the manufacturer’s instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures :
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/television technician for help and for additional suggestions.
The user may find the following booklet prepared by the Federal Communications Commission helpful “How to Identify
and Resolve Radio-TV Interference Problems.” This booklet is available from the U.S. Government Printing Office.
Washington, DC 20402, Stock 004-000-00345-4
FCCWarning
The user is cautioned that changes or modifications not expressly approved by the manufacturer could void the user’s
authority to operate this equipment.
Note : In order for an installation of this product to maintain compliance with the limits for a Class B device, shielded
cablesandpowercordmustbeused.
CE Notice:
Following standards were applied to this product, in order to achieve compliance with the electromagnetic
compatibility :
- Immunity in accordance with EN 50082-1: 1992
- Emissions in accordance with EN 55022: 1987 Class B.
NOTICE
Copyright 1997.
All Right Reserved
Manual Ver 1.0
All information, documentation, and specifications contained in this manual are subject to change without prior
notification by the manufacturer.
The author assumes no responsibility for any errors or omissions which may appear in this document nor does
it make a commitment to update the information contained herein.
TRADEMARKS
Intel is a registered trademark of Intel Corporation
PentiumII Processor is a registered trademark of Intel Corporation
PC/AT is a registered trademark of International Business Machine Corporation.
PS/2 is a registered trademark of IBM Corporation.
All other brand and product names referred to in this manual are trademarks or registered trademarks of their
respective holders.
2
TABLEOFCONTENTS
T
T
PREFACE ...................................................................................................................3
CHAPTER 1 INTRODUCTION ...........................................................................................4
Specification ....................................................................................................................................... 4
Accessories of HOT-641/P................................................................................................................. 6
CHAPTER 2HARDWARE CONFIGURATION........................................................................7
ThePentiumII &Celeron Processor ................................................................................................. 8
Whatdoesthe RM(RetentionMechanism) consistof ..................................................................... 8
InstalltheRetention MechanismandHeat SinkSupport ................................................................. 9
InstallPentium IIProcessor ............................................................................................................. 11
Celeron Processor S.E.P.P only RM Assembly Procedure .............................................................12
WhatdoesCeleron Processor RMconsist of .................................................................................. 13
InstallCeleronProcessor.................................................................................................................. 14
CPU External Clock (System Clock) setting................................................................................... 14
Jumpers.............................................................................................................................................. 15
CPUMultiplierand System FrequencySetting- JP11 ~JP14& J201..........................................15
ClearCMOS- JP6 ............................................................................................................................ 17
FlashEEPROMVpp - JP9 ............................................................................................................... 17
Connectors & Sockets ...................................................................................................................... 18
CHAPTER 3MEMORY CONFIGURATION .........................................................................21
CHAPTER 4 FLASH UTILITY ........................................................................................22
CHAPTER 5 AWARD BIOS SETUP ..............................................................................24
The Main Menu................................................................................................................................. 25
StandardCMOSSetup...................................................................................................................... 27
BIOS Features Setup......................................................................................................................... 29
ChipsetFeaturesSetup ..................................................................................................................... 32
PowerManagementSetup ................................................................................................................ 35
PCIConfigurationSetup .................................................................................................................. 38
IntegratedPeripherals ....................................................................................................................... 40
PasswordSetting............................................................................................................................... 43
3
PREFACE
P
P
HOT-641/Pisa highly integratedIBMPC/AT compatible systemboarddesigned to
meettheindustry's mostdemanding desktopapplications.
Basedonthe Intel82440BX AGPsetchipsetwhich supportup to500MHzPentiumTMII
processorwithMMXtechnology.
Onboardfour 168-pinDIMMsocket supportupto 1GBSDRAM.
HOT-641/Pisequipped withanAccelerated GraphicsPort(A.G.P.), a high-performance
interconnectfor graphic-intensiveapplication,such as3D applications.The A.G.P.is
independentofthe PCI busand is designedtoexclusively usewithgraphical-display
devices. The HOT-641/P supports 3.3 V A.G.P. devices with data transfer rates up to
133MHz,allowing datathroughputof 500MB/sec.
TheIntel's82440BX AGPsetchipsetprovides an integratedBus Mastering IDEcontrol-
lerwithtwo highperformance IDEinterfaces whichallowsup tofour IDEdevices
connectionandup to 33MB/sec of datatransferrates.
Theon-boardGigaI/Ocontroller providesstandard PCI/Ofunctions:
floppydriveinterface, two FIFOserialports, anInDAdevice port andaSPP/EPP/ECP
capable parallel port.
HOT-641/Pisbuilt withfourPCI localbus slots providinga high bandwidthdata path
fordata-movementintensive functions suchasgraphics, and withthreeISA slots.
HOT-641/Pprovidesthe foundationfor costeffective,high performanceand highly
expandableplatforms, whichdeliversthelatestintheIntelPentiumTM IIprocessorand
newadvanced chipsettechnology.
4
SPECFICATION
1
1
TheHOT-641/PMainboard iscarefullydesigned forthe demanding PCuser who wantshigh perfor-
manceandmany intelligentfeaturesin a compactpackage:
IntelChipset:
FeaturesIntel's440BX AGPset withI/O subsystems.
CPUSupport:
IntelPentiumII processor233/66 ~333/66MHz and350/100 ~500/100MHz.
Celeronprocessor 266~333 MHz.
VersatileMemorySupports:
Equipped with four DIMM sockets support168-pin 3.3VSDRAMmemory modules,total
memorysizeup to 1GB.
ConfigurablesupportforECC(Error Checkingand Correcting)
PCIandISAExpansionSlots:
Providesfour32-bit PCI slotsand three 16-bitISAslots.
AGPSlot:
SupportsAccelerated GraphicsPortcardsforhigh performance,componentlevelinterconnect
targeted at 3D graphical display applications.
OnboardGiGA-I/O:
Providesone Floppyport; oneoptional PS/2mouseconnector; twohigh-speedUARTcompatible
serial ports and one parallel port with ECP and EPP capabilities. Serial Port 2 can also be directed
fromCOM2to the InfraredModulefor wireless connections.
OnboardPCIBusMasterIDEController:
Two UltraDMA/33 BusMaster IDE Portssupports four IDEdevices up to33 MB/sec IDEtrans-
fersandsupports EnhancedPIOModes 3 and4 and BusMaster IDE DMAMode 2 devices.
Onboard20-pinATXPower Supply:
ProvidesATXpower connectoronboardsupports soft-on/offfunction.
SystemBIOS:
Provideslicensed AwardV4.51PG BIOSon FlashEEPROM.
SupportsGreenPC,DMIand Bundledwith NCRSCSIBIOS.
ACPI:
Support ACPI(Advanced Configurationand PowerInterface) function. ACPI provide more
EnergySavingFeaturesforthe futureoperating systemsupporting OSDirectPower Management
(OSPM)functionality.
5
BoardSize:
ATX form factor 305mm x 220mm.
AdvancedFeatures:
LowEMI--Spread Spectrum builtin- ±1.5% modulationand automatic clockshut-offof unused
PCI/SDRAMSslots toreducethe EMI.
"AdvancedConfigurationandPowerInterface" ReadyforPC'97.
DualFunctionPower Button --Thesystem can beone of twostates, one is Suspendmodeand
the other is the Soft-off mode. Pushing the power button for less than 4 seconds will place the
systemintoSuspend mode. Whenpushthe powerbutton for morethan 4seconds,the system
enterstheSoft-off mode.
Wake-ON-LAN --The systemwill power-onautomatically byactivatingofLAN.
(Thisfunctionsupport Intel LANcard only).
ModemRingPower-on -- Thesystemwill power-onautomaticallyby activatingof modemring.
MoreAdvancedFeatures(HOT-641/PP):
VoltagesMonitoring--System voltageslevelsaremonitoredto ensurestable currenttomain
boardcomponents.
Systemvoltagesinclude VCORE and VL2 for CPU, and +5V, +12V, -5V, -12V for system.
FANStatusMonitoring-- TopreventCPU overheat,CPU fans ismonitored forRPMand failure.
(CPUCoolingFANwithRPM sensoris required)
6
ACCESSORIES OF HOT-641/P
Figure 1-1
7
HARDWARECONFIGURATION
2
2
The Pentium™ II & Celeron™ Processor
ThePentiumII and Celeron processoristhe next memberof the P6processorfamily. It
combinesthe architecturaladvancesinthePentiumProprocessorwiththeinstructionset
extensionsofMMX technology. It isfully compatible withthehuge baseofIntel architec-
ture-basedPCsoftware. Additional, thePentiumII processordeliversnew levelsofperfor-
manceforadvancemediaand communicationssoftware includingpowerful,realistic
graphicsandimaging capabilities, videoconference, and theabilityto runfull-screen,full-
motionvideo. Thecombination ofthese advancedtechnologiesmakes thePentium II
processortheideal choicefoeexecuting modem32-bitcompute-intensive andmultimedia-
enhancedapplication workloadsusingadvanced32-bit operatingsystems.
ThePentiumII andCeleronprocessor bothhavea separate,32KB,on-chip, non-blocking L1
cachewhichrun at theprocessorfrequency, Pentium IIprocessor also hasa512KB or
256KB on-board L2 non-blocking cache runs at half the processor speed.
ThePentiumII processorusingSingle Edge Contact(S.E.C.) cartridge packagingtechnol-
ogywhichenables highvolume availability,improvedhandling protection.
TheCeleronprocessorusingSingle EdgeProcessor Package.(S.E.P.P.)
Figure2-1shows the front,rear and topviewsof PentiumIIprocessor (without heatsink
mounted).
Figure2-2shows theprimary and non-primaryside ofCeleronprocessor withoutheatsink
mounted and with heat sink mounted.
Figure 2-2
Figure 2-1
8
What does the RM (Retention Mechanism) consist of
PentiumIIprocessor requiresthe RetentionMechanism (RM)andoptional HeatSink
Support(HSS)to holdthebase processorinthe S.E.C.cartridge.
Followinginstallationprocedurewilldisplay howto installthesemechanism.
RetentionMechanismpackage consists of2 separate partsandoptional HeatSinkSupport
consistsof3 separateparts.
Normally,dependon the typeofheat sink,HeatSink Support isnot always available. For
someheatsink attached onpentium II processormightnot fittoinstall Heat SinkSupport
which introduced on this manual. So, the procedure of Heat Sink Support installation just
yourreferenceonly.
RetentionMechanism(RM) -
PlasticGuidewithcaptivenuts thathold the
S.E.C. Cartridge in the Slot1 connector.
(RefertoFigure2-1-1)
RMAttachPin (RMAP) -
Plasticpinsinsertedthroughthe RMto secure
ittothemainboard(four requiredper Assembly).
(RefertoFigure2-1-2)
Heat Sink Support Base (HSSBASE) -
Plasticsupport barmountedtothemainboard
undertheATX heat sink.
(RefertoFigure2-1-3)
HSSPin(HSSPIN) -
Plasticpinsinserted through theHSSBASEto secure
ittothe mainboard(tworequired perAssembly).
(RefertoFigure2-1-4)
HSSTopBar (HSSTOP) -
Plasticbar thatclipsontotheHSSBASE
throughthefins on theATXheat sink.
(RefertoFigure2-1-5)
Figure 2-1-3
Figure 2-1-4
Figure 2-1-5
Figure 2-1-1
Figure 2-1-2
9
Install the Retention Mechanism and Heat Sink Support
Placethemainboard onaworkbench (not ina chassis). Besure that themainboard is bare
(thatis,no SIMMs,cables,or cards areinstalled).
InstalltheRetentionMechanism:
1.Findsout the RetentionMechanism (RM)
MountingHolesand "Pin 1"markof Slot 1
onHOT-641/P mainboard.
(RefertoFigure 2-8)
2.Insertthe RetentionMechanism(RM)
around theSlot 1. Besure the SquareCut
Mark ofRMhave thesame orientationof
Slot1pin 1.(Refer toFigure 2-9)
3.Insertfour RMAttachPin through theRM
tosecureittothe mainboard(four required
per Assembly). (Refer to Figure 2-9)
Figure 2-8
Figure 2-9
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